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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EP4SGX230DF29C3N~~

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EP4SGX230DF29C3N - Intel

Name: Intel EP4SGX230DF29C3N
Brand: Intel
SKU: EP4SGX230DF29C3N
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: EP4SGX230DF29C3N

Manufacturer: Intel

Allelco Part Number: 98D-EP4SGX230DF29C3N

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,283 pcs available, New & Original

Parts Description: IC FPGA 372 I/O 780FBGA

Package: 780-FBGA (29x29)

Data sheet: EP4SGX230DF29C3.pdf

Datasheets
Stratix IV Device Handbook Vol1.pdf Stratix IV Devices.pdf Virtual JTAG Megafuntion Guide.pdf

Errata
Stratix IV GX Errata.pdf

RoHs Status: RoHS Compliant

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In stock: 4283

Specifications

EP4SGX230DF29C3N Tech Specifications
Intel - EP4SGX230DF29C3N technical specifications, attributes, parameters and parts with similar specifications to Intel - EP4SGX230DF29C3N

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	0.87V ~ 0.93V
Total RAM Bits	17544192
Supplier Device Package	780-FBGA (29x29)
Series	Stratix® IV GX
Package / Case	780-BBGA, FCBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	228000
Number of LABs/CLBs	9120
Number of I/O	372
Mounting Type	Surface Mount
Base Product Number	EP4SGX230

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
ECCN	3A001A7A
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the EP4SGX230DF29C3N Stratix IV GX FPGA compare to other devices in the same series when targeting high-speed serial communication designs?: The EP4SGX230DF29C3N offers 228,000 logic elements and 9,120 LABs, providing substantial routing resources and logic density suitable for complex transceiver-based applications. With 372 I/O pins and integrated transceivers supporting data rates up to 6.375 Gbps (as per Stratix IV GX family capabilities), it enables multi-gigabit serial links in backplanes or optical modules. Compared to lower-density variants like the EP4SGX70, which has only 72,000 logic elements, this device supports more complex protocol stacks such as PCIe Gen3 or 10G Ethernet without requiring external PHYs. However, compared to newer families like Arria V or Cyclone V, it lacks hardened floating-point units and advanced power management features, making it less efficient for DSP-intensive workloads.

What are the key thermal and power considerations when integrating the EP4SGX230DF29C3N into a system operating at full capacity?: Operating within a junction temperature range of 0°C to 85°C, the EP4SGX230DF29C3N must be carefully managed under sustained load due to its core voltage of 0.87V–0.93V and high logic density. At typical dynamic power consumption levels exceeding 30W during peak utilization—especially when multiple transceivers are active—thermal vias and adequate PCB copper area are essential. A well-designed heatsink or forced airflow is often necessary in industrial environments. The MSL 3 classification also implies that board-level reliability requires controlled humidity during assembly, particularly if soldering occurs over 168 hours after exposure.

In what scenarios would the EP4SGX230DF29C3N be preferred over discrete ASIC solutions despite higher unit cost?: The EP4SGX230DF29C3N provides reconfigurability and rapid prototyping advantages that justify its cost in applications where requirements evolve post-deployment, such as telecom line cards or test equipment. Its 372 I/Os support dense pin counts without external multiplexers, while the 175 Mbit embedded RAM allows local buffering for real-time signal processing. For fixed-function systems with stable specifications, an ASIC may offer better power efficiency, but the FPGA’s time-to-market benefit and reduced BOM complexity can outweigh this in low-to-medium volume production.

How should designers evaluate ESD protection requirements for the EP4SGX230DF29C3N in industrial control environments?: Although not specified by Intel for internal ESD robustness, the EP4SGX230DF29C3N’s surface-mount FBGA package necessitates careful handling during assembly. Industrial systems often require external TVS diodes on all I/O lines rated for at least ±8 kV contact discharge per IEC 61000-4-2. Additionally, proper grounding of the substrate pad through multiple thermal vias minimizes latch-up risk. Designers should avoid placing sensitive signals near high-current transceivers unless isolation techniques like guard rings or differential routing are implemented.

What role does the 175 Mbit of embedded block RAM play in optimizing performance for the EP4SGX230DF29C3N-based design?: The 175,441,920 bits (~175 Mb) of embedded SRAM reduce reliance on external memory interfaces, lowering latency and pin contention. This is especially valuable in applications like frame buffers, FIFO chains, or lookup tables in protocol engines. When used efficiently, it offloads the fabric from routing-intensive tasks, improving timing closure. However, mismanagement—such as excessive use of large dual-port blocks without considering address decoding—can fragment available resources and degrade placement quality, leading to increased clock skew.

How does the choice between the EP4SGX230DF29C3N and substitute part EP4SGX230DF29C3G impact manufacturing continuity?: Both EP4SGX230DF29C3N and EP4SGX230DF29C3G share identical electrical and mechanical characteristics, differing primarily in commercial grade vs. industrial temperature rating or packaging variant. Selecting one over the other affects qualification testing and supply chain stability. If transitioning from EP4SGX230DF29C3N to EP4SGX230DF29C3G, designers must verify that the extended temperature range or alternate ball-out configuration meets their system requirements without altering layout constraints.

Can the EP4SGX230DF29C3N support simultaneous high-bandwidth protocols such as PCIe x4 and 10 Gigabit Ethernet without resource conflicts?: Yes, the Stratix IV GX architecture includes dedicated transceivers and hard IP cores that allow concurrent operation of PCIe x4 (using up to four lanes) and 10GbE (via SFP+ interface). The EP4SGX230DF29C3N’s 228K LEs provide sufficient logic to implement protocol stacks and DMA controllers. However, careful planning is needed to allocate LABs, PLLs, and clock networks appropriately. Over-subscription of transceiver channels or shared reference clocks may cause jitter-related issues in mixed-signal designs.

What are the implications of using the EP4SGX230DF29C3N in a multi-FPGA system requiring synchronization across multiple boards?: The EP4SGX230DF29C3N includes phase-locked loop (PLL) and delay-locked loop (DLL) circuitry capable of generating synchronized clocks across internal domains. For multi-board synchronization, IEEE 1588 Precision Time Protocol (PTP) can be implemented using its transceivers and logic fabric. However, achieving sub-microsecond accuracy demands disciplined PCB trace matching, low-skew clock distribution, and careful calibration of delay settings—factors that become increasingly challenging as board count grows beyond two units.

How does the Moisture Sensitivity Level (MSL 3) affect storage and assembly scheduling for products using the EP4SGX230DF29C3N?: Classified as MSL 3, the EP4SGX230DF29C3N absorbs moisture over time, posing popcorning risks if baked after 168 hours at elevated temperatures. Therefore, PCB assemblies should be completed within that window unless reflow oven baking procedures are followed prior to soldering. Manufacturers must track open-packaging dates and coordinate procurement with build schedules to prevent delays caused by unexpected rework due to moisture-related failures.

Is it feasible to upgrade an existing design based on the EP4SGX230DF29C3N to support DDR3 memory interfacing?: While the EP4SGX230DF29C3N does not include hardened DDR3 memory controllers, it can implement soft DDR3 SDRAM interfaces using its general-purpose I/Os and SERDES if timing constraints are met. However, this approach consumes significant logic resources and complicates signal integrity analysis due to limited termination options and longer routing paths. Most designers opt instead for FPGA families with built-in DDR3 PHYs for better margin and reduced development effort.

What trade-offs exist between using internal RAM versus external DRAM for buffering data streams in EP4SGX230DF29C3N applications?: Internal RAM saves external component count and reduces board space, beneficial for compact designs. But it limits buffer depth compared to off-chip SDRAM, which can be expanded arbitrarily. For streaming applications with variable packet sizes, external memory offers greater flexibility, whereas internal blocks are preferable for fixed-size pipelines or small lookups. Power-wise, accessing off-chip memory increases dynamic current due to higher capacitance switching, though leakage differences are negligible.

How do the ECCN and HTSUS codes influence global compliance for designs incorporating the EP4SGX230DF29C3N?: Assigned ECCN 3A001A7A and HTSUS 8542.39.0001, the EP4SGX230DF29C3N falls under U.S. export regulations governing programmable logic devices. These classifications indicate moderate scrutiny for end-use verification, especially in defense or encryption contexts. Importers may need additional documentation depending on destination country restrictions, and exporters should consult local customs authorities to avoid shipment holds or licensing requirements.

Can the EP4SGX230DF29C3N be used effectively in aerospace or military avionics applications despite lacking radiation-hardened certification?: No, the EP4SGX230DF29C3N is not qualified for radiation environments such as those encountered in space or high-altitude platforms. Single-event upsets (SEUs) or total ionizing dose (TID) effects could corrupt configuration memory or cause functional failure. For avionics, radiation-tolerant alternatives like Microsemi RTG4 or Xilinx Kintex UltraScale+ MPSoC RH certified parts should be considered instead.

What steps are recommended to ensure reliable configuration loading for the EP4SGX230DF29C3N in field-deployed systems?: Reliable configuration requires either a robust flash-based host controller or a secure bitstream loaded via JTAG with CRC checks. Given the absence of onboard configuration memory in the base device, designers must implement error detection and recovery mechanisms—such as watchdog timers and redundant boot sectors—to handle partial image corruption. Additionally, minimizing configuration clock frequency below 10 MHz during startup improves immunity to noise-induced glitches.

How does the 780-FBGA (29x29) package influence PCB design complexity for the EP4SGX230DF29C3N?: The fine-pitch ball grid array demands precise layer stack-up, tight impedance control, and via-in-pad technologies if microvias are required. With 372 I/Os densely packed into a 29mm x 29mm footprint, crosstalk mitigation becomes critical, particularly between adjacent high-speed traces routed near transceiver channels. Thermal management also requires multiple ground planes and strategically placed thermal pads connected to inner-layer copper pours.

Are there known limitations in using the EP4SGX230DF29C3N for cryptographic acceleration tasks compared to newer FPGAs?: The Stratix IV generation predates hardened cryptographic accelerators common in later families. Implementing AES or SHA engines on the EP4SGX230DF29C3N consumes many LEs and reduces available logic for other functions. Latency and throughput suffer compared to modern solutions with dedicated hardware engines, making it less suitable for high-throughput security appliances or real-time encrypted communications.

How does voltage scaling affect the performance envelope of the EP4SGX230DF29C3N in low-power embedded deployments?: The EP4SGX23X230DF29C3N operates at 0.87V–0.93V, enabling relatively low static power consumption. However, dynamic power scales quadratically with voltage; reducing beyond nominal values risks setup/hold violations in sequential circuits. While some power savings are possible through clock gating and unused block shutdown, aggressive voltage reduction requires extensive timing reanalysis and may negate benefits due to increased hold-time failures.

What documentation and tools are essential for successful implementation of the EP4SGX230DF29C3N in a custom SoC integration?: Successful deployment relies on Quartus II Pro Edition with Stratix IV device support, along with detailed reference designs from Intel’s literature library covering transceiver calibration, reset sequencing, and pin planning. Understanding the FPGA’s internal architecture—including how LABs interconnect, how PLLs distribute clocks, and how transceivers align to reference inputs—is crucial for meeting timing budgets. Without these resources, design iterations increase significantly, delaying time-to-market.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EP4SGX230DF29C3N

Product Attribute
Part Number	EP4SGX230DF29C3NES	EP4SGX230DF29I3N	EP4SGX230DF29C3ES	EP4SGX230DF29C2XN
Manufacturer	Intel	Intel	Intel	Intel
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of LABs/CLBs	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-
Number of I/O	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Logic Elements/Cells	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Voltage - Supply	-	-	-	-
Total RAM Bits	-	-	-	-

EP4SGX230DF29C3N Datasheet PDF

Download EP4SGX230DF29C3N pdf datasheets and Intel documentation for EP4SGX230DF29C3N - Intel.

Datasheets: Stratix IV Device Handbook Vol1.pdf Stratix IV Devices.pdf Virtual JTAG Megafuntion Guide.pdf
Errata: Stratix IV GX Errata.pdf

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Customer Reviews

Evaluation: 10 Articles

Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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