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MCIMX6L3EVN10AC - NXP Semiconductors

Name: NXP Semiconductors MCIMX6L3EVN10AC
Brand: NXP Semiconductors
SKU: MCIMX6L3EVN10AC
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: MCIMX6L3EVN10AC

Manufacturer: NXP Semiconductors

Allelco Part Number: 41D-MCIMX6L3EVN10AC

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 7,450 pcs available, New & Original

Parts Description: 432-TFBGA

Data sheet: -

Category: Integrated Circuits (ICs) > Specialized ICs

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In stock: 7450

Specifications

MCIMX6L3EVN10AC Tech Specifications
NXP Semiconductors - MCIMX6L3EVN10AC technical specifications, attributes, parameters and parts with similar specifications to NXP Semiconductors - MCIMX6L3EVN10AC

Product Attribute	Attribute Value
Part Number	MCIMX6L3EVN10AC
Package	432-TFBGA
Description	432-TFBGA
Stock Condition	Get 7450 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	NXP Semiconductors
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Parts Introduction

Manufacturer Part Number

MCIMX6L3EVN10AC

Manufacturer

NXP Semiconductors

Introduction

The MCIMX6L3EVN10AC is a high-performance, low-power Arm Cortex-A9 based application processor from NXP Semiconductors. It is designed for a wide range of embedded applications, including industrial automation, smart home devices, and multimedia systems.

Product Features and Performance

Arm Cortex-A9 core running at 1.0 GHz

Single-core processor with 32-bit bus width

Multimedia co-processors including NEON SIMD

Supports LPDDR2, LVDDR3, and DDR3 RAM controllers

Integrated graphics acceleration

Keypad and LCD display controllers

10/100 Mbps Ethernet interface

3x USB 2.0 interfaces with PHY

Product Advantages

High-performance processing capabilities for advanced embedded applications

Low-power design for energy-efficient operation

Comprehensive set of peripheral interfaces for flexible system integration

Proven Arm Cortex-A9 architecture for reliable and efficient performance

Key Reasons to Choose This Product

Scalable and versatile platform for a wide range of embedded applications

Optimized for low-power operation, making it well-suited for battery-powered devices

Extensive peripheral support and interface options for easy system integration

Backed by the reliability and industry-leading expertise of NXP Semiconductors

Quality and Safety Features

Operates across a wide temperature range of -40°C to 105°C (TA)

Surface mount package for robust and reliable operation

Designed and manufactured to meet industry-standard quality and safety requirements

Compatibility

The MCIMX6L3EVN10AC is compatible with various operating systems and development platforms supporting the Arm Cortex-A9 architecture.

Application Areas

Industrial automation and control systems

Smart home and IoT devices

Multimedia and entertainment systems

Medical and healthcare equipment

Robotics and autonomous systems

Product Lifecycle

The MCIMX6L3EVN10AC is an active and currently available product from NXP Semiconductors. There are several equivalent or alternative models available in the i.MX6 series, such as the MCIMX6Q5DVN13AC and MCIMX6D5DVN13AC, which offer similar performance and features. If you have any questions or need further assistance, please contact our sales team through our website.

Frequently Asked Questions(FAQ)

What is the maximum operating temperature range for the MCIMX6L3EVN10AC, and how does thermal performance impact system reliability in industrial applications?: The MCIMX6L3EVN10AC operates over a temperature range of -40°C to 105°C (TA), making it suitable for extended industrial environments. This wide range ensures stable performance in automotive or outdoor equipment exposed to thermal cycling. However, sustained operation near the upper limit may require careful PCB layout and heatsinking, especially when driving peripherals like LCDs or Ethernet at full load, due to power dissipation in the 1.2V core voltage domain.

How does the MCIMX6L3EVN10AC support multimedia processing, and what co-processors are available for offloading graphics and signal processing tasks?: The MCIMX6L3EVN10AC integrates NEON™ SIMD extensions alongside dedicated multimedia hardware accelerators, enabling efficient audio, video, and image processing. These accelerators reduce CPU load during tasks like H.264 decoding or audio filtering, which is critical in embedded systems such as infotainment units or digital signage players where real-time responsiveness is required without exceeding power budgets.

Can the MCIMX6L3EVN10AC interface with DDR3 memory, and what design considerations apply when selecting SDRAM for optimal performance?: Yes, the MCIMX6L3EVN10AC supports DDR3 memory controllers, providing high-bandwidth data access essential for applications requiring fast frame buffer updates or large data logging. When pairing with DDR3 modules, designers must match impedance-controlled traces, terminate properly at the memory side, and consider refresh cycles under low-power modes—especially important given the device’s multi-voltage I/O domains and power gating capabilities.

What are the key differences between the MCIMX6L3EVN10AC and other i.MX6SL variants regarding clock speed and peripheral availability?: While all i.MX6SL family members share the ARM Cortex-A9 core and multimedia accelerators, the MCIMX6L3EVN10AC runs at 1.0GHz—a common base frequency among SL variants—but lacks some high-speed interfaces found in higher-tier i.MX6 models like Quad/Dual cores or SATA support. Compared to these, it trades raw computational throughput for lower cost and smaller footprint, making it ideal for single-core embedded control rather than compute-intensive workloads.

Is the MCIMX6L3EVN10AC suitable for automotive-grade designs, and what certifications or qualification levels should be verified beyond standard commercial specs?: Though the part meets ROHS3 compliance and has an MSL rating of 3, its standard industrial temperature grade (-40°C to +85°C typical) falls short of AEC-Q100 Grade 2 (up to 105°C). Designers aiming for automotive use should confirm whether this specific device has undergone automotive qualification testing; otherwise, additional reliability screening or derating practices may be necessary to ensure long-term field robustness.

How many USB ports does the MCIMX6L3EVN10AC provide, and what role does integrated PHY play in board-level implementation?: The MCIMX6L3EVN10AC includes three USB 2.0 controllers with embedded physical layer transceivers (PHY), eliminating the need for external USB transceivers. This reduces component count and simplifies ESD protection design, though signal integrity on the USB_DP/DM lines remains critical above 480 Mbps, particularly near the 3.0V I/O rail that powers these interfaces.

What display interface options are supported by the MCIMX6L3EVN10AC, and how do they affect resolution and refresh rate capabilities?: It features a keypad and LCD controller optimized for embedded displays up to WVGA resolution, typically supporting resistive or capacitive touch panels via GPIO or dedicated interfaces. While not designed for high-resolution HDMI output, internal pixel pipeline can drive TFT matrices directly—ideal for kiosks, POS terminals, or portable test equipment where simplicity outweighs need for advanced video formats.

Does the MCIMX6L3EVN10AC include an Ethernet MAC, and what network stack considerations arise from its 10/100Mbps limitation?: Yes, it embeds a 10/100 Ethernet Media Access Controller but no Gigabit capability. For applications demanding faster throughput, external PHYs won’t upgrade the MAC itself. In factory automation edge nodes or remote monitoring devices, this bandwidth cap may necessitate protocol optimization (e.g., UDP instead of TCP) or prioritization via Quality of Service settings to maintain responsiveness under moderate loads.

What mounting type and package form factor does the MCIMX6L3EVN10AC use, and what layout challenges does the BGA configuration present?: The device uses a 432-MAPBGA package (13x13 mm), mounted via surface mount technology. This fine-pitch array requires precise solder mask registration, controlled-impedance routing for memory buses, and likely a debug header or test points for bring-up. Thermal vias beneath the die aid heat dissipation but must avoid interfering with adjacent signal layers to maintain signal integrity across mixed-voltage domains.

How does the MCIMX6L3EVN10AC manage power across its multiple I/O voltage rails, and what implications exist for dynamic voltage scaling in battery-powered systems?: With independent 1.2V, 1.8V, and 3.0V I/O supplies, the MCIMX6L3EVN10AC allows selective domain power gating. Core logic operates at 1.2V, enabling lower leakage compared to higher-voltage cores. Designers can leverage DVFS techniques to trade performance for efficiency during idle periods, extending runtime in portable medical devices or IoT gateways without sacrificing compatibility with legacy 3.3V peripherals via level shifters if needed.

Are there any restrictions on using SD/MMC interfaces with the MCIMX6L3EVN10AC in boot configurations, and how does initialization sequence affect system startup?: The MCIMX6L3EVN10AC supports MMC/SD/SDIO interfaces capable of booting from eMMC or removable cards. However, proper pull-up/pull-down resistor placement on CMD and DAT lines is essential to meet initialization timing requirements specified in SD Physical Layer standards. Failure here may prevent successful boot even with correctly programmed ROM code.

What serial communication protocols does the MCIMX6L3EVN10AC support, and how do UART vs SPI trade-offs influence peripheral selection in sensor-rich designs?: It offers multiple UART, SPI, I2C, and SSI interfaces. UARTs suit asynchronous point-to-point links (debug consoles), while SPI enables faster daisy-chained sensors or flash memory. I2C reduces pin count for low-speed devices like temperature monitors. Choice depends on data rate needs, cable length, and protocol overhead—SPI generally offers better noise immunity over longer traces in noisy industrial settings.

What is the significance of the Moisture Sensitivity Level (MSL) rating for the MCIMX6L3EVN10AC, and how should assembly processes accommodate this?: Rated MSL 3 (168 hours), the MCIMX6L3EVN10AC must be assembled within one week of opening its moisture barrier to prevent popcorning during reflow. Fabrication facilities must follow JEDEC J-STD-033 guidelines, including baking before rework if exposure exceeds threshold, ensuring reliability in mass production environments with strict process controls.

Does the MCIMX6L3EVN10AC include hardware security features, and what measures protect firmware integrity in unattended deployments?: While lacking dedicated cryptographic engines like AES or TRNG, it supports secure boot through ROM-based verification using RSA or SHA hashes stored in OTP fuses or external secure elements. Designers must implement software-based encryption for sensitive data and validate boot images early to mitigate risks in unattended kiosks or remote telemetry units handling proprietary information.

How does the absence of SATA affect storage expansion options when using the MCIMX6L3EVN10AC in data acquisition systems?: Without native SATA support, direct connection to HDDs or SSDs isn’t feasible. Instead, designers typically use SD card slots, SPI-connected flash, or external USB mass storage—all supported by the chip’s existing interfaces. This limits sequential write speeds compared to SATA but suffices for moderate logging rates in embedded recorders where cost and size dominate over throughput.

What is the expected lifecycle status of the MCIMX6L3EVN10AC, and how might supply continuity impact long-term product roadmaps?: As part of NXP’s mature i.MX6SL line, the MCIMX6L3EVN10AC is likely in volume production with assured availability for industrial and automotive applications. However, migration paths toward newer i.MX 6ULL or 6UL+ series should be evaluated for projects exceeding 7–10 years, especially if future-proofing against obsolescence becomes critical during end-of-life planning phases.

How does the MCIMX6L3EVN10AC compare to ARM Cortex-M based MCUs in terms of application suitability for real-time control tasks?: Unlike Cortex-M devices optimized for deterministic interrupt latency and ultra-low power, the MCIMX6L3EVN10AC runs Linux or RTOS atop a general-purpose A9 core, offering richer OS support and multimedia capabilities. For motor control or sensor fusion requiring microsecond response times, Cortex-M alternatives would outperform it; however, for UI-driven appliances combining networking and display, the trade-off favors complexity over raw determinism.

What are the recommended decoupling strategies for stabilizing the MCIMX6L3EVN10AC’s mixed-voltage I/O domains during high-frequency switching events?: Each voltage rail—especially the sensitive 1.2V core supply—requires tightly coupled 0201 or 0402 MLCC capacitors placed within 1mm of package pins, supplemented by bulk tantalum or polymer caps for transient absorption. High-speed signals crossing voltage domains need careful impedance matching and isolation to prevent ground bounce, particularly during simultaneous switching of USB, Ethernet, and memory interfaces at peak loads.

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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