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HomeProductsIntegrated Circuits (ICs)Interface - Drivers, Receivers, TransceiversHIN202IA
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HIN202IA - Harris Corporation

Manufacturer Part Number
HIN202IA
Manufacturer
Harris Corporation
Allelco Part Number
98D-HIN202IA
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
39,981 pcs available, New & Original
Parts Description
RS-232 TRANSMITTER/RECEIVER
Package
16-SSOP
Data sheet
-
RoHs Status
 
Our certification
In stock: 39981
  • Unit Price: $1.945
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $1.945 $1.95
200+ $0.753 $150.60
500+ $0.726 $363.00
1000+ $0.714 $714.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

HIN202IA Tech Specifications
Harris Corporation - HIN202IA technical specifications, attributes, parameters and parts with similar specifications to Harris Corporation - HIN202IA

Product Attribute Attribute Value
Manufacturer Harris Corporation
Voltage - Supply 4.5V ~ 5.5V
Type Transceiver
Supplier Device Package 16-SSOP
Series -
Receiver Hysteresis 500 mV
Protocol RS232
Product Attribute Attribute Value
Package / Case 16-SSOP (0.209", 5.30mm Width)
Package Bulk
Operating Temperature -40°C ~ 85°C (TA)
Number of Drivers/Receivers 2/2
Mounting Type Surface Mount
Duplex Full
Data Rate 120kbps

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the HIN202IA’s receiver hysteresis of 500 mV impact noise immunity in noisy industrial environments, and what design considerations should be taken into account when interfacing RS232 signals over long cables?
The 500 mV receiver hysteresis on the HIN202IA provides a defined threshold window that helps reject small voltage fluctuations caused by electromagnetic interference or ground potential differences. This is particularly valuable in industrial settings where RS232 lines may run alongside motors, relays, or power cables. When signal integrity degrades due to capacitive coupling or impedance mismatches over extended cable runs, the hysteresis margin reduces the likelihood of false triggering at the receiver input. Designers should ensure that the worst-case noise amplitude in their system remains below this threshold to maintain reliable communication at the specified data rate of 120 kbps.
What are the thermal performance implications of using the HIN202IA in continuous full-duplex operation at elevated ambient temperatures near its maximum rated junction temperature?
Operating the HIN202IA continuously in full-duplex mode generates power dissipation primarily through internal switching losses in the charge pumps and driver stages. At supply voltages near 5.5 V and with moderate load capacitance on the RS232 output pins, quiescent current can reach approximately 1 mA per channel. With two drivers and two receivers active, total supply current may exceed 4–5 mA under typical conditions. In an SSOP-16 package with limited exposed pad connectivity, sustained operation at 85°C ambient requires careful PCB layout with adequate copper pour for heat spreading. Thermal derating may necessitate reducing data rates or implementing airflow to avoid exceeding the absolute maximum junction temperature, especially during prolonged use in enclosed systems.
How do the charge pump requirements of the HIN202IA compare to modern CMOS-level logic devices like the MAX232, and what trade-offs exist between component count and power efficiency when selecting between these solutions?
Unlike the HIN202IA, which uses an internal charge pump to generate ±10 V from a single 5 V supply, older devices such as the MAX232 require external capacitors for charge pumping but often operate at lower quiescent currents. The HIN202IA achieves higher integration by embedding the charge pump within the IC, eliminating the need for discrete timing capacitors—reducing board space and simplifying layout. However, this comes at the cost of higher internal power consumption due to the continuous operation of the dual charge pumps. For battery-powered or low-noise applications, the MAX232’s lower current draw and better noise performance may be preferable despite requiring external components. In contrast, the HIN202IA offers superior integration and faster response time, making it more suitable for compact designs prioritizing ease of implementation over ultra-low power.
Can the HIN202IA be safely used with 3.3 V microcontrollers without level shifting, and what precautions must be taken regarding input voltage thresholds and driver output compliance?
While the HIN202IA operates over a supply range of 4.5 V to 5.5 V, its RS232 receiver inputs are designed to accept standard RS232-compliant voltage swings (±3 V to ±15 V). These inputs are compatible with 3.3 V TTL logic levels, so direct connection from a 3.3 V microcontroller UART to the HIN202IA’s receiver inputs is permissible. However, the opposite direction—driving the HIN202IA’s transmitter outputs into a 3.3 V system—is not feasible because the transmitter outputs swing up to ±10 V relative to the chip’s ground. Therefore, if bidirectional communication is required, an additional level-shifting stage or dedicated transceiver with 3.3 V logic compatibility (e.g., MAX3232) would be necessary. Careful attention must also be paid to shared ground references to prevent ground loops when bridging different voltage domains.
What are the implications of the HIN202IA’s RoHS non-compliance for regulatory certification and international distribution, especially in markets enforcing strict hazardous substance bans?
The RoHS non-compliance status of the HIN202IA means it contains restricted materials such as lead in concentrations exceeding the directive limits, typically in solder finishes or internal die attach layers. As a result, this device cannot be legally sold into RoHS-compliant regions without significant redesign or sourcing of compliant alternatives. Engineering teams relying on this part for new product development face potential delays in obtaining CE marking or other regional certifications in Europe, Canada, Japan, and other jurisdictions with similar regulations. Suppliers may offer RoHS-compliant versions under different part numbers, so verification against the latest manufacturer documentation is essential before committing to procurement or design freeze.
How does the moisture sensitivity level (MSL) rating of MSL 3 for the HIN202IA affect storage, handling, and reflow soldering procedures in high-volume manufacturing environments?
An MSL 3 classification indicates that the HIN202IA begins absorbing moisture after 168 hours (7 days) of exposure at 85°C/85% RH. Once this threshold is exceeded, the device enters Level 1 over-time exposure, requiring baking before reflow to prevent catastrophic delamination and popcorning during thermal cycling. High-volume manufacturers must therefore track lot receipt dates and implement FIFO (first-in-first-out) inventory practices. If the device sits beyond 7 days post-delivery without baking, it should undergo 125°C for 48 hours prior to reflow soldering. Failure to adhere to this protocol risks internal moisture vaporization, leading to board warpage or component failure during assembly, particularly in lead-free reflow profiles exceeding 240°C peak temperature.
What are the key differences between the HIN202IA and newer RS232 transceivers such as the SP3222E in terms of ESD protection, data rate capability, and power consumption, and how might these factors influence selection for embedded control systems?
Compared to the SP3222E, which integrates enhanced ±15 kV HBM ESD protection and operates at up to 1 Mbps with lower quiescent current (~3 mA), the HIN202IA offers only basic electrostatic discharge protection and caps data rates at 120 kbps with higher power draw (~5 mA typical). The SP3222E also features automatic shutdown modes and better noise immunity through Schmitt-trigger inputs. For modern embedded designs requiring higher speeds, longer cable lengths, or compliance with IEC standards, the SP3222E provides superior robustness and efficiency. However, if legacy RS232 interfaces must interface with older equipment or require minimal footprint in a proven design, the HIN202IA remains viable—especially where cost and familiarity outweigh performance gains offered by newer alternatives.
Is it possible to operate the HIN202IA with a single 3.3 V supply by using an external voltage booster, and what challenges arise from bypassing its internal charge pump circuitry?
Yes, the HIN202IA can technically function with a 3.3 V supply if paired with an external charge pump circuit capable of generating ±10 V rails. However, bypassing the internal charge pump requires careful matching of rise/fall times, output ripple, and transient response to meet RS232 voltage thresholds. External boost converters introduce complexity, increased PCB area, and potential instability due to feedback loop interactions. Moreover, the HIN202IA was not designed for this configuration; datasheet specifications assume 5 V operation. Deviations from recommended operating conditions could degrade signal integrity, reduce reliability, and void warranty or qualification claims. Therefore, while possible in theory, such modifications are not advised without thorough validation across all environmental and load conditions.
Given its full-duplex architecture with two independent drivers and receivers, how should termination and signal routing be managed when using the HIN202IA to connect two distant RS232 peripherals simultaneously?
Since the HIN202IA supports full-duplex communication via separate transmit and receive paths, each line (TXD/RXD) should follow RS232 best practices: twisted-pair cabling, proper shielding, and controlled impedance if exceeding 1 meter. Termination resistors are generally unnecessary for RS232 due to high slew rates and differential signaling, but stub lengths should be minimized to reduce reflections. Layout symmetry between driver and receiver pairs helps balance propagation delays, especially at data rates approaching 120 kbps. Additionally, ensure that both ends of the communication link share a common ground reference to avoid voltage offset issues that could drive receivers into undefined states despite valid logic levels.
What role does the 16-SSOP package size play in system integration decisions, and how does it compare to SOIC or DIP formats in terms of manufacturability and signal integrity?
The 16-SSOP (5.3 mm width) package of the HIN202IA occupies significantly less board real estate than equivalent SOIC or DIP packages, enabling compact printed circuit board layouts ideal for portable or space-constrained applications. Its surface-mount form factor facilitates automated pick-and-place assembly and improves thermal performance through closer integration with PCB copper planes. Compared to through-hole DIP variants, SSOP eliminates lead inductance and enhances high-frequency response, though care must be taken with trace routing near the device to minimize crosstalk. However, the smaller pitch (typically 0.65 mm) demands precise soldering equipment and skilled handling to avoid bridging or tombstoning during reflow—factors that favor mature SMT production lines over manual assembly environments.

Parts with Similar Specifications

The three parts on the right have similar specifications to Harris Corporation HIN202IA

Product Attribute HIN202EIBNZ-T7A HIN202EIBNZ HIN202EIBNZ-TR5661 HIN202EIBNZ-TR5661
Part Number HIN202EIBNZ-T7A HIN202EIBNZ HIN202EIBNZ-TR5661 HIN202EIBNZ-TR5661
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Intersil Renesas Electronics America Inc
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Duplex - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Type - - - -
Data Rate - - - -
Number of Drivers/Receivers - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Supply - - - -
Receiver Hysteresis - - - -
Protocol - - - -

Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
HIN202IA Image

HIN202IA

Harris Corporation
98D-HIN202IA

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