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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EP2S15F672C5N
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EP2S15F672C5N - Intel

Manufacturer Part Number
EP2S15F672C5N
Manufacturer
Intel
Allelco Part Number
32D-EP2S15F672C5N
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,270 pcs available, New & Original
Parts Description
IC FPGA 366 I/O 672FBGA
Package
672-FBGA (27x27)
Data sheet
EP2S15F672C5N.pdf

PCN Part Status Change

2.73KHz.pdf

PCN Assembly/Origin

2.73KHz.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf
RoHs Status
RoHS Compliant
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Specifications

EP2S15F672C5N Tech Specifications
Intel - EP2S15F672C5N technical specifications, attributes, parameters and parts with similar specifications to Intel - EP2S15F672C5N

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 1.15V ~ 1.25V
Total RAM Bits 419328
Supplier Device Package 672-FBGA (27x27)
Series Stratix® II
Package / Case 672-BBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 15600
Number of LABs/CLBs 780
Number of I/O 366
Mounting Type Surface Mount
Base Product Number EP2S15

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EP2S15F672C5N Image
EP2S15F672C5N (1)

Manufacturer Part Number

EP2S15F672C5N

Manufacturer

Intel

Introduction

The EP2S15F672C5N is part of Intel's Stratix® II series, specialized as an Embedded Field Programmable Gate Array.

Product Features and Performance

FPGA architecture design

Efficient logic utilization

High-performance digital signal processing

Low power consumption

Supports various logic designs

Product Advantages

Offers flexibility in design alterations

Provides a high level of integration

Suitable for prototyping and production

Key Technical Parameters

Number of LABs/CLBs: 780

Number of Logic Elements/Cells: 15600

Total RAM Bits: 419328

Number of I/O: 366

Voltage Supply: 1.15V ~ 1.25V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Stringent quality control

Reliable performance in specified operating temperature range

Compatibility

Compatible with 672-BBGA and 672-FBGA (27x27) packages

Supports a variety of interface standards

Application Areas

Telecommunications

Automotive systems

Data processing

Industrial control

Product Lifecycle

Obsolete

Replacement or upgrade options should be considered

Several Key Reasons to Choose This Product

High integration capability reducing overall system costs

Flexible and reprogrammable solutions helping in reducing time-to-market

Proven Intel technology ensuring reliability and performance

Support for advanced digital processing capabilities

Frequently Asked Questions(FAQ)

How does the power consumption of the EP2S15F672C5N compare to other Stratix® II FPGAs when operating at typical I/O loading conditions?
The EP2S15F672C5N typically draws between 0.8W and 1.2W under nominal 1.2V core supply and standard I/O configurations with moderate switching activity. This places it toward the lower end of the Stratix® II family’s power envelope, particularly when compared to higher-density variants like the EP2S30 or EP2S40, which can exceed 2.5W under similar workloads due to increased logic utilization and routing congestion. Actual consumption varies significantly based on configuration block usage, PLL/DLL activation, and dynamic reconfiguration frequency, so static datasheet values alone are insufficient for precise thermal design.
What is the effective memory bandwidth available from the internal RAM blocks in the EP2S15F672C5N during sustained data throughput operations?
With 419,328 total RAM bits configured as distributed or embedded memory, the EP2S15F672C5N supports peak theoretical bandwidths up to ~600 Mbps per block (based on 18-bit wide dual-port access at 100 MHz). However, real-world sustained throughput rarely exceeds 400–450 Mbps due to routing overhead, clock skew, and arbitration delays in multi-bank configurations. For high-performance applications requiring >500 Mbps, external SDRAM interfaces become more efficient than relying solely on internal block RAM.
Can the EP2S15F672C5N reliably operate in industrial temperature ranges beyond its specified 0°C to 85°C junction limit?
No, the EP2S15F672C5N is qualified only for commercial temperature operation up to 85°C (TJ). Operating beyond this range introduces risks such as timing margin degradation, increased leakage current, and potential functional failures in critical paths. While some users report marginal stability up to 100°C in controlled environments, such use violates Intel’s reliability specifications and voids warranty coverage. For extended temperature applications, consideration of automotive- or industrial-grade alternatives is strongly recommended.
How many high-speed transceivers does the EP2S15F672C5N support, and what are their maximum achievable data rates?
The EP2S15F672C5N includes 20 transceivers capable of supporting up to 3.125 Gbps per lane using SERDES architecture compliant with IEEE 802.3, PCIe Gen1/2, and Gigabit Ethernet standards. These transceivers share a common reference clock domain, limiting independent lane synchronization flexibility. Achievable data rates depend heavily on PCB trace length matching, signal integrity, and protocol overhead—actual usable throughput often falls short of theoretical maxima by 10–15% in practice.
Is it feasible to implement a DDR2 interface using only the internal FPGA resources of the EP2S15F672C5N without external memory controllers?
Yes, but with significant constraints. The EP2S15F672C5N can support basic DDR2 signaling using its general-purpose I/O pins and dedicated DLLs, though achieving reliable timing requires careful placement, constrained routing, and manual calibration of DQS strobes. Without an integrated PHY layer, bit error rates increase substantially above 100 MHz effective data rates. Therefore, while possible for low-frequency applications (<133 MHz), full-speed DDR2 operation benefits greatly from external controller ICs or newer FPGA families with built-in memory interfaces.
What is the impact of LAB (Logic Array Block) utilization on maximum achievable system frequency in designs using the EP2S15F672C5N?
Maximum clock frequency decreases nonlinearly as LAB usage exceeds 60%. At 30% LAB occupancy, the EP2S15F672C5N typically achieves 200+ MHz; however, pushing above 80% utilization reduces achievable frequencies to 150 MHz or lower due to routing congestion and increased interconnect delay. This effect becomes pronounced when implementing complex state machines or deeply pipelined algorithms. Design partitioning into multiple clock domains or leveraging DSP blocks can mitigate some frequency loss but adds complexity.
Does the EP2S15F672C5N support partial reconfiguration of specific regions while maintaining system functionality?
Partial reconfiguration is supported through Intel’s Partial Reconfiguration feature, but only when the design explicitly reserves and isolates configurable modules within the FPGA fabric. The EP2S15F672C5N’s Stratix® II architecture allows dynamic updates to user-defined partitions without halting global operation, provided the updated module meets timing closure requirements and does not interfere with active global signals like clocks or resets. However, resource allocation for PR logic consumes additional LABs and increases initial configuration time.
How should decoupling capacitors be sized and placed for stable operation of the EP2S15F672C5N in high-switching applications?
For the EP2S15F672C5N, place 0.1 µF ceramic capacitors as close as possible to each VCCIO and VCCINT pin pair, supplemented by one 2.2 µF bulk capacitor near the center of the board. High-switching designs may require additional 0.01 µF capacitors at I/O banks with frequent transitions. Impedance across the power delivery network must remain below 0.5 Ω up to 100 MHz to prevent voltage droop-induced glitches. Poor decoupling manifests as increased jitter in PLL outputs and intermittent logic errors.
Can the EP2S15F672C5N drive LVDS signals without external level-shifting components?
Yes, the EP2S15F672C5N includes native LVDS transmitter and receiver circuitry compliant with ANSI/TIA/EIA-644-A standards. It can directly interface with LVDS-compatible peripherals using differential I/O pairs without external transceivers, provided the PCB traces maintain proper impedance (typically 100 Ω differential) and termination resistors (100 Ω across the pair) are installed. Signal integrity degrades rapidly beyond 15 cm trace lengths without careful layout discipline.
What are the key differences between the EP2S15F672C5N and the EP2S15F672C6N regarding speed grade performance?
The EP2S15F672C5N operates at a -5 speed grade, supporting up to 200 MHz internal logic performance, whereas the C6 variant (-6) achieves up to 250 MHz. This 25% increase in maximum frequency comes at the cost of slightly higher power consumption and tighter setup/hold margins. Designs targeting high-speed protocols like PCIe Gen2 or 1000BASE-X should prioritize the C6 version if pin compatibility and package constraints allow.
Is radiation tolerance or SEU (Single Event Upset) mitigation required for the EP2S15F672C5N in aerospace or avionics applications?
The EP2S15F672C5N is not inherently radiation-hardened. In space or high-radiation environments, it is susceptible to Single Event Upsets caused by cosmic particles flipping configuration bits or corrupting SRAM-based logic states. Mitigation strategies include triple modular redundancy (TMR), watchdog timers, and periodic frame scrubbing via JTAG. However, these techniques consume significant FPGA resources—up to 30% additional LUTs—and may exceed the EP2S15F672C5N’s capacity for complex functions, making alternative hardened devices preferable.
How does the number of available PLLs in the EP2S15F672C5N constrain multi-domain clocking architectures?
The EP2S15F672C5N contains four Phase-Locked Loops (PLLs), each capable of generating up to six output clocks with independent phase and frequency control. This limits independent clock domains to four major sources unless fractional-N synthesis or cascaded dividers are used. In systems requiring more than four distinct clock frequencies, designers must share PLLs carefully, potentially sacrificing phase accuracy or increasing jitter. Over-utilization leads to excessive output jitter (>1 ps RMS) and instability under load changes.
What considerations apply when cascading multiple EP2S15F672C5N devices for larger logic capacity?
Cascading is technically feasible via JTAG or passive interconnects, but introduces latency, reduced reliability, and complicates timing closure. The EP2S15F672C5N lacks native support for multi-device synchronization, so handshaking protocols must be implemented in firmware. Moreover, inter-chip propagation delays (typically 5–10 ns/mm) disrupt tight timing budgets, especially at frequencies >100 MHz. For scalable systems, upgrading to a higher-density Stratix® II model is generally more robust than replicating functionality across multiple chips.
Are there known limitations in using the EP2S15F672C5N with USB 2.0 high-speed peripheral implementations?
Implementing USB 2.0 High-Speed (480 Mbps) is challenging on the EP2S15F672C5N due to strict timing requirements for bit-level synchronization. While SERDES lanes can transmit raw data streams, the absence of a dedicated USB PHY necessitates external transceivers or soft IP that accurately handles NRZI encoding/decoding and bit stuffing—tasks demanding extremely low-latency logic paths. Most successful USB 2.0 designs using Stratix® II parts employ external USB controller chips rather than direct FPGA-to-host communication.
How does the Moisture Sensitivity Level (MSL) rating of MSL 3 affect storage and handling of the EP2S15F672C5N?
As an MSL 3 component (168-hour floor life), the EP2S15F672C5N must be stored in dry ambient conditions (<10% RH) and soldered within 168 hours after desiccant packaging removal. Beyond this window, moisture absorption increases popcorning risk during reflow soldering. Manufacturers typically recommend baking before assembly if shelf life exceeds MSL limits. Proper handling documentation and environmental controls are essential to preserve solder joint integrity and prevent catastrophic failure.
Can the EP2S15F672C5N support simultaneous read/write operations on multiple block RAM banks without contention?
Yes, the EP2S15F672C5N’s block RAM architecture supports true dual-port access across different banks simultaneously. Each 4K x 18-bit RAM block can be independently accessed for concurrent reads and writes, enabling efficient ping-pong buffering or multi-channel data processing. However, shared address/data buses between banks create implicit dependencies that may serialize transactions if not managed through arbiter logic, negating parallelism benefits.
What trade-offs exist between using the EP2S15F672C5N’s internal oscillators versus external crystal references?
The EP2S15F672C5N provides internal oscillator options (100 kHz or 50 kHz) for basic timing, but they offer poor frequency stability (±500 ppm over temperature) compared to external crystals (±20 ppm typical). Internal oscillators eliminate external components but restrict PLL multiplication ratios and increase long-term clock drift. For precision applications like communication protocols or synchronous data capture, external crystals are strongly preferred despite added PCB footprint and cost.
How does the choice of FPGA development tool version affect synthesis and timing closure for the EP2S15F672C5N?
Using outdated Quartus II versions (pre-9.1 SP1) results in suboptimal mapping of Stratix® II primitives, leading to inefficient LAB usage and degraded timing estimates. Newer versions incorporate updated constraint solvers and improved DSP block inference, enabling better utilization of the EP2S15F672C5N’s 288 embedded multipliers. Additionally, recent tools provide more accurate post-fit simulation models, reducing the likelihood of late-stage timing violations and redesign cycles. Always validate with the latest stable release before committing to hardware.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP2S15F672C5N

Product Attribute EP2S15F672C5 EP2S15F672C4N EP2S15F672C3N EP2S15F672C4
Part Number EP2S15F672C5 EP2S15F672C4N EP2S15F672C3N EP2S15F672C4
Manufacturer Intel Intel Intel Intel
Number of Logic Elements/Cells - - - -
Number of LABs/CLBs - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of I/O - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Total RAM Bits - - - -
Voltage - Supply - - - -
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)

EP2S15F672C5N Datasheet PDF

Download EP2S15F672C5N pdf datasheets and Intel documentation for EP2S15F672C5N - Intel.

Datasheets
Stratix II Device Handbook.pdf Virtual JTAG Megafuntion Guide.pdf
PCN Obsolescence/ EOL
Mult Dev Add Subs 6/Sep/2019.pdf Mult Dev EOL 4/Dec/2020.pdf
PCN Packaging
Mult Dev Label CHG 24/Jan/2020.pdf Mult Dev Label Chgs 24/Feb/2020.pdf
PCN Part Status Change
2.73KHz.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf
PCN Other
Readiness Plan Update 3/Apr/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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EP2S15F672C5N Image

EP2S15F672C5N

Intel
32D-EP2S15F672C5N

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