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HomeProductsIntegrated Circuits (ICs)MemoryIS25LP064D-JBLE-TR
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IS25LP064D-JBLE-TR - ISSI, Integrated Silicon Solution Inc

Manufacturer Part Number
IS25LP064D-JBLE-TR
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Allelco Part Number
32D-IS25LP064D-JBLE-TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
35,863 pcs available, New & Original
Parts Description
64Mb QPI/QSPI, 8-pin SOP 208Mil,
Package
8-SOIC
Data sheet
IS25LP064D-JBLE.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 35863
  • Unit Price: $1.068
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $1.068 $1.07
10+ $0.928 $9.28
30+ $0.841 $25.23
100+ $0.718 $71.80
500+ $0.677 $338.50
1000+ $0.659 $659.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

IS25LP064D-JBLE-TR Tech Specifications
ISSI, Integrated Silicon Solution Inc - IS25LP064D-JBLE-TR technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc - IS25LP064D-JBLE-TR

Product Attribute Attribute Value
Manufacturer Integrated Silicon Solution, Inc. (ISSI)
Write Cycle Time - Word, Page 40µs, 800µs
Voltage - Supply 2.3V ~ 3.6V
Technology FLASH - NOR (SLC)
Supplier Device Package 8-SOIC
Series Automotive, AEC-Q100
Package / Case 8-SOIC (0.209", 5.30mm Width)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 64Mbit
Memory Organization 8M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Memory Format FLASH
Clock Frequency 166 MHz

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Parts Introduction

Manufacturer Part Number

IS25LP064D-JBLE-TR

Manufacturer

Integrated Silicon Solution

Introduction

Flash memory chip for high-performance data storage solutions

Product Features and Performance

Non-Volatile FLASH Memory

64Mbit Memory Size

SPI - Quad I/O, QPI, DTR Interface for Fast Data Transfer

166 MHz Clock Frequency for Rapid Read/Write Operations

Supports Word/Page Write Cycle Times of 40µs and 800µs

Product Advantages

Highly Reliable and Durable

Automotive Grade Quality

AEC-Q100 Qualified for High-Quality Standards

Operates Across a Wide Voltage Range (2.3V to 3.6V)

Suitable for High-Temperature Environments, up to 105°C

Key Technical Parameters

64Mbit Memory Capacity

8M x 8 Memory Organization

SPI with Enhanced Protocols for Flexible Usage

166 MHz High-Speed Clock

3V to 3.6V Voltage Supply

-40°C to 105°C Operating Temperature Range

Quality and Safety Features

AEC-Q100 Automotive Qualification

Stress-Tested for Temperature and Operational Robustness

Compatibility

Compatible with Systems Requiring SPI-Compatible Memory

Adaptable Interface For Various Microcontrollers and Processors

Application Areas

Automotive Electronics

Industrial Automation

Consumer Electronics

Communication Infrastructure

Internet of Things (IoT) Devices

Product Lifecycle

Active Product Status

Not Currently Nearing Discontinuation

Potential for Future Replacements or Upgrades

Several Key Reasons to Choose This Product

Efficient High-Capacity Storage Solution

Fast Data Transfer Capable of Meeting High-Speed Performance Demands

Proven Reliability in Stringent Automotive Applications

Flexible Operational Ranges Suited for Various Electronic Applications

Comprehensive Qualification Ensuring Quality and Robustness

Ease of Integration with Existing Microcontroller Setups

Supports Advanced Memory Interface Options for Diverse Use Cases

Frequently Asked Questions(FAQ)

How does the IS25LP064D-JBLE-TR support high-speed data transfer in automotive-grade SPI NOR flash applications, and what are the implications of its 166 MHz clock frequency for real-world system design?
The IS25LP064D-JBLE-TR achieves a maximum clock frequency of 166 MHz under Dual Transfer Rate (DTR) mode when operating with QPI or QSPI interfaces, enabling efficient burst read performance critical for code execution from flash memory in time-sensitive automotive systems. This speed allows the device to sustain data throughput exceeding 66 MB/s in optimal conditions, which is essential for applications such as infotainment boot-up sequences or over-the-air update transfers. However, achieving this peak frequency requires careful PCB layout, signal integrity management, and adherence to timing constraints in the host microcontroller's SPI controller. Designers must ensure that trace lengths are matched and impedance-controlled, especially when using quad I/O modes, to avoid setup and hold violations. Additionally, the 166 MHz operation is only valid within the specified voltage range of 2.3V to 3.6V and temperature range of -40°C to 105°C, reinforcing its suitability for automotive environments.
What distinguishes the IS25LP064D-JBLE-TR from standard commercial-grade SPI flash devices in terms of reliability and qualification, and how does this impact long-term deployment in vehicle systems?
Unlike many commercial-grade SPI flash alternatives, the IS25LP064D-JBLE-TR is fully qualified under AEC-Q100 Grade 1, ensuring robustness against thermal cycling, mechanical stress, and electromagnetic interference typical in automotive environments. It operates reliably across an extended temperature range of -40°C to 105°C, making it suitable for under-hood or dashboard-mounted ECUs where ambient temperatures can fluctuate drastically. The SLC (Single-Level Cell) NOR architecture provides higher endurance—typically up to 100,000 write cycles per block—compared to multi-level cell variants, enhancing longevity in firmware update scenarios common in modern vehicles. This combination of automotive qualification, wide temperature tolerance, and high endurance reduces failure risk during the 10+ year lifecycle of a vehicle, minimizing warranty claims and field recalls associated with memory corruption or wear-out.
In comparison to parallel NOR flash solutions, how does the IS25LP064D-JBLE-TR improve system integration while maintaining compatibility with legacy SPI-based microcontrollers?
Compared to traditional parallel NOR flash devices requiring multiple address and data lines, the IS25LP064D-JBLE-TR uses a compact SPI interface with quad I/O and QPI capabilities, significantly reducing pin count and board space. An 8-SOIC package occupies less than half the footprint of typical 24-pin SOIC parallel flash parts, enabling miniaturization in space-constrained automotive modules such as ADAS cameras or telematics units. Despite its serial interface, the device supports XIP (Execute-In-Place) via QPI/DTR modes, allowing direct code execution without external DRAM, thus preserving real-time responsiveness. While parallel flash offers slightly faster access times due to wider buses, the IS25LP064D’s 166 MHz DTR performance often matches or exceeds practical needs in embedded control loops, especially when leveraging hardware accelerators on modern MCUs. For legacy SPI controllers, backward-compatible modes ensure seamless migration paths without major firmware overhaul.
How should designers evaluate power consumption trade-offs when integrating the IS25LP064D-JBLE-TR into battery-powered automotive subsystems, and what operational states affect standby current?
The IS25LP064D-JBLE-TR consumes typical standby currents below 1 µA when in deep power-down mode, which is critical for reducing quiescent drain in always-on automotive systems like remote keyless entry receivers or low-power diagnostic nodes. During active operations—such as page programming or sector erasing—current spikes can reach 3 mA at 3.3 V supply, necessitating careful consideration of duty cycle in energy-sensitive designs. Since the device supports fast erase and program cycles (e.g., 800 µs page write), minimizing unnecessary write operations extends battery life. Designers should leverage hardware-based wear leveling or software throttling to distribute writes evenly across blocks, preventing localized degradation and reducing overall activity. When paired with wake-up-on-SPI features, the device enables ultra-low-power sleep states while maintaining readiness for command reception, optimizing energy efficiency without sacrificing responsiveness.
Can the IS25LP064D-JBLE-TR be used interchangeably with larger-capacity SPI flash parts like 128 Mb variants, and what limitations arise from its 64 Mbit capacity in firmware storage applications?
While the IS25LP064D-JBLE-TR shares the same 8-SOIC package and electrical interface as higher-density alternatives such as 128 Mb devices, its 64 Mbit capacity imposes strict limits on firmware size. At 8M x 8 organization, it can store approximately 8 MB of binary code, which may be insufficient for complex infotainment stacks or advanced driver-assistance system (ADAS) algorithms requiring additional image buffers or configuration data. Designers targeting future-proof architectures should reserve sufficient margin for OTA updates, security metadata, and diagnostic logs. If expansion is anticipated, selecting a 128 Mb part from the same family (e.g., IS25LP128D) ensures headroom without redesigning the PCB layout. However, downgrading to smaller densities like 32 Mb would likely result in partition overflow, forcing compression or feature reduction, so capacity planning must precede component selection.
What role does the MSL 3 rating play in the handling and reliability of the IS25LP064D-JBLE-TR during manufacturing and assembly, and how do manufacturers mitigate moisture-related risks?
With an Moisture Sensitivity Level (MSL) of 3, the IS25LP064D-JBLE-TR is rated for exposure up to 168 hours before reflow soldering, aligning with industry-standard JEDEC guidelines for surface-mount components. This classification implies that prolonged storage in humid environments could lead to internal moisture absorption, potentially causing popcorning during thermal excursions in reflow ovens. To prevent this, manufacturers implement bake-out procedures before assembly and maintain inventory turnover policies that limit shelf life. End users should follow IPC/JEDEC J-STD-033 handling protocols, including storage in dry cabinets with humidity monitoring and desiccant use. Proper floor-life tracking and real-time humidity logging during production reduce the risk of delamination or bond-wire fracture, ensuring long-term solder joint integrity in harsh automotive environments where thermal cycling exacerbates stress on plastic packages.
How does the IS25LP064D-JBLE-TR support secure firmware updates in connected automotive systems, and what built-in mechanisms protect against unauthorized code execution?
The IS25LP064D-JBLE-TR incorporates a flexible protection scheme via status register bits that allow partitioning memory sectors into read-only, write-protected, or execute-only regions. This enables secure boot implementations where critical bootloader code resides in locked sectors inaccessible to runtime modification. Combined with hardware cryptographic acceleration on compatible hosts, the device facilitates authenticated firmware updates over CAN FD or Ethernet, ensuring only signed images are flashed. Although the flash itself lacks on-chip encryption engines, its fast write cycles (down to 40 µs per word) allow rapid deployment of encrypted payloads decrypted by external security co-processors. This balance of speed, protection granularity, and compatibility with automotive-grade SoCs makes it viable for ISO/SAE 21434-compliant systems requiring functional safety and cyber-resilience.
In what ways does the IS25LP064D-JBLE-TR compare to eMMC or NAND-based storage in embedded automotive control units, particularly regarding random access latency and reliability under vibration?
Unlike block-oriented NAND flash or eMMC devices optimized for sequential throughput, the IS25LP064D-JBLE-TR offers deterministic random access latency as low as 50 ns in fast read mode, enabling instant branching in real-time control loops such as engine management or brake-by-wire systems. Its SLC NOR architecture exhibits superior endurance and data retention compared to TLC/QLC NAND, which suffer from accelerated wear under repeated writes and require complex ECC schemes. Moreover, the absence of moving parts and reliance on stable semiconductor processes make the IS25LP064D more resilient to mechanical shock and vibration common in chassis-mounted modules. While NAND offers higher density per die area, the IS25LP064D’s simplicity, predictability, and automotive qualification favor it in safety-critical applications where reliability outweighs storage volume considerations.

Parts with Similar Specifications

The three parts on the right have similar specifications to ISSI, Integrated Silicon Solution Inc IS25LP064D-JBLE-TR

Product Attribute IS25LP064D-JKLE-TR IS25LP064D-JLLE-TR IS25LP064D-RMLE-TR IS25LP064A-JMLE-TR
Part Number IS25LP064D-JKLE-TR IS25LP064D-JLLE-TR IS25LP064D-RMLE-TR IS25LP064A-JMLE-TR
Manufacturer ISSI, Integrated Silicon Solution Inc ISSI, Integrated Silicon Solution Inc ISSI, Integrated Silicon Solution Inc ISSI, Integrated Silicon Solution Inc
Series - - - -
Memory Size - - - -
Clock Frequency - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Memory Organization - - - -
Memory Type - - - -
Write Cycle Time - Word, Page - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Memory Format - - - -
Memory Interface - - - -
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Technology - - - -

IS25LP064D-JBLE-TR Datasheet PDF

Download IS25LP064D-JBLE-TR pdf datasheets and ISSI, Integrated Silicon Solution Inc documentation for IS25LP064D-JBLE-TR - ISSI, Integrated Silicon Solution Inc.

Datasheets
IS25LP064D, IS25WP064D.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
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All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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ISSI, Integrated Silicon Solution Inc

IS25LP064D-JBLE-TR

ISSI, Integrated Silicon Solution Inc
32D-IS25LP064D-JBLE-TR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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