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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EPF10K20RI208-4
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EPF10K20RI208-4 - Intel

Manufacturer Part Number
EPF10K20RI208-4
Manufacturer
Intel
Allelco Part Number
32D-EPF10K20RI208-4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,250 pcs available, New & Original
Parts Description
IC FPGA 147 I/O 208RQFP
Package
208-RQFP (28x28)
Data sheet
EPF10K20RI208-4.pdf

Datasheets

FLEX 10K.pdf
RoHs Status
 
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In stock: 15250

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Specifications

EPF10K20RI208-4 Tech Specifications
Intel - EPF10K20RI208-4 technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF10K20RI208-4

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 4.5V ~ 5.5V
Total RAM Bits 12288
Supplier Device Package 208-RQFP (28x28)
Series FLEX-10K®
Package / Case 208-BFQFP Exposed Pad
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C (TA)
Number of Logic Elements/Cells 1152
Number of LABs/CLBs 144
Number of I/O 147
Number of Gates 63000
Mounting Type Surface Mount
Base Product Number EPF10K20

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EPF10K20RI208-4 Image
EPF10K20RI208-4 (1)

Manufacturer Part Number

EPF10K20RI208-4

Manufacturer

Intel

Introduction

Intel EPF10K20RI208-4 is an embedded FPGA from the FLEX-10K® series.

Product Features and Performance

Incorporates 144 Logic Array Blocks (LABs)

Provides a total of 1152 Logic Elements/Cells

Features 12288 bits of embedded RAM

Offers 147 Input/Output pins

Delivers a gate count of 63000

Surface Mountable

Operating Temperature range of -40°C to 85°C

Product Advantages

Ample logic elements for complex designs

Sufficient RAM for data processing

Multiple I/Os for versatile connectivity

Capable of withstanding industrial temperature ranges

Key Technical Parameters

Number of LABs/CLBs: 144

Number of Logic Elements/Cells: 1152

Total RAM Bits: 12288

Number of I/O: 147

Number of Gates: 63000

Voltage Supply: 4.5V to 5.5V

Quality and Safety Features

Reliable performance in extreme temperatures

Compatibility

Designed with a standard 208-BFQFP Exposed Pad

Application Areas

Suitable for a broad range of industrial and embedded applications

Product Lifecycle

Obsolete status

Potential for replacement or upgrading should be investigated

Several Key Reasons to Choose This Product

Developed by Intel, a leading manufacturer in the semiconductor industry

High logic density for intermediate to complex project requirements

Enhanced connectivity with 147 I/O pins

Robust design suitable for harsh operating environments

Part of the well-regarded FLEX-10K® product family

Frequently Asked Questions(FAQ)

What are the key architectural trade-offs when using the EPF10K20RI208-4 FPGA compared to higher-density FPGAs in the same voltage range?
The EPF10K20RI208-4 provides 1,152 logic elements and 144 LABs, which positions it as a mid-complexity device ideal for control logic, glue logic, and moderate state machines. Its 63,000-gate capacity and 12,288 bits of embedded RAM limit it from handling large data-path applications or high-throughput signal processing that would require more block RAM or distributed logic. Engineers often select this device when system complexity doesn’t justify the cost, power, or design overhead of larger FPGAs, especially in industrial or embedded control applications where deterministic timing and moderate I/O expansion are sufficient.
How does the 4.5V to 5.5V supply voltage range of the EPF10K20RI208-4 influence power supply design and noise margins in legacy systems?
Operating at 5V nominal allows the EPF10K20RI208-4 to interface directly with TTL and older CMOS logic families without level translation, simplifying board-level integration in systems designed before widespread 3.3V adoption. However, the 4.5V minimum requires careful regulation under load transients to avoid brownout conditions. Designers should account for IR drop in power delivery networks and consider low-ESR decoupling capacitors near the package due to the exposed pad’s reliance on thermal and electrical conduction through the PCB. The wider voltage window increases noise immunity but demands tighter control of switching transients to prevent latch-up or timing degradation.
Why might an engineer choose the EPF10K20RI208-4 over a modern low-voltage FPGA despite its higher operating voltage?
The EPF10K20RI208-4 offers backward compatibility with 5V systems and robust I/O drive strength, making it suitable for industrial environments where legacy interfaces (e.g., RS-485, opto-isolated inputs) remain prevalent. Additionally, its 147 user I/Os in a 208-pin RQFP provide a favorable pin-to-function ratio for moderate-complexity designs. Unlike many modern FPGAs that require multiple voltage rails (core, I/O, PLL), this device operates from a single 5V supply, reducing power supply complexity and BOM cost in systems where efficiency is secondary to reliability and ease of integration.
What thermal management considerations apply to the 208-BFQFP exposed pad package of the EPF10K20RI208-4 during high-utilization operation?
The exposed thermal pad on the EPF10K20RI208-4 must be soldered to a grounded copper pour on the PCB to achieve rated thermal performance. At full logic utilization and high I/O switching activity, junction temperatures can approach the 85°C ambient limit without adequate heatsinking. Thermal vias under the pad should connect to internal ground planes to enhance heat dissipation. In enclosed or high-ambient environments, airflow or localized heatsinking may be necessary to maintain reliability, especially since the MSL 3 rating limits pre-assembly exposure time and necessitates controlled rework conditions.
How does the 12,288-bit total RAM in the EPF10K20RI208-4 constrain memory-intensive applications compared to contemporary FPGAs with embedded block RAM?
The distributed RAM architecture in the EPF10K20RI208-4 is composed of small, configurable blocks tied to logic elements, limiting efficient implementation of FIFOs, lookup tables, or buffer memory beyond a few hundred bits per function. For example, a dual-port 16-bit FIFO would consume a disproportionate number of logic cells, reducing available resources for other logic. This makes the device poorly suited for applications requiring deep storage or high-bandwidth data streaming. Engineers targeting such use cases typically migrate to FPGAs with dedicated block RAM or external memory interfaces, unless the application can tolerate segmented, time-multiplexed memory access.
What design verification challenges arise from the lack of DiGi-Electronics programmability verification for the EPF10K20RI208-4?
The absence of verified programmability through DiGi-Electronics tools means engineers must rely on Intel’s Quartus II or legacy MAX+PLUS II environments for configuration and timing analysis. This can complicate automated test flows or third-party programming infrastructure, especially in high-volume manufacturing where standardized programming protocols are preferred. Designers should validate configuration stability across the full temperature range and supply voltage tolerance, as unverified toolchains may not fully account for timing derating or configuration cell retention under marginal conditions.
In what scenarios would the EPF10K20RI208-4 be preferred over a substitute like the APA075-PQG208I despite similar pin counts?
The EPF10K20RI208-4 offers a proven, long-lifecycle FPGA architecture with documented radiation tolerance characteristics and extensive legacy design support, making it preferable in aerospace, defense, or industrial systems where component obsolescence risk is a critical factor. While the APA075-PQG208I may offer higher gate density, it lacks the same level of field-proven reliability data and may require more complex power sequencing or configuration schemes. For designs prioritizing stability, long-term availability, and minimal revalidation effort, the EPF10K20RI208-4 remains a conservative choice despite newer alternatives.
How does the -4 speed grade of the EPF10K20RI208-4 affect maximum clock frequency and inter-device synchronization in multi-FPGA systems?
The -4 speed grade indicates a moderate propagation delay, typically allowing internal logic to operate reliably up to 80–100 MHz depending on routing complexity and logic depth. In multi-FPGA designs, this limits high-speed synchronization unless careful clock domain planning and source-synchronous signaling are employed. Designers should perform static timing analysis across worst-case PVT (process, voltage, temperature) corners, especially when interfacing with faster devices, as skew and setup/hold margins may become marginal at higher frequencies. The speed grade also influences PLL performance, restricting high-resolution clock synthesis or jitter-sensitive applications.
What are the implications of the RoHS non-compliant status for the EPF10K20RI208-4 in global product development?
The RoHS non-compliant designation means the EPF10K20RI208-4 contains leaded solder, which may restrict its use in consumer electronics or products destined for EU markets unless an exemption applies (e.g., for industrial or medical equipment). This necessitates segregation in manufacturing lines and may increase compliance documentation overhead. However, in sectors like automotive (under specific exemptions) or military, this is less restrictive. Designers must evaluate end-market regulations early and consider lifecycle planning, as continued reliance on non-compliant components may hinder future product iterations or recycling compliance.
How should engineers approach signal integrity for the 147 I/O pins of the EPF10K20RI208-4 in high-noise environments?
With 147 user I/Os, the EPF10K20RI208-4 can generate significant simultaneous switching noise (SSN), especially when driving capacitive loads or operating at high toggle rates. Proper pin assignment—grouping high-speed signals away from analog or sensitive digital inputs—and controlled impedance routing are essential. Ground return paths must be minimized through solid reference planes and strategic placement of ground pins. Additionally, the 5V I/O levels provide better noise margin than 3.3V systems, but edge rates should be managed via slew rate control (if supported in design) or series termination to reduce EMI and crosstalk, particularly in motor control or relay-driven applications.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF10K20RI208-4

Product Attribute EPF10K20RI208-4N EPF10K20RI240-4 EPF10K20RI240-4N EPF10K20RC208-4N
Part Number EPF10K20RI208-4N EPF10K20RI240-4 EPF10K20RI240-4N EPF10K20RC208-4N
Manufacturer Intel Intel Intel Intel
Voltage - Supply - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of I/O - - - -
Total RAM Bits - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Logic Elements/Cells - - - -
Number of Gates - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of LABs/CLBs - - - -

EPF10K20RI208-4 Datasheet PDF

Download EPF10K20RI208-4 pdf datasheets and Intel documentation for EPF10K20RI208-4 - Intel.

Datasheets
FLEX 10K.pdf
PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf RQFP PQ4 30/Jun/2010.pdf
PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification
Laser Mark 17/Feb/2016.pdf Mult Series Software Chgs 26/Mar/2020.pdf
PCN Other
Software Disc 06/Nov/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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EPF10K20RI208-4 Image

EPF10K20RI208-4

Intel
32D-EPF10K20RI208-4

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