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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EP3C10F256C8
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EP3C10F256C8 - Intel

Manufacturer Part Number
EP3C10F256C8
Manufacturer
Intel
Allelco Part Number
32D-EP3C10F256C8
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,639 pcs available, New & Original
Parts Description
IC FPGA 182 I/O 256FBGA
Package
256-FBGA (17x17)
Data sheet
EP3C10F256C8.pdf
RoHs Status
 
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Specifications

EP3C10F256C8 Tech Specifications
Intel - EP3C10F256C8 technical specifications, attributes, parameters and parts with similar specifications to Intel - EP3C10F256C8

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 1.15V ~ 1.25V
Total RAM Bits 423936
Supplier Device Package 256-FBGA (17x17)
Series Cyclone® III
Package / Case 256-LBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 10320
Number of LABs/CLBs 645
Number of I/O 182
Mounting Type Surface Mount
Base Product Number EP3C10

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EP3C10F256C8 Image
EP3C10F256C8 (1)

Manufacturer Part Number

EP3C10F256C8

Manufacturer

Intel

Introduction

Intel's Cyclone III series FPGA for embedded applications

Product Features and Performance

645 LABs/CLBs

10320 Logic Elements/Cells

423936 Total RAM Bits

182 Number of I/O

Supply Voltage Range of 1.15V to 1.25V

Surface Mount Technology

Operating Temperature Range 0°C to 85°C

Product Advantages

Optimized for low power consumption

High functionality with a large number of logic cells and memory

Robust I/O capabilities

Key Technical Parameters

645 LABs/CLBs

10320 Logic Elements/Cells

423936 Total RAM Bits

182 I/O Pins

15V to 1.25V Supply Voltage

0°C to 85°C Operating Temperature

Quality and Safety Features

Compliance with industry quality and safety standards

Reliable performance within the specified operating temperature range

Compatibility

Compatible with standard 256-LBGA integrated circuits

Application Areas

Suitable for automotive, industrial, medical, consumer electronics, and communication applications

Product Lifecycle

Active status

Not nearing discontinuation

Replacements and upgrades available

Several Key Reasons to Choose This Product

Advanced logic, memory, and I/O capabilities for complex applications

Low power consumption enhances system efficiency

Backed by Intel's reputation and support

Versatile use across multiple industries

Long-term availability and support for product integration

Frequently Asked Questions(FAQ)

How does the I/O count and voltage range of the EP3C10F256C8 compare to typical FPGA requirements in low-power embedded applications, and what design considerations arise from its 1.2V core supply?
The EP3C10F256C8 offers 182 general-purpose I/Os operating at a core voltage between 1.15V and 1.25V, which aligns with modern power-efficient FPGA architectures. This relatively moderate I/O count supports medium-complexity digital designs such as motor control interfaces or industrial sensor aggregation without requiring high-speed transceivers. However, the narrow voltage tolerance—especially near the lower bound—demands careful power rail regulation; even minor deviations can impact timing margins or increase leakage current. Designers must ensure clean, low-noise power delivery to maintain signal integrity across the 182 pins, particularly when driving external components like ADCs or communication peripherals.
In what scenarios would the EP3C10F256C8 be preferred over higher-density FPGAs like those in the Cyclone V series, despite its smaller logic capacity?
The EP3C10F256C8 is advantageous in cost-sensitive, thermally constrained, or legacy-compatible embedded systems where only modest reconfigurable logic is needed. Its 10,320 logic elements and 423,936 bits of RAM are sufficient for implementing state machines, protocol bridges (e.g., SPI to UART), or small-scale image preprocessing pipelines. Unlike higher-end devices, it avoids expensive transceivers and advanced DSP blocks, reducing both BOM cost and power consumption. For applications like automotive body control modules or factory automation I/O expanders, this trade-off justifies selection despite lower scalability.
What are the implications of the EP3C10F256C8’s RoHS non-compliance status on global supply chain integration and end-of-life planning?
The EP3C10F256C8's RoHS non-compliant status restricts deployment in regions enforcing strict hazardous substance regulations, such as the European Union under Directive 2011/65/EU. While it may still find use in legacy industrial systems with exemptions, new product designs must account for potential obsolescence risks. Manufacturers sourcing this device should evaluate alternative compliant parts unless existing inventory buffers mitigate discontinuation timelines. Long-term reliability also hinges on verifying solder compatibility, especially given its MSL 3 classification requiring storage within 168 hours post-opening.
How does the 256-FBGA packaging influence thermal management and PCB layout complexity when integrating the EP3C10F256C8 into a compact embedded system?
The 256-ball Fine-Pitch Ball Grid Array (FBGA) configuration on a 17×17 mm footprint presents significant routing challenges due to dense via arrays and limited access to internal power planes. Thermal dissipation relies heavily on effective solder joint conduction to the PCB’s ground plane, necessitating adequate copper pour and possibly thermal vias beneath the package. Without a heatsink, junction temperatures could exceed 85°C under sustained load, limiting usable logic utilization. Careful layer stackup and decoupling placement become critical to prevent IR drop-induced timing failures.
Can the EP3C10F256C8 support real-time signal processing tasks comparable to dedicated DSP chips, and how do its logic element and RAM resources constrain algorithmic implementation?
While capable of basic FIR filtering or PWM generation, the EP3C10F256C8 lacks hardened DSP blocks found in newer FPGAs, making complex multi-rate or high-throughput algorithms inefficient. Its 10,320 logic elements and 423,936-bit block RAM allow implementation of simple finite impulse response filters with ≤16 taps but struggle with deeper pipelines or parallel data paths. Designers often offload such workloads to microcontrollers or ASICs unless leveraging pipelined architectures optimized for LUT-based arithmetic. Resource partitioning becomes essential to balance control logic against dataflow computation needs.
When selecting between the EP3C10F256C8 and similar mid-range FPGAs, how should one evaluate the impact of LAB/CLB structure versus total logic element counts on actual routability and performance?
The EP3C10F256C8 organizes logic into 645 Logic Array Blocks (LABs), each containing multiple Adaptive Logic Modules (ALMs). This hierarchical structure affects placement density and routing congestion compared to flat logic element counts alone. Designs exceeding LAB boundaries may incur additional delay penalties during place-and-route. Therefore, while total LEs indicate raw capacity, LAB-aware partitioning ensures better timing closure and reduces iterative synthesis cycles. Engineers should analyze resource utilization per LAB cluster rather than aggregate metrics to anticipate routing bottlenecks early.
What precautions are necessary when using the EP3C10F256C8 in environments subject to temperature cycling, given its specified operating junction temperature range?
Although rated for 0°C to 85°C, repeated thermal cycling can degrade solder joints in the FBGA package, especially if coefficient of thermal expansion (CTE) mismatches exist between the board and FPGA substrate. Mitigation strategies include using low-stress solder alloys, minimizing thermal gradients through uniform copper distribution, and avoiding rapid transitions during power-up/shutdown sequences. Additionally, functional verification under extreme temperature corners ensures correct initialization and I/O behavior beyond nominal conditions.
How does the EP3C10F256C8’s I/O voltage flexibility compare to newer FPGAs supporting multiple I/O standards, and what limitations apply when interfacing legacy peripherals?
Unlike contemporary FPGAs offering configurable I/O banks with mixed-voltage support (e.g., LVCMOS18/LVDS), the EP3C10F256C8 typically operates all 182 I/Os at a single voltage level aligned with its 1.2V core. This restricts direct compatibility with 3.3V or 5V systems unless level-shifting circuitry is added externally. Legacy protocols like RS-232 or parallel LCDs may require discrete translation stages, increasing component count and signal path latency. Designers must validate timing budgets when inserting buffers between FPGA and legacy devices.
What role does the base product number EP3C10 play in identifying compatible development tools, IP cores, and pin-compatible alternatives when working with the EP3C10F256C8?
The base part EP3C10 encompasses multiple speed grades and packages within the Cyclone III family, ensuring software tools like Quartus Prime recognize the device automatically. However, IP cores targeting specific features—such as PLL configurations or memory controllers—may vary by variant. Engineers should verify that their selected toolchain version fully supports the C8 speed grade and 256-pin package before committing to hardware bring-up. Cross-referencing the full model number prevents mismatches during programming or timing analysis phases.
Given its ECCN classification of 3A991D, what export compliance considerations apply to the EP3C10F256C8 in international engineering projects involving defense or telecommunications infrastructure?
The ECCN 3A991D designation indicates the EP3C10F256C8 qualifies as a "mass market" programmable logic device with encryption capabilities limited to basic configuration functions. This generally permits export under License Exception LVS (Low Value Shipment) for commercial end uses but requires review if integrated into systems classified under higher controls (e.g., military-grade avionics). Project teams must consult national regulations—such as U.S. EAR Part 734—before shipping finished boards containing this component to restricted destinations.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP3C10F256C8

Product Attribute EP3C10F256C8N EP3C10F256C7N EP3C10F256C6N EP3C10F256C7
Part Number EP3C10F256C8N EP3C10F256C7N EP3C10F256C6N EP3C10F256C7
Manufacturer Intel Intel Intel Intel
Number of LABs/CLBs - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Logic Elements/Cells - - - -
Number of I/O - - - -
Voltage - Supply - - - -
Total RAM Bits - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

EP3C10F256C8 Datasheet PDF

Download EP3C10F256C8 pdf datasheets and Intel documentation for EP3C10F256C8 - Intel.

Datasheets
Cyclone III Datasheet.pdf Cyclone III Device Handbook Vol2.pdf Cyclone III Family Overview.pdf Virtual JTAG Megafuntion Guide.pdf
HTML Datasheet
Cyclone III Device Handbook Vol2.pdf
PCN Packaging
Mult Dev Label CHG 24/Jan/2020.pdf Mult Dev Label Chgs 24/Feb/2020.pdf
PCN Design/Specification
Mult Series Software Chgs 26/Mar/2020.pdf Substrate/Wire 10/Jun/2010.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
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New Zealand 5
Asia India 4
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Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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EP3C10F256C8 Image

EP3C10F256C8

Intel
32D-EP3C10F256C8

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