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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMC9S08AC48CFDE
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MC9S08AC48CFDE - Freescale Semiconductor

Manufacturer Part Number
MC9S08AC48CFDE
Manufacturer
Freescale Semiconductor, Inc. (NXP Semiconductors)
Allelco Part Number
98D-MC9S08AC48CFDE
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,226 pcs available, New & Original
Parts Description
IC MCU 8BIT 48KB FLASH 48QFN
Package
48-QFN-EP (7x7)
Data sheet
-
RoHs Status
 
Our certification
In stock: 11226

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Specifications

MC9S08AC48CFDE Tech Specifications
Freescale Semiconductor - MC9S08AC48CFDE technical specifications, attributes, parameters and parts with similar specifications to Freescale Semiconductor - MC9S08AC48CFDE

Product Attribute Attribute Value
Manufacturer Freescale Semiconductor, Inc. (NXP Semiconductors)
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Supplier Device Package 48-QFN-EP (7x7)
Speed 40MHz
Series S08
RAM Size 2K x 8
Program Memory Type FLASH
Program Memory Size 48KB (48K x 8)
Peripherals LVD, POR, PWM, WDT
Package / Case 48-VFQFN Exposed Pad
Package Bulk
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 38
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 8x10b
Core Size 8-Bit
Core Processor S08
Connectivity I²C, SCI, SPI
Base Product Number MC9S08

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the MC9S08AC48CFDE compare to other HCS08 family members in terms of program memory and I/O availability for embedded system designs requiring moderate complexity?
The MC9S08AC48CFDE offers 48KB of FLASH program memory, which is among the higher capacity options within the HCS08 series, making it suitable for applications that require substantial firmware without transitioning to larger core architectures. With 38 general-purpose I/O pins, it supports a balanced mix of digital control, communication interfaces, and sensor integration. This combination allows designers to implement moderately complex control algorithms—such as motor control with encoder feedback or data acquisition systems with multiple analog inputs—without needing additional microcontroller units. Compared to lower-memory variants like the MC9S08QD4 or MC9S08QE8, this device avoids the need for external flash while still providing sufficient GPIO for most single-chip solutions below 50 I/Os.
What are the key trade-offs when selecting the MC9S08AC48CFDE for a battery-powered industrial sensor node operating at 3.3V?
The MC9S08AC48CFDE operates efficiently at 2.7V to 5.5V, making it compatible with 3.3V logic and typical battery voltages. At 3.3V, its 40MHz internal clock consumes approximately 1.5 mA active current, which can be reduced to under 10 µA in wait mode—a critical factor for battery life in remote sensing applications. However, the absence of integrated voltage regulators means the system must provide clean 3.3V from the battery, increasing BOM complexity unless using a dedicated LDO. Additionally, while it includes 8-channel 10-bit ADCs, they have limited sampling rates (~100 ksps), which may constrain high-speed signal acquisition compared to higher-performance MCUs. Designers must also consider that RoHS non-compliance could limit sourcing in certain regions, affecting supply chain resilience.
Can the MC9S08AC48CFDE reliably drive inductive loads such as relays or solenoids directly, or is an external driver required?
The MC9S08AC48CFDE’s GPIO pins can source/sink up to 25 mA per pin (with a total package current limit around 150–200 mA), but driving inductive loads like relays requires careful attention to inrush current and back-EMF. A typical 5V relay coil may draw 30–50 mA during activation, exceeding safe continuous drive levels if sustained. While short pulses (e.g., <10 ms) might be acceptable, repeated switching without flyback diodes risks damaging the MCU. Therefore, external transistor or MOSFET drivers are strongly recommended for reliable operation. The PWM peripheral can help reduce power dissipation via duty-cycled driving, but only if the load is compatible with pulsed operation.
In what scenarios would the internal oscillator of the MC9S08AC48CFDE be preferable over an external crystal, and how accurate is it for time-critical applications?
The MC9S08AC48CFDE includes a factory-trimmed internal RC oscillator rated at ±2% accuracy over temperature and voltage. This makes it ideal for low-cost, non-time-sensitive applications such as simple sensor logging or basic motor control where precise timing isn’t critical. For UART baud rates above 115200 bps or SPI communication near full speed, the ±2% variation can cause significant bit errors due to cumulative clock drift across bytes. In such cases, an external 4 MHz crystal provides ±10 ppm stability, ensuring consistent timing even over long data frames. Thus, the internal oscillator suffices for prototyping or infrequent communication, but production systems involving high-speed serial protocols should use an external oscillator.
How does the RAM size of the MC9S08AC48CFDE impact real-time data processing tasks, and what strategies can mitigate memory limitations?
With only 2KB of RAM, the MC9S08AC48CFDE imposes strict limits on dynamic data structures and runtime buffers. Real-time filtering algorithms requiring large coefficient tables or intermediate results must be optimized into lookup tables stored in FLASH or precomputed offline. Similarly, string manipulation or complex data parsing should avoid temporary buffer allocations exceeding hundreds of bytes. Efficient coding practices—such as reusing variables, minimizing stack usage, and avoiding recursion—are essential. For applications collecting multiple analog samples rapidly (e.g., waveform capture), data should be processed incrementally rather than buffered entirely in RAM. If more memory is needed, external SRAM chips can interface via the SPI or I2C peripherals, though this adds latency and software overhead.
What considerations apply when integrating the MC9S08AC48CFDE into a design using mixed-voltage environments, especially when interfacing with 5V legacy components?
Although the MC9S08AC48CFDE accepts up to 5.5V on VDD, its I/O pins are not 5V-tolerant when operating below 5V. Connecting 5V signals directly to GPIOs below 3.6V may violate absolute maximum ratings and damage the chip. Level shifting is required for bidirectional communication with 5V systems. Simple resistor dividers can work for unidirectional 5V-to-3.3V downconversion, but active solutions like dedicated translators (e.g., TXB0108) are better for bidirectional lines. Alternatively, configuring unused pins as open-drain with pull-ups can enable safe voltage bridging. Always verify signal rise/fall times and ensure compatibility with the target device’s input thresholds to maintain reliable logic levels.
How does the MC9S08AC48CFDE handle brownout conditions, and what role does its POR/LVD circuitry play in system robustness?
The MC9S08AC48CFDE features Power-On Reset (POR) and Low-Voltage Detection (LVD) circuitry set to trip at approximately 2.5V when powered from 3.3V supplies. During undervoltage events (e.g., battery depletion), the LVD triggers before the MCU becomes unstable, causing a controlled reset that prevents erratic behavior. Combined with watchdog timer (WDT) support, this helps recover from transient faults. However, the LVD threshold is fixed and not user-adjustable, so it may not align perfectly with specific application voltage tolerances. For harsh environments with rapid voltage drops, adding a bulk capacitor near the VDD pin can smooth transients and reduce false resets. Still, persistent brownouts will eventually deplete energy, so robust power management remains essential.
Is the MC9S08AC48CFDE suitable for automotive applications requiring ISO 26262 compliance, and what limitations exist?
No, the MC9S08AC48CFDE is not designed or qualified for functional safety standards such as ISO 26262. It lacks diagnostic features like lockstep CPU cores, memory ECC, or built-in self-test routines required for ASIL-rated systems. Its operating temperature range (-40°C to +85°C) covers many industrial uses but falls short of the -40°C to +125°C automotive grade. Additionally, RoHS non-compliance complicates traceability in regulated markets. While it might serve as a cost-effective solution in non-safety-related consumer electronics, any deployment in vehicles demands alternative MCUs from safety-qualified families such as the SPC5xx or MPC5xxx series.
What debugging and development tools are recommended for the MC9S08AC48CFDE, and what challenges might arise during bring-up?
Development typically begins with Freescale/NXP’s CodeWarrior IDE or modern alternatives like MCUXpresso, which support HCS08 device packs. Hardware debuggers such as the USB Multilink Universal or older BDM cables interface via the 6-pin BDM header. However, the 48-QFN package lacks exposed test points, requiring careful PCB layout to access BDM signals without soldering probes. Flash programming over BDM is standard, but erase operations can fail if brownout protection is enabled without proper supply stabilization. Beginners often overlook decoupling capacitors near VDD/VSS, leading to unreliable flash writes or resets. Using a scope to monitor reset line activity during boot helps diagnose initialization failures early.
How does the choice between internal vs. external oscillators affect startup time in the MC9S08AC48CFDE-based systems?
The internal oscillator starts nearly instantly after power-up (typically within microseconds), whereas an external crystal may take tens of milliseconds to stabilize. This difference matters in applications requiring rapid wake-from-sleep cycles, such as event-driven sensors. However, the internal oscillator’s ±2% drift can delay UART synchronization by several bits at 9600 bps over temperature swings—unlikely to be problematic for human-scale timing but noticeable in automated test equipment. Designers aiming for minimal latency should favor the internal oscillator; those prioritizing precision timing over long durations should use an external source despite slower start-up.

Parts with Similar Specifications

The three parts on the right have similar specifications to Freescale Semiconductor MC9S08AC48CFDE

Product Attribute MC9S08AC48MFDE MC9S08AC48CFGE MC9S08AC48CFGER MC9S08AC48MFGE
Part Number MC9S08AC48MFDE MC9S08AC48CFGE MC9S08AC48CFGER MC9S08AC48MFGE
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Program Memory Type - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Program Memory Size - - - -
Data Converters - - - -
Core Processor - - - -
EEPROM Size - - - -
Number of I/O - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Oscillator Type - - - -
Peripherals - - - -
Core Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Speed - - - -
Connectivity - - - -
RAM Size - - - -

Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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MC9S08AC48CFDE Image

MC9S08AC48CFDE

Freescale Semiconductor
98D-MC9S08AC48CFDE

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