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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EPF6024AQC240-2
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EPF6024AQC240-2 - Intel

Manufacturer Part Number
EPF6024AQC240-2
Manufacturer
Intel
Allelco Part Number
32D-EPF6024AQC240-2
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,190 pcs available, New & Original
Parts Description
IC FPGA 199 I/O 240QFP
Package
240-PQFP (32x32)
Data sheet
EPF6024AQC240-2.pdf
RoHs Status
 
Our certification
In stock: 7190

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Specifications

EPF6024AQC240-2 Tech Specifications
Intel - EPF6024AQC240-2 technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF6024AQC240-2

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 3V ~ 3.6V
Supplier Device Package 240-PQFP (32x32)
Series FLEX 6000
Package / Case 240-BFQFP
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Product Attribute Attribute Value
Number of Logic Elements/Cells 1960
Number of LABs/CLBs 196
Number of I/O 199
Number of Gates 24000
Mounting Type Surface Mount
Base Product Number EPF6024

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 6 (Time on Label)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

EPF6024AQC240-2 Image
EPF6024AQC240-2 (1)

Manufacturer Part Number

EPF6024AQC240-2

Manufacturer

Intel

Introduction

EPF6024AQC240-2 is a model from Intel's FLEX 6000 series of Embedded FPGAs, designed for versatile applications requiring reprogrammable logic. It supports various embedded control systems functionalities with high flexibility and performance.

Product Features and Performance

FPGA from FLEX 6000 Series

Utilizes 196 Logic Array Blocks (LABs) and 1960 logic cells

Includes 199 Input/Output pins

Offers up to 24,000 gates

Operates with a supply voltage range from 3V to 3.6V

Surface Mount, 240-pin Bumper Flat Quad Package (BFQFP)

Operating temperature range from 0°C to 85°C

Product Advantages

High-density logic cells enhance performance for embedded processing

I/O versatility for broad connectivity options

Scalable FPGA solution suitable for a variety of applications

Low voltage requirements ensure power efficiency

Key Technical Parameters

Number of LABs/CLBs: 196

Number of Logic Elements/Cells: 1960

Number of I/O: 199

Number of Gates: 24000

Voltage Supply: 3V ~ 3.6V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Robust thermal performance from 0°C to 85°C

Manufactured to meet high Intel standards with compliance to PCIe standards for safety and quality

Compatibility

Compatible with various standard programming and development environments supporting FPGAs

Application Areas

Embedded systems

Automotive electronics

Digital communication systems

Consumer electronics integration

Product Lifecycle

Product Status: Obsolete

Intel suggests exploring upgraded or newer FLEX models as replacements

Several Key Reasons to Choose This Product

Proven Intel quality and reliability

High logic density and generous I/O options for complex designs

Energy-efficient design supports Eco-conscious engineering projects

Obsolete status gives opportunities for cost-effective purchase for suitable ongoing uses

Frequently Asked Questions(FAQ)

How does the EPF6024AQC240-2’s logic density compare to other FLEX 6000 series FPGAs in terms of usable resources for medium-complexity designs?
The EPF6024AQC240-2 offers 1,960 logic elements (LEs) and 196 LABs, which places it at the higher end of the FLEX 6000 series in terms of resource count. When compared to lower-density variants such as the EPF6016A, this device provides approximately 25% more logic capacity, making it suitable for designs requiring more complex state machines or moderate parallel processing. However, because LE utilization is often constrained by routing congestion and timing closure rather than raw count alone, the effective usable logic may be lower depending on design partitioning and clock domain complexity.
What are the key thermal and electrical limitations when integrating the EPF6024AQC240-2 into a system operating at full load within an industrial temperature range?
Operating across 0°C to 85°C junction temperature requires careful attention to power dissipation, which is not explicitly defined in standard datasheets but can be estimated from typical current consumption under active switching. Given its 3V–3.6V supply and moderate I/O count, peak static power could reach several hundred milliwatts. Thermal resistance must be evaluated through board-level simulation or prototype testing to avoid exceeding TJmax, especially if populated near other heat-generating components in a dense PCB stack-up.
Can the EPF6024AQC240-2 be safely used in automotive-grade applications despite being RoHS non-compliant?
While the EPF6024AQC240-2 itself meets commercial-grade reliability standards, its RoHS non-compliance—likely due to restricted lead-based soldering or halogen content—poses a regulatory risk in automotive environments where strict material compliance is required. Although functional performance is unaffected, system-level certification efforts may require alternative components or additional material documentation to satisfy OEM requirements, increasing validation overhead.
How should designers assess whether the 199 I/O capability of the EPF6024AQC240-2 is sufficient for a given interface mix without over-constraining future flexibility?
A realistic approach involves mapping expected signal types—such as LVTTL, LVCMOS, or unidirectional control lines—to available bank configurations. Since the EPF6024AQC240-2 uses a single-voltage architecture, mixed-signal interfacing must adhere to 3.3V compatibility. Designers should reserve 10–15% of I/O headroom for debugging, test points, or protocol extensions, and verify pinout alignment with package layout constraints before committing to layout routing strategies.
What trade-offs exist between using the EPF6024AQC240-2 versus a newer-generation FPGA when targeting low-power embedded systems?
The EPF6024AQC240-2 lacks advanced power management features found in modern FPGAs, such as dynamic voltage/frequency scaling or per-block sleep modes. As a result, even at idle, it consumes more quiescent current than contemporary alternatives like Intel Cyclone V devices. For battery-powered or thermally sensitive applications, this may necessitate external voltage regulation or clock gating techniques to mitigate leakage effects, adding BOM cost and design complexity.
Is it advisable to use the EPF6024AQC240-2 for prototyping high-speed serial communication protocols like PCIe or USB?
No. The FLEX 6000 architecture predates hardened transceivers capable of handling high-speed serial standards. Implementing PCIe or USB via soft IP on the EPF6024AQC240-2 would demand significant FPGA resources for SERDES emulation, increase latency, and raise jitter beyond specification limits. This part is better suited for glue-logic or asynchronous bridging functions rather than direct high-bandwidth protocol termination.
How does the Moisture Sensitivity Level (MSL) rating of 6 for the EPF6024AQC240-2 impact storage and reflow handling in mass production?
MSL 6 indicates extreme sensitivity to moisture absorption, requiring storage under dry conditions with desiccant and humidity indicator cards, and mandatory bake-out prior to reflow if exposure exceeds floor life thresholds. Failure to comply risks popcorning during soldering, leading to delamination and catastrophic failure. Production facilities must implement rigorous ESD-safe handling protocols aligned with JEDEC J-STD-033 standards for reliable assembly.
What factors limit the maximum achievable clock frequency when implementing combinatorial logic chains in the EPF6024AQC240-2?
The FLEX 6000’s interconnect topology imposes predictable propagation delays that scale nonlinearly with LAB span. For purely combinational paths spanning more than four LABs, typical maximum frequencies rarely exceed 125 MHz due to routing congestion and fanout restrictions. Designers must balance register insertion with area efficiency, often achieving optimal results through pipelining rather than relying solely on critical path optimization.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF6024AQC240-2

Product Attribute EPF6024AQC240-2N EPF6024AQC240-3 EPF6024AQC240-1 EPF6024AQC208-2
Part Number EPF6024AQC240-2N EPF6024AQC240-3 EPF6024AQC240-1 EPF6024AQC208-2
Manufacturer Intel Intel Intel Intel
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Number of LABs/CLBs - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Logic Elements/Cells - - - -
Number of Gates - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of I/O - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

EPF6024AQC240-2 Datasheet PDF

Download EPF6024AQC240-2 pdf datasheets and Intel documentation for EPF6024AQC240-2 - Intel.

Datasheets
FLEX 10K Embedded.pdf FLEX 6000 Device Family Data Sheet.pdf
PCN Packaging
2.73KHz.pdf
PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Other
Software Disc 06/Nov/2020.pdf

Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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  3. Standardized full-process testing
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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EPF6024AQC240-2 Image

EPF6024AQC240-2

Intel
32D-EPF6024AQC240-2

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