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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EPF10K10TC144-4N
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EPF10K10TC144-4N - Intel

Manufacturer Part Number
EPF10K10TC144-4N
Manufacturer
Intel
Allelco Part Number
32D-EPF10K10TC144-4N
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
3,680 pcs available, New & Original
Parts Description
IC FPGA 102 I/O 144TQFP
Package
144-TQFP (20x20)
Data sheet
EPF10K10TC144-4.pdf
RoHs Status
 
Our certification
In stock: 3680

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Specifications

EPF10K10TC144-4N Tech Specifications
Intel - EPF10K10TC144-4N technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF10K10TC144-4N

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 4.75V ~ 5.25V
Total RAM Bits 6144
Supplier Device Package 144-TQFP (20x20)
Series FLEX-10K®
Package / Case 144-LQFP
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 70°C (TA)
Number of Logic Elements/Cells 576
Number of LABs/CLBs 72
Number of I/O 102
Number of Gates 31000
Mounting Type Surface Mount
Base Product Number EPF10K10

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EPF10K10TC144-4N Image
EPF10K10TC144-4N (1)

Manufacturer Part Number

EPF10K10TC144-4N

Manufacturer

Intel

Introduction

The EPF10K10TC144-4N is part of Intel's FLEX-10K series of embedded FPGAs, offering programmable logic solutions for complex system-on-chip applications.

Product Features and Performance

72 Logic Array Blocks/LABs

576 Logic Elements/Cells

6144 Total RAM Bits

102 Number of I/Os

31000 Number of Gates

Supports 4.75V to 5.25V supply voltage

Surface Mount technology

Operational temperature range from 0°C to 70°C

Packaged in a 144-LQFP (Low-profile Quad Flat Package)

Product Advantages

High integration facilitates complex circuit designs

Flexible I/O system for various interfacing requirements

Broad range of logic density for scalability

Key Technical Parameters

Number of LABs/CLBs: 72

Number of Logic Elements/Cells: 576

Total RAM Bits: 6144

Number of I/O: 102

Number of Gates: 31000

Voltage - Supply: 4.75V ~ 5.25V

Quality and Safety Features

Conforms to operational standards in temperature range from 0°C to 70°C

Robust surface mount packaging

Compatibility

Compatible with 144-TQFP (20x20) standard

Interoperable with various FLEX-10K series products

Application Areas

Complex digital systems

System-on-chip applications

Telecommunications

Industrial control systems

Automotive electronics

Product Lifecycle

Obsolete status

Seek information for replacements or upgrades

Several Key Reasons to Choose This Product

Part of the Intel FLEX-10K family known for reliability

Wide range of input/output configurations

Suitability for diverse electronic applications

Ability to support complex programmable logic designs

Recognized Intel quality and support despite obsolescence

Frequently Asked Questions(FAQ)

How does the EPF10K10TC144-4N compare to other FLEX-10K series devices in terms of logic capacity and power efficiency for mid-range FPGA applications?
The EPF10K10TC144-4N offers 576 logic elements and 72 LABs, providing sufficient logic density for moderate complexity designs. When compared to higher-end FLEX-10K variants like the EPF10K30, this device delivers a more targeted balance between performance and resource utilization, making it suitable for embedded control systems where area and power are constrained. Its 4.75V–5.25V operating range aligns with standard digital logic levels, enabling integration into legacy or mixed-voltage environments without requiring extensive level-shifting circuitry.
What are the thermal and electrical limitations when using the EPF10K10TC144-4N in industrial temperature environments above 70°C?
The EPF10K10TC144-4N is rated for commercial operation from 0°C to 70°C (TA), meaning it cannot be reliably used in industrial environments exceeding this threshold without derating or thermal management. Operating beyond 70°C risks timing violations, increased leakage current, and potential degradation of internal interconnects due to electromigration. In such cases, designers must either select a higher-grade industrial-temperature variant or implement active cooling solutions to maintain junction temperatures within safe limits, even if ambient conditions exceed specifications.
Can the EPF10K10TC144-4N support high-speed serial communication interfaces like PCIe or Gigabit Ethernet directly, or does it require external PHY components?
The EPF10K10TC144-4N does not include dedicated transceivers capable of native support for high-speed serial protocols such as PCIe or Gigabit Ethernet. While its 102 I/O pins allow flexible digital interfacing, implementing these standards requires external physical layer (PHY) chips or serializer/deserializer (SerDes) modules. This architecture shifts bandwidth-intensive tasks away from the FPGA fabric but reduces internal routing congestion and preserves logic resources for control and protocol processing, which may benefit system-level power and cost.
How should clocking architecture be designed around the EPF10K10TC144-4N given its lack of internal phase-locked loops (PLLs)?
The EPF10K10TC144-4N does not integrate internal PLLs, so all clock domain management must rely on external oscillators or clock management ICs. Designers must ensure clean, low-jitter clock sources for synchronous circuits and implement careful synchronization between asynchronous clock domains using FIFOs or handshake protocols. This absence simplifies routing but increases dependency on PCB layout quality and external timing components, particularly critical for data acquisition or communication subsystems.
What is the impact of the EPF10K10TC144-4N’s 6144-bit RAM on memory-intensive applications like small-scale buffering or state machine storage?
With 6144 total RAM bits, the EPF10K10TC144-4N can support modest memory structures such as dual-port block RAM configured as 36×16 or 72×8 arrays. This suffices for lightweight FIFO buffers, lookup tables, or state machine storage in non-data-critical paths. However, large packet buffers or complex table-based algorithms will exceed available memory, necessitating off-chip SRAM or external memory controllers. Designers should allocate RAM blocks efficiently and consider trade-offs between distributed and block RAM usage based on access patterns.
Is the EPF10K10TC144-4N suitable for battery-powered or portable embedded systems due to its power characteristics?
While the EPF10K10TC144-4N operates at standard 5V logic levels (4.75V–5.25V), its dynamic and static power consumption—though lower than modern low-voltage FPGAs—may limit suitability for ultra-low-power portable devices. The -4 speed grade indicates faster propagation delays but typically correlates with higher power dissipation under switching activity. For battery-operated applications, alternative architectures using CPLDs or ASICs might offer better energy efficiency unless reprogrammability justifies the overhead.
How does the pin count and package size affect signal integrity and routing complexity when integrating the EPF10K10TC144-4N onto a high-layer-count PCB?
The 144-pin TQFP (20x20 mm) package provides adequate I/O for most medium-complexity designs while maintaining manageable footprint constraints. However, placing all 102 usable I/Os near the edge can complicate high-speed trace routing, especially if differential pairs or clock lines require controlled impedance. Careful floorplanning is essential to minimize crosstalk and skew; otherwise, signal integrity issues may arise in dense layouts, potentially limiting maximum achievable clock frequencies or increasing EMI susceptibility.
What design considerations apply when substituting the EPF10K10TC144-4N with alternative devices like the A54SX32A-TQG144?
Although the A54SX32A-TQG144 is listed as a substitute, significant architectural differences exist: the Stratix A54SX32A contains embedded SRAM blocks, hardened multipliers, and advanced routing resources absent in the EPF10K10TC144-4N. Substitution requires complete RTL redesign, toolchain migration, and verification of timing closure under new constraints. Pin compatibility helps, but functional equivalence is not guaranteed, and performance profiles differ substantially, making direct replacement unsuitable without thorough validation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF10K10TC144-4N

Product Attribute EPF10K10TC144-4 EPF10K10TC144-3N EPF10K10TI144-4N EPF10K10TC144-3
Part Number EPF10K10TC144-4 EPF10K10TC144-3N EPF10K10TI144-4N EPF10K10TC144-3
Manufacturer Intel Intel Intel Intel
Voltage - Supply - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Total RAM Bits - - - -
Number of I/O - - - -
Number of LABs/CLBs - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Gates - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of Logic Elements/Cells - - - -

EPF10K10TC144-4N Datasheet PDF

Download EPF10K10TC144-4N pdf datasheets and Intel documentation for EPF10K10TC144-4N - Intel.

Datasheets
FLEX 10K.pdf FLEX 10KE Device Data Sheet.pdf
PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf
PCN Other
Software Disc 06/Nov/2020.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
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  • IPC
  • ESD
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EPF10K10TC144-4N Image

EPF10K10TC144-4N

Intel
32D-EPF10K10TC144-4N

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