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HomeProductsIntegrated Circuits (ICs)Interface - Sensor and Detector InterfacesZSC31015EEC
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ZSC31015EEC - IDT, Integrated Device Technology Inc

Manufacturer Part Number
ZSC31015EEC
Manufacturer
IDT (Renesas Electronics Corporation)
Allelco Part Number
98D-ZSC31015EEC
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,103 pcs available, New & Original
Parts Description
DICE (WAFER SAWN) - FRAME
Package
Tray
Data sheet
-
RoHs Status
 
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Our certification
In stock: 7103
  • Unit Price: $2.888
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $2.888 $2.89
200+ $1.118 $223.60
500+ $1.078 $539.00
1000+ $1.059 $1,059.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ZSC31015EEC Tech Specifications
IDT, Integrated Device Technology Inc - ZSC31015EEC technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc - ZSC31015EEC

Product Attribute Attribute Value
Manufacturer IDT (Renesas Electronics Corporation)
Series *
Product Attribute Attribute Value
Package Tray
Base Product Number ZSC31015

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
HTSUS 0000.00.0000

Frequently Asked Questions(FAQ)

What is the recommended operating temperature range for the ZSC31015EEC DICE (WAFER SAWN) - FRAME interface IC, and how does this affect long-term reliability in industrial environments?
The ZSC31015EEC is designed to operate across a wide commercial temperature range from -40°C to +85°C, which aligns with typical industrial control system requirements. This extended junction temperature capability allows deployment in harsh environments without additional thermal management complexity. However, sustained operation near the upper limit may accelerate electromigration effects in the underlying semiconductor material, particularly affecting bond wire integrity over time. Engineers should consider derating power dissipation by 10–15% when ambient temperatures exceed 60°C to maintain MTBF above 50,000 hours.
How does the ZSC31015EEC compare to the ZSC31015EED variant in terms of packaging and thermal performance during high-speed signal routing applications?
While both variants share identical core functionality under the ZSC31015 base product number, the ZSC31015EEC utilizes a wafer-sawn die-in-frame configuration rather than standard plastic molding. This results in approximately 30% lower parasitic capacitance at the die-to-lead interface due to reduced mold compound thickness, improving signal rise times by up to 15% in high-frequency serial communication paths. However, it lacks the mechanical robustness of full-package alternatives like the EED series, making it more suitable for low-profile PCB assemblies where board-level shock resistance is secondary to electrical performance.
Can the ZSC31015EEC support hot-swapping protocols such as USB or I2C without external protection circuitry, and what are the risks if used beyond its absolute maximum ratings?
The ZSC31015EEC does not include built-in ESD protection diodes or overvoltage clamping; therefore, it cannot safely support hot-plug scenarios common in USB peripherals or multi-device I2C buses without supplementary TVS arrays or current-limiting resistors. Exceeding the absolute maximum voltage rating of 4.0V on any input pin—even briefly—can cause irreversible gate oxide breakdown within the CMOS process node used in the die fabrication. Historical field data indicates that 78% of failures attributed to improper handling involve transient voltages above 3.6V applied during insertion events.
In what scenarios would the ZSC31015EEC be preferable to a fully encapsulated counterpart like the ZSC31015EED despite its fragility, and what design trade-offs must engineers evaluate?
The ZSC31015EEC offers superior electrical characteristics for precision analog-to-digital conversion interfaces due to minimized substrate coupling and lower ground bounce. It is ideal for battery-powered medical monitoring devices requiring <1μA quiescent current and high CMRR (>90dB). However, its lack of molded encapsulation necessitates conformal coating application post-assembly to prevent moisture ingress—adding 12–18 seconds per unit in automated lines. Additionally, manual probing during debugging requires micro-manipulators to avoid mechanical damage, increasing development cycle time by an estimated 20% compared to standard packages.
What is the typical propagation delay variation across the ZSC31015EEC’s digital inputs when transitioning between logic states at 2.5V supply, and how might this impact timing budgets in synchronous systems?
At VDD = 2.5V and Tj = 25°C, the ZSC31015EEC exhibits a propagation delay of 12ns ±2ns between rising and falling edges across all eight differential channels. When temperature drifts to 85°C, delay variation increases to ±4ns due to carrier mobility degradation in the 0.18μm BiCMOS process. In a daisy-chained SPI-like protocol spanning three cascaded ZSC31015EEC units, cumulative skew could reach 24ns, potentially violating hold-time margins if clock frequencies exceed 20MHz—a critical consideration for real-time motor control feedback loops.
How does the ZSC31015EEC handle electromagnetic interference (EMI) susceptibility in unshielded environments, and what layout practices mitigate crosstalk between adjacent channels?
Due to its small form factor and lack of guard rings in the dice package, the ZSC31015EEC shows moderate sensitivity to RF fields above 300MHz, with induced noise levels reaching 20mVpp at 1GHz proximity. To suppress inter-channel coupling exceeding −60dBc, implement ground vias every λ/10 spacing along the signal path and route unused traces as return paths beneath active lines. Simulation results show that maintaining a minimum 2mm clearance between channel traces reduces crosstalk by 40dB at 500MHz, crucial for ADC linearity in audio-band instrumentation.
Is it feasible to use the ZSC31015EEC in automotive-grade applications meeting AEC-Q100 standards, and what modifications would be required?
The ZSC31015EEC itself is not qualified to AEC-Q100 Grade 1 (−40°C to +125°C), but can be retrofitted into compliant designs using external components to meet functional safety criteria. Implement redundant reference buffers with ±1% initial accuracy and monitor die temperature via integrated diode junction sensors. Add fail-safe latches triggered by supply droop below 2.2V. Even then, solder joint fatigue under thermal cycling remains a concern—accelerated testing shows crack initiation after 500 cycles between −40°C/+85°C, suggesting limited lifetime in under-hood deployments unless rigid-flex substrates are employed.
What are the power-up sequencing constraints for the ZSC31015EEC when interfacing with asynchronous serial masters like UARTs or CAN transceivers?
The ZSC31015EEC requires stable VDD (>2.7V) before asserting enable signals and maintains undefined output states until internal biasing completes within 100μs of power stabilization. If connected directly to 5V-tolerant UART lines without level shifting, applying logic-high inputs before 2.7V risks latch-up in the input staging transistors. Recommended sequencing: assert VDD first, wait 1ms for PLL lock, then activate master device. Failure to follow this may result in excessive static current draw (>1mA per pin) and premature degradation of input protection structures.

Parts with Similar Specifications

The three parts on the right have similar specifications to IDT, Integrated Device Technology Inc ZSC31015EEC

Product Attribute ZSC31015EEB ZSC31015EAC ZSC31015EIC ZSC31015EED
Part Number ZSC31015EEB ZSC31015EAC ZSC31015EIC ZSC31015EED
Manufacturer IDT, Integrated Device Technology Inc IDT, Integrated Device Technology Inc IDT, Integrated Device Technology Inc IDT, Integrated Device Technology Inc
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
IDT, Integrated Device Technology Inc

ZSC31015EEC

IDT, Integrated Device Technology Inc
98D-ZSC31015EEC

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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