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HomeProductsIntegrated Circuits (ICs)Embedded - CPLDs (Complex Programmable Logic Devices)EPM1270F256C5RR
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EPM1270F256C5RR - Intel

Manufacturer Part Number
EPM1270F256C5RR
Manufacturer
Intel
Allelco Part Number
32D-EPM1270F256C5RR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,460 pcs available, New & Original
Parts Description
IC CPLD 980MC 10NS 256FBGA
Package
256-FBGA (17x17)
Data sheet
EPM1270F256C5RR.pdf
RoHs Status
 
Our certification
In stock: 17460

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Specifications

EPM1270F256C5RR Tech Specifications
Intel - EPM1270F256C5RR technical specifications, attributes, parameters and parts with similar specifications to Intel - EPM1270F256C5RR

Product Attribute Attribute Value
Manufacturer Intel
Voltage Supply - Internal 2.375V ~ 2.625V, 3V ~ 3.6V
Supplier Device Package 256-FBGA (17x17)
Series MAX® II
Programmable Type In System Programmable
Package / Case 256-BGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Macrocells 980
Number of Logic Elements/Blocks 1270
Number of I/O 212
Mounting Type Surface Mount
Delay Time tpd(1) Max 10 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected

Parts Introduction

Manufacturer Part Number

EPM1270F256C5RR

Manufacturer

intel

Introduction

The intel EPM1270F256C5RR is a high-performance, in-system programmable Complex Programmable Logic Device (CPLD) that offers a powerful combination of features and flexibility. With 1270 logic elements, 980 macrocells, and 212 I/O, this CPLD is designed to handle a wide range of embedded applications, providing advanced logic capabilities and efficient power consumption.

Product Features and Performance

1270 logic elements and 980 macrocells for advanced logic processing

212 I/O pins for flexible connectivity

In-system programmability for easy design changes and updates

Fast maximum delay time of 10 ns for high-speed applications

Flexible voltage supply options, supporting 2.375V to 2.625V and 3V to 3.6V

Operating temperature range of 0°C to 85°C (TJ)

Surface mount 256-BGA packaging for compact integration

Product Advantages

High-density logic resources for complex embedded designs

Rapid logic implementation and modifications with in-system programmability

Efficient power consumption and wide voltage supply options

Robust thermal performance and reliability with the extended temperature range

Key Reasons to Choose This Product

Powerful logic capabilities to handle demanding embedded applications

Flexible design options and easy upgradability with in-system programming

Reliable performance and thermal characteristics for a wide range of operating conditions

Compact and efficient surface mount package for space-constrained designs

Quality and Safety Features

Rigorous quality control and testing procedures to ensure reliable operation

Compliance with industry safety standards for safe and secure implementation

Compatibility

The intel EPM1270F256C5RR CPLD is compatible with a wide range of embedded systems and can be seamlessly integrated into various application environments.

Application Areas

Industrial automation and control systems

Telecommunications equipment

Automotive electronics

Medical devices

Consumer electronics

Product Lifecycle

The intel EPM1270F256C5RR CPLD is an active product, and there are no plans for its discontinuation. However, for the most up-to-date information on product availability and potential alternative models, please contact our website's sales team.

Frequently Asked Questions(FAQ)

What are the key differences between the EPM1270F256C5RR and similar CPLDs in terms of timing performance and power efficiency for high-speed digital logic applications?
The EPM1270F256C5RR offers a maximum propagation delay of 10 ns, which is critical for designs requiring tight timing margins. When compared to other mid-range CPLDs from competing vendors, this delay characteristic allows it to support clock frequencies up to approximately 100 MHz in typical state-machine implementations. However, its dual voltage support (2.375V–2.625V core and 3V–3.6V I/O) introduces trade-offs; while the lower core voltage reduces dynamic power consumption by roughly 30% compared to older-generation devices operating at 3.3V, the broader I/O compatibility enables interfacing with legacy systems without level shifters. This combination makes it suitable for mixed-voltage environments where both speed and legacy integration matter.
How does the number of macrocells and logic elements in the EPM1270F256C5RR influence architectural decisions when implementing complex control logic in an industrial automation system?
With 980 macrocells and 1,270 embedded logic elements, the EPM1270F256C5RR provides sufficient granularity for implementing moderate-complexity control algorithms such as protocol bridging or machine-state management in embedded controllers. Each macrocell typically contains flip-flops, programmable AND-OR arrays, and carry-chain logic, enabling efficient synthesis of finite-state machines with up to several hundred states. In practice, designers should reserve at least 20% headroom for routing congestion when targeting full utilization, especially when using all 212 available I/Os. This device is well-suited for replacing discrete logic in medium-scale applications but may require partitioning across multiple devices if implementing multi-protocol gateways with parallel data processing paths.
Can the EPM1270F256C5RR reliably operate over the full industrial temperature range specified, and what design considerations are necessary to ensure signal integrity in harsh environments?
The EPM1270F256C5RR is rated for junction temperatures from 0°C to 85°C, which aligns with standard commercial and light industrial use cases. While this exceeds basic consumer-grade reliability, continuous operation near the upper limit requires careful thermal management—particularly since power dissipation scales quadratically with switching activity. At typical I/O loads and 2.5V core voltage, the device may dissipate up to 1.2 W under worst-case switching conditions, necessitating adequate PCB copper pour or heatsinking. Additionally, input signal thresholds must be evaluated against noise margins at elevated ambient temperatures due to reduced transistor gain, potentially requiring stronger pull-up resistors or Schmitt-trigger inputs on asynchronous signals.
Is it feasible to cascade multiple EPM1270F256C5RR devices to expand logic capacity in a large-scale sequential circuit, and what synchronization challenges might arise?
Cascading EPM1270F256C5RR units is technically possible using dedicated macrocells configured as synchronous counters or handshake protocols, but introduces significant timing risks. Since each device has an internal delay variation of ±1.5 ns around the 10 ns nominal tpd, inter-device skew can accumulate rapidly—especially when coordinating outputs across more than two stages. Moreover, global reset distribution becomes problematic unless synchronized via external clocks or dedicated clear lines routed with matched lengths. For most applications, it's preferable to use higher-density FPGAs or split logic into functionally independent blocks rather than relying solely on CPLD chaining for scalability.
How should termination strategies be chosen for unused I/O pins on the EPM1270F256C5RR to minimize electromagnetic interference and prevent latch-up during field operation?
Unused I/Os on the EPM1270F256C5RR should not be left floating, as this can create unintended antenna effects and increase susceptibility to electrostatic discharge. Instead, they should be tied to VCCIO through a 1 kΩ resistor or configured as weak pull-ups via software settings, ensuring stable DC levels while limiting current during transients. This approach reduces radiated emissions by approximately 15 dBμV/m in conducted testing scenarios and prevents parasitic thyristor activation that could lead to catastrophic failure under ESD events exceeding the absolute maximum ratings. Always verify configuration registers post-programming to confirm pin states match design intent.
What impact do the different VCCIO voltage rails have on interoperability between the EPM1270F256C5RR and common peripheral interfaces like LVCMOS or LVTTL?
The EPM1270F256C5RR supports flexible I/O standards ranging from 2.375V to 3.6V per bank, enabling direct compatibility with 3.3V CMOS, 2.5V LVCMOS, and even 3.0V SSTL interfaces without additional translation circuitry. However, cross-voltage communication requires careful threshold alignment: for example, driving 3.3V signals into a 2.5V receiver may violate setup/hold windows if rise times exceed 2 ns due to differing VIH/VIL levels. Designers should consult Intel’s I/O compatibility matrix and simulate eye diagrams under process-voltage-temperature (PVT) corner conditions to ensure robust operation across supply variations within specified tolerances.
Why might the EPM1270F256C5RR be preferred over SRAM-based FPGAs for certain embedded control tasks despite lower total gate count capacity?
The EPM1270F256C5RR offers deterministic timing behavior essential for real-time control loops, where predictable propagation delays eliminate race conditions that plague FPGA-based solutions with variable routing latencies. Its non-volatile configuration memory retains logic states after power-off, eliminating boot-time loading overhead common in FPGAs, thus reducing startup time by up to 10 ms compared to equivalent FPGA implementations. Furthermore, static power consumption remains below 5 mW in standby mode—orders of magnitude lower than even low-power FPGAs—making it ideal for battery-operated or always-on monitoring systems where energy efficiency outweighs flexibility requirements.
How does the Moisture Sensitivity Level (MSL) rating of 3 for the EPM1270F256C5RR affect handling procedures during reflow soldering in high-volume manufacturing?
An MSL rating of 3 indicates that the EPM1270F256C5RR must be used within 168 hours of exposure to ambient humidity before reflow, assuming storage at <30°C/<60% RH. After opening the moisture-barrier bag, components should either be baked at 125°C for 24 hours or placed in dry storage with desiccant before assembly. Failure to follow this protocol risks popcorning during thermal cycling, particularly at the BGA-to-PCB interface where moisture expansion generates stresses exceeding solder joint fatigue limits. Automated optical inspection (AOI) after reflow can detect such defects early, but prevention through strict FIFO inventory control and humidity monitoring is far more cost-effective than rework.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPM1270F256C5RR

Product Attribute EPM1270F256C5NRR EPM1270F256I5RR EPM1270F256C4RR EPM1270F256I5NRR
Part Number EPM1270F256C5NRR EPM1270F256I5RR EPM1270F256C4RR EPM1270F256I5NRR
Manufacturer Intel Intel Intel Intel
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of I/O - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Delay Time tpd(1) Max - - - -
Programmable Type - - - -
Voltage Supply - Internal - - - -
Number of Logic Elements/Blocks - - - -
Number of Macrocells - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

EPM1270F256C5RR Datasheet PDF

Download EPM1270F256C5RR pdf datasheets and Intel documentation for EPM1270F256C5RR - Intel.

PCN Obsolescence/ EOL
MAX II EOL-Reversal 19/Mar/2021.pdf Mult Dev EOL 4/Dec/2020.pdf
PCN Design/Specification
Quartus SW/Web Chgs 23/Sep/2021.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Intel

EPM1270F256C5RR

Intel
32D-EPM1270F256C5RR

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