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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EP2C5F256I8N
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EP2C5F256I8N - Intel

Manufacturer Part Number
EP2C5F256I8N
Manufacturer
Intel
Allelco Part Number
32D-EP2C5F256I8N
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,067 pcs available, New & Original
Parts Description
IC FPGA 158 I/O 256FBGA
Package
256-FBGA (17x17)
Data sheet
EP2C5F256I8N.pdf
RoHs Status
RoHS Compliant
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Our certification
In stock: 11067
  • Unit Price: $35.25
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $35.25 $35.25
10+ $34.21 $342.10
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

EP2C5F256I8N Tech Specifications
Intel - EP2C5F256I8N technical specifications, attributes, parameters and parts with similar specifications to Intel - EP2C5F256I8N

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 1.15V ~ 1.25V
Total RAM Bits 119808
Supplier Device Package 256-FBGA (17x17)
Series Cyclone® II
Package / Case 256-LBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 4608
Number of LABs/CLBs 288
Number of I/O 158
Mounting Type Surface Mount
Base Product Number EP2C5

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EP2C5F256I8N Image
EP2C5F256I8N (1)

Manufacturer Part Number

EP2C5F256I8N

Manufacturer

Intel

Introduction

Intel's EP2C5F256I8N is part of the Cyclone® II series, a family of embedded FPGAs designed for high-performance, low-power applications requiring flexible logic customization.

Product Features and Performance

Incorporates 288 Logic Array Blocks (LABs)

Features 4,608 Logic Elements/Cells for versatile programming

Provides a total of 119,808 RAM bits for data storage

Supports up to 158 input/output pins

Operates on a low supply voltage of 1.15V to 1.25V

Designed for surface mount technology

Functional across a broad operating temperature range (-40°C to 100°C)

Product Advantages

Low power consumption due to optimized voltage range

High density of logic cells and LABs for complex logic implementation

Ample I/Os and memory for diverse application requirements

Sturdy design suitable for extreme environmental conditions

Key Technical Parameters

Number of LABs/CLBs: 288

Number of Logic Elements/Cells: 4608

Total RAM Bits: 119808

Number of I/O: 158

Voltage Supply: 1.15V ~ 1.25V

Operating Temperature: -40°C ~ 100°C (TJ)

Package / Case: 256-LBGA

Supplier Device Package: 256-FBGA (17x17)

Quality and Safety Features

Robust 256-LBGA packaging for durability and reliability

Designed to meet stringent industrial quality and safety standards

Compatibility

Compatible with a wide range of programming tools and software from Intel and third-party providers

Flexible I/O operation supports various logic level standards

Application Areas

Ideal for automotive, industrial control, telecom infrastructure, and consumer electronics

Suitable for high-speed interfacing, signal processing, and complex logic circuits

Product Lifecycle

Currently in an active product status, ensuring availability

Long-term support expected, with no near-term discontinuation planned

Replacement or upgrade options available within the Intel Cyclone series

Several Key Reasons to Choose This Product

High-performance FPGA from a reputable manufacturer, Intel

Optimized for power efficiency, reducing operational costs

Versatile application potential due to extensive I/O and logic cell counts

Durable and reliable for mission-critical applications

Active lifecycle status with long-term support and availability

Frequently Asked Questions(FAQ)

How does the EP2C5F256I8N’s power consumption compare to other Cyclone II FPGAs when implementing a typical control logic design with moderate I/O activity?
The EP2C5F256I8N operates within a supply voltage range of 1.15V to 1.25V, which contributes to efficient power performance for its density class. Compared to larger Cyclone II variants like the EP2C20 or EP2C35, it delivers similar logic efficiency but at lower complexity, resulting in reduced dynamic and static power under comparable workloads. For designs requiring around 4,600 logic elements with 158 I/O pins, this part balances performance and energy use effectively, making it suitable for cost-sensitive, low-power embedded applications without sacrificing necessary throughput.
In what scenarios would the EP2C5F256I8N be preferable over the EP2C35F256C8N despite having fewer logic resources?
The EP2C5F256I8N offers a more compact form factor and lower pin count (158 vs. 256), which can simplify board routing and reduce BOM cost in space-constrained systems. While the EP2C35F256C8N provides greater logic capacity (10,208 LEs), the EP2C5F256I8N is sufficient for applications such as motor control interfaces, sensor aggregation, or small-scale protocol bridging where resource utilization stays below 5,000 logic elements. Its smaller package also enables higher-density layouts, which may justify selection even when peak performance isn’t required.
What are the thermal implications of using the EP2C5F256I8N in an industrial-grade system operating continuously near its maximum junction temperature?
The EP2C5F256I8N has a specified operating junction temperature range from -40°C to +100°C, allowing reliable operation in harsh environments without active cooling. However, sustained high ambient temperatures increase thermal resistance across the 256-LBGA package. At full utilization—such as driving multiple high-speed I/O banks and utilizing internal RAM blocks—power dissipation can reach several hundred milliwatts. Proper PCB layout, thermal vias, and airflow planning are essential to maintain TJ within spec and avoid long-term reliability degradation.
Can the EP2C5F256I8N support LVDS signaling on all 158 I/O pins simultaneously?
No, the EP2C5F256I8N supports LVDS only on select I/O banks, typically up to 64 pairs depending on configuration and available dedicated transceiver circuitry. Out of the 158 general-purpose I/O pins, only a subset can be configured for LVDS due to shared reference clock resources and bank-level transceiver availability. Designers must consult the device handbook to map transceiver-capable pins per bank and ensure clocking architecture compatibility before committing to parallel high-speed data paths.
How should designers approach timing closure when using the EP2C5F256I8N in a multi-clock domain design?
Timing closure with the EP2C5F256I8N requires careful assignment of clocks and synchronization logic due to its moderate number of dedicated PLLs (typically two). Each PLL supports one primary input clock, so additional clocks must share or be derived from these sources. Cross-domain signals should employ double-flop synchronizers, and asynchronous resets should be avoided unless properly managed. Given the 288 LABs and 4,608 logic elements, aggressive pipelining may be needed in complex state machines to meet setup/hold margins, especially at higher frequencies approaching 200 MHz.
What impact does the Moisture Sensitivity Level (MSL) rating of 3 for the EP2C5F256I8N have on manufacturing handling and storage?
With an MSL3 classification, the EP2C5F256I8N must be assembled within 168 hours of opening the moisture-barrier bag if stored above 30% relative humidity and below 85°C. This aligns with standard semiconductor assembly practices and ensures no popcorning risk during reflow soldering. Manufacturers should follow J-STD-033 guidelines for bake-out procedures if shelf life exceeds 6 months, ensuring reliability in high-volume production environments.
Is the EP2C5F256I8N suitable for safety-critical applications requiring formal verification tools or certification support?
The EP2C5F256I8N itself does not carry any specific functional safety certifications (e.g., IEC 61508 or ISO 26262), and Intel does not provide formal verification models or safety manuals for this consumer-grade FPGA. Therefore, it is generally not recommended for safety-critical systems without extensive architectural mitigation and independent validation. Applications in medical, aerospace, or automotive domains typically require certified components or redundant design strategies beyond standard FPGA capabilities.
How does the internal memory architecture of the EP2C5F256I8N influence block RAM allocation in typical firmware-intensive designs?
The EP2C5F256I8N contains 119,808 bits of embedded SRAM organized into 74 blocks of 1,872 bits each. These can be configured as single-port, dual-port, or pseudo-single-port memories. In firmware-heavy applications—such as storing lookup tables or buffering video streams—designers should align memory usage with block boundaries to maximize efficiency. Misalignment leads to wasted storage and increased routing congestion, especially given the limited LAB-to-RAM ratio compared to higher-end Cyclone II devices.
What considerations apply when interfacing the EP2C5F256I8N with DDR2 memory modules?
Direct DDR2 interface support is not natively provided by the EP2C5F256I8N; instead, users must implement custom PHY layers or leverage external memory controllers. The FPGA lacks integrated DDR2 transceivers, so timing calibration, DQS alignment, and ODT management must be handled in soft logic. Designers often pair this FPGA with discrete controller chips or use external PHYs to achieve reliable data rates, adding complexity but enabling flexible memory bandwidth scaling based on application needs.
Why might the EP2C5F256I8N exhibit different I/O switching behavior compared to newer FPGA families like Stratix or Arria?
The EP2C5F256I8N uses legacy I/O standards and driver architectures optimized for mid-range performance rather than high-speed serial transmission. Its output slew rates, termination options, and input thresholds are less configurable than those found in modern families. Additionally, older process technology results in higher capacitance and longer propagation delays per interconnect, limiting maximum toggle rates to approximately 166 Mbps per pin in most configurations. This makes it better suited for synchronous digital control rather than high-bandwidth communication links.
How does the choice of configuration mode affect boot time and reliability when using the EP2C5F256I8N?
The EP2C5F256I8N supports passive and active serial configuration modes via an external flash or CPLD. Active Serial mode reduces boot time significantly by allowing the host processor to initiate reconfiguration, while Passive Serial relies solely on internal oscillator delays. Reliability depends on flash integrity and signal quality; noisy lines or weak pull-ups can corrupt the bitstream. Designers should include CRC checks and fallback mechanisms to recover from corrupted images, particularly in field-deployed systems.
Can the EP2C5F256I8N drive backplane Ethernet transceivers directly, or is an external PHY required?
No, the EP2C5F256I8N does not support gigabit Ethernet transceivers internally. To implement Ethernet MAC functionality, users must add an external PHY chip compatible with RGMII or MII protocols. The FPGA handles packet processing in soft logic, so latency and jitter depend on implementation efficiency. This separation increases board area but allows reuse across multiple projects and simplifies compliance testing with IEEE 802.3 standards.
What role does the Base Product Number (EP2C5) play in selecting alternative parts or revision compatibility?
The EP2C5 base indicates that the EP2C5F256I8N belongs to a family sharing core architecture, pinout compatibility, and configuration methodology. All EP2C5 variants (e.g., EP2C5F176C8N, EP2C5T144C8N) can typically use the same development tools and configuration devices. However, package differences affect thermal and mechanical integration, while speed grades (like I8 vs. C8) define timing margins. Always verify electrical characteristics and available features (e.g., PLL count, I/O banks) before substituting within the same base number.
How do environmental conditions outside the datasheet range affect long-term operation of the EP2C5F256I8N?
Operating outside the specified -40°C to +100°C junction temperature window risks parametric drift, latch-up, or accelerated electromigration. Below -40°C, solder joint cracking becomes a concern in lead-free assemblies. Above +100°C, leakage currents increase exponentially, potentially causing functional failures even if absolute max ratings aren't exceeded. For extended outdoor or industrial deployments, derating by 10–15°C is advisable to preserve mean time between failures (MTBF).
What are the implications of the REACH and RoHS status for global deployment of products using the EP2C5F256I8N?
The EP2C5F256I8N is RoHS compliant and REACH unaffected, meaning it meets European Union restrictions on hazardous substances and registration requirements. These statuses simplify export compliance in regulated markets and reduce regulatory overhead during product lifecycle management. However, designers must still track supplier-specific declarations and monitor for future changes in chemical reporting thresholds, even though the part currently poses minimal compliance risk.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP2C5F256I8N

Product Attribute EP2C5F256C8N EP2C5F256I8 EP2C5F256C8 EP2C5F256C6N
Part Number EP2C5F256C8N EP2C5F256I8 EP2C5F256C8 EP2C5F256C6N
Manufacturer Intel Intel Intel Intel
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Logic Elements/Cells - - - -
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of LABs/CLBs - - - -
Total RAM Bits - - - -
Number of I/O - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42

EP2C5F256I8N Datasheet PDF

Download EP2C5F256I8N pdf datasheets and Intel documentation for EP2C5F256I8N - Intel.

Datasheets
256-FBGA Pkg Info.pdf Virtual JTAG Megafuntion Guide.pdf
PCN Packaging
Mult Dev Label CHG 24/Jan/2020.pdf Mult Dev Label Chgs 24/Feb/2020.pdf
PCN Design/Specification
Mult Series Software Chgs 26/Mar/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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EP2C5F256I8N Image

EP2C5F256I8N

Intel
32D-EP2C5F256I8N

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