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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EPF10K200SBC356-3~~

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EPF10K200SBC356-3 - Intel

Name: Intel EPF10K200SBC356-3
Brand: Intel
SKU: EPF10K200SBC356-3
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: EPF10K200SBC356-3

Manufacturer: Intel

Allelco Part Number: 32D-EPF10K200SBC356-3

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 14,410 pcs available, New & Original

Parts Description: IC FPGA 274 I/O 356BGA

Package: 356-BGA (35x35)

Data sheet: EPF10K200SBC356.pdf

Datasheets
FLEX 10KE Device Data Sheet.pdf

PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf

PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf

PCN Design/Specification
Mult Series Software Chgs 26/Mar/2020.pdf

PCN Other
Software Disc 06/Nov/2020.pdf

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In stock: 14410

Specifications

EPF10K200SBC356-3 Tech Specifications
Intel - EPF10K200SBC356-3 technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF10K200SBC356-3

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	2.375V ~ 2.625V
Total RAM Bits	98304
Supplier Device Package	356-BGA (35x35)
Series	FLEX-10KS®
Package / Case	356-LBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 70°C (TA)
Number of Logic Elements/Cells	9984
Number of LABs/CLBs	1248
Number of I/O	274
Number of Gates	513000
Mounting Type	Surface Mount
Base Product Number	EPF10K200

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A2A
HTSUS	8542.39.0001

Parts Introduction

EPF10K200SBC356-3 (1)

Manufacturer Part Number

EPF10K200SBC356-3

Manufacturer

Intel

Introduction

The EPF10K200SBC356-3 is an Embedded FPGA (Field Programmable Gate Array) from Intel's FLEX-10KS series.

Product Features and Performance

274 I/O pins

9,984 Logic Elements/Cells

98,304 Total RAM Bits

1,248 LABs/CLBs

513,000 Gates

Operating temperature range of 0°C to 70°C

Product Advantages

Field-programmable and reconfigurable architecture

Flexible and customizable design capabilities

Efficient for implementing complex digital logic functions

Key Technical Parameters

Voltage supply range: 2.375V to 2.625V

Package: 356-BGA (35x35)

Mounting Type: Surface Mount

Quality and Safety Features

Robust design for reliable operation

Compliance with industry standards

Compatibility

Compatible with Intel's FLEX-10KS FPGA family

Application Areas

Embedded systems

Digital signal processing

Industrial automation

Telecommunications

Aerospace and defense

Product Lifecycle

This product is currently in production and not nearing discontinuation.

Replacement or upgrade options are available within the FLEX-10KS FPGA family.

Key Reasons to Choose This Product

Flexible and reconfigurable design capabilities

Efficient implementation of complex digital logic

Reliable and robust performance

Compatibility with the FLEX-10KS FPGA family

Suitable for a wide range of embedded applications

Frequently Asked Questions(FAQ)

How does the power consumption of the EPF10K200SBC356-3 compare between typical and maximum operating conditions, and what design considerations should be made for thermal management in high-frequency applications?: The EPF10K200SBC356-3 exhibits a typical power dissipation of approximately 0.8W under normal operating conditions at room temperature, with peak values reaching up to 1.5W during full logic utilization and dynamic switching. This variation is influenced by internal interconnect capacitance, I/O configuration, and clock frequency. For systems operating above 75 MHz, thermal vias and adequate copper pour on adjacent layers are strongly recommended to maintain junction temperatures below 85°C, as exceeding this threshold can degrade propagation delay consistency and increase skew across the FPGA fabric.

What are the key differences in timing characteristics between the fast-corner and slow-corner process models when implementing synchronous designs using the EPF10K200SBC356-3?: In the fast-corner model, setup times are typically 30–40 ps faster than nominal, while hold times may tighten by up to 20 ps, leading to reduced margin for asynchronous inputs. Conversely, the slow-corner increases propagation delays by ~15% due to lower transistor drive strength, requiring longer clock-to-output timing budgets. Designers targeting industrial temperature ranges must account for these variations by applying appropriate timing constraints in Quartus Prime, especially when crossing clock domains or using LVDS interfaces.

Can the EPF10K200SBC356-3 support simultaneous use of multiple I/O standards such as LVCMOS33 and SSTL-2 Class II, and what impact does mixed-voltage signaling have on power integrity?: Yes, the EPF10K200SBC356-3 supports concurrent instantiation of LVCMOS33 and SSTL-2 Class II within different banks, provided they are electrically isolated via voltage-domain partitioning. However, mixing analog and digital signals without proper guard rings increases substrate noise coupling by an estimated 10–15 mV RMS. To preserve signal fidelity, it’s advisable to allocate dedicated ground planes and minimize return path discontinuities in the PCB layout, particularly near high-speed memory interfaces.

What is the expected static current draw of the EPF10K200SBC356-3 when configured with minimal activity but powered from a 3.3V supply, and how does leakage scale with temperature?: Under idle conditions with no clocks running and most I/O pins left unterminated, the EPF10K200SBC356-3 draws approximately 12 mA at 25°C. This value rises nonlinearly with temperature—approximately doubling every 10°C increase due to subthreshold conduction in CMOS structures. At 85°C, static current can reach 25–30 mA, which significantly affects battery-powered or thermally constrained embedded systems unless low-power mode configurations are employed.

How does the routing resource availability in the EPF10K200SBC356-3 influence architectural decisions when integrating multiple high-speed serial transceivers alongside complex state machines?: The EPF10K200SBC356-3 contains 1,216 logic elements and 16 dedicated M4K blocks, offering sufficient resources for moderate-complexity designs. However, each M4K consumes roughly 40 LEs when used as a dual-port RAM, and transceiver implementations require significant routing channels around the periphery. Over-utilization beyond 70% of available routing segments often leads to increased congestion, resulting in longer compile times and degraded signal integrity. Therefore, designers should prioritize block-level partitioning and avoid dense pin-to-pin connections across unused regions.

What are the recommended decoupling capacitor values and placement guidelines for stabilizing the VCCINT and VCCIO supplies on the EPF10K200SBC356-3?: For stable operation, the EPF10K200SBC356-3 requires 0.1 µF ceramic capacitors placed within 2 mm of each VCCINT pin and 1.0 µF bulk capacitor per power rail segment. High-frequency bypassing should target frequencies above 500 MHz using X7R dielectric types, while low-frequency stabilization relies on tantalum or polymer capacitors. Improper decoupling increases ground bounce by up to 100 mV peak-to-peak, potentially causing functional failures in delay-sensitive paths like PLL feedback loops.

How does the propagation delay of the EPF10K200SBC356-3 vary across different LAB (Logic Array Block) clusters, and what implications does this have for synchronous system design?: Propagation delay across LABs in the EPF10K200SBC356-3 typically varies by ±12% depending on physical location relative to the central clock tree. LABs located farther from global clock buffers exhibit longer skew accumulation, necessitating careful assignment of critical paths to adjacent LABs during synthesis. Failure to do so may result in timing violations even when post-fit analysis appears acceptable, particularly in wide datapaths exceeding 64 bits.

Can the EPF10K200SBC356-3 operate reliably in automotive-grade temperature environments, and what modifications are needed to meet AEC-Q100 qualification?: The commercial-grade EPF10K200SBC356-3 is not rated for full automotive operation; however, some users implement derating techniques such as reducing clock frequencies by 20% and limiting dynamic power consumption to stay within junction temperature limits. True automotive compliance would require sourcing the EPF10K200SBC356-3N variant with extended temperature rating (-40°C to +125°C), though this part may not be available through standard distributors.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF10K200SBC356-3

Product Attribute
Part Number	EPF10K200SBC356-2X	EPF10K200SBC356-1	EPF10K200SBC356-2X	EPF10K200SBC356-1
Manufacturer	Altera	Altera	Intel	Intel
Series	-	-	-	-
Voltage - Supply	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of Gates	-	-	-	-
Number of I/O	-	-	-	-
Total RAM Bits	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of LABs/CLBs	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Logic Elements/Cells	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount

EPF10K200SBC356-3 Datasheet PDF

Download EPF10K200SBC356-3 pdf datasheets and Intel documentation for EPF10K200SBC356-3 - Intel.

Datasheets: FLEX 10KE Device Data Sheet.pdf
PCN Packaging: All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL: EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification: Mult Series Software Chgs 26/Mar/2020.pdf
PCN Other: Software Disc 06/Nov/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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