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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LCMXO2-640UHC-4TG144I~~

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LCMXO2-640UHC-4TG144I - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LCMXO2-640UHC-4TG144I
Brand: Lattice Semiconductor Corporation
SKU: LCMXO2-640UHC-4TG144I
Price: 10.97 USD
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: LCMXO2-640UHC-4TG144I

Manufacturer: Lattice Semiconductor

Allelco Part Number: 32D-LCMXO2-640UHC-4TG144I

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,163 pcs available, New & Original

Parts Description: IC FPGA 107 I/O 144TQFP

Package: 144-TQFP (20x20)

Data sheet: LCMXO2-640UHC-4.pdf

Datasheets
MachXO2 Family Datasheet.pdf MachXO2 Family Handbook.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Assembly/Origin
Alternate Assembly/Test Site 14/Apr/2014.pdf

PCN Design/Specification
MachXO2 Family Datasheet 30/Sep/2013.pdf QFP Dev Marking Chgs 28/Sep/2020.pdf

Getting Started Guide
Product Selector Guide.pdf

RoHs Status: ROHS3 Compliant

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Specifications

LCMXO2-640UHC-4TG144I Tech Specifications
Lattice Semiconductor Corporation - LCMXO2-640UHC-4TG144I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LCMXO2-640UHC-4TG144I

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.375V ~ 3.465V
Total RAM Bits	65536
Supplier Device Package	144-TQFP (20x20)
Series	MachXO2
Package / Case	144-LQFP
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells	640
Number of LABs/CLBs	80
Number of I/O	107
Mounting Type	Surface Mount
Base Product Number	LCMXO2-640

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

LCMXO2-640UHC-4TG144I (1)

Manufacturer Part Number

LCMXO2-640UHC-4TG144I

Manufacturer

Lattice Semiconductor

Introduction

LCMXO2-640UHC-4TG144I is part of the MachXO2 series, designed as a low power, highly flexible field programmable gate array (FPGA) offering versatile deployment options.

Product Features and Performance

Low power consumption

High flexibility and programmability

80 LABs/CLBs (Logic Array Blocks / Configurable Logic Blocks)

640 logic elements/cells

65536 total RAM bits, enabling efficient data storage

Surface mount technology for secure, compact installation

Product Advantages

Offers a balance of low power and high performance

Provides ample I/Os and logic density for medium complexity designs

The logic capacity and memory are well-suited for a range of applications in various industries

Key Technical Parameters

Number of Logic Elements/Cells: 640

Total RAM Bits: 65536

Number of LABs/CLBs: 80

Number of I/O: 107

Voltage Supply Range: 2.375V to 3.465V

Operating Temperature Range: -40°C to 100°C

Quality and Safety Features

Operates reliably within a wide temperature range of -40°C to 100°C

Built following strict industry standards for safety and performance

Compatibility

Compatible with board layouts using 144-pin LQFP

Compatible with programmable logic device programming tools from Lattice Semiconductor

Application Areas

Consumer electronics

System management

Telecommunications infrastructure

Automotive systems

General embedded control systems

Product Lifecycle

Status: Active

Currently not at risk of discontinuation with long-term availability expected

Several Key Reasons to Choose This Product

Lower power usage allows for eco-friendly designs

Versatile across multiple applications due to a substantial number of inputs/outputs and logic capacity

Operational robustness given the wide voltage and temperature range support

Supported by Lattice Semiconductor's commitment to quality and ongoing customer support

Competitive advantage due to balance in performance, quality, and long-term availability

Frequently Asked Questions(FAQ)

What is the recommended operating voltage range for the LCMXO2-640UHC-4TG144I FPGA, and how does this impact system-level power budgeting in industrial control applications?: The LCMXO2-640UHC-4TG144I operates within a supply voltage range of 2.375V to 3.465V, which aligns with standard 3.3V digital logic systems commonly used in industrial environments. This relatively wide tolerance allows designers to interface directly with 3.3V sensors, microcontrollers, or communication modules without level-shifting circuitry, reducing component count. However, tighter regulation may be necessary at the upper end of the range to prevent overheating during high-switching activity, especially given its 107 I/O pins and 640 logic elements that can generate significant dynamic power consumption under load.

How does the number of logic elements (640 LEs) and embedded RAM bits (65,536 bits) in the LCMXO2-640UHC-4TG144I compare to other MachXO2 family members like the LCMXO2-1200, and what are the implications for implementing state machines or FIFO buffers?: Compared to the larger LCMXO2-1200 variant, the LCMXO2-640UHC-4TG144I offers approximately half the logic capacity but retains a comparable proportion of embedded SRAM—about 65Kb total. For simple state machines with fewer than 10 states and minimal data buffering, this device is sufficient and cost-effective. However, implementing larger dual-port FIFOs or complex lookup tables would likely exceed available resources on the 640 variant, necessitating external memory or selection of a higher-density part like the LCMXO2-1200UE.

In a design requiring -40°C to +100°C operation, what derating considerations should be applied to the LCMXO2-640UHC-4TG144I’s timing characteristics, particularly skew and propagation delay?: While the LCMXO2-640UHC-4TG144I is rated for industrial temperature ranges, users must account for increased skew and longer propagation delays at elevated temperatures due to slower transistor switching speeds. At 100°C, typical clock-to-output delays may increase by 15–25% compared to room temperature conditions. Designers should allocate additional margin in critical path timing budgets and avoid relying solely on fast-cycle simulations unless compensated for worst-case thermal scenarios.

Can the LCMXO2-640UHC-4TG144I support hot-swapping or live insertion in backplane applications, and what precautions are needed given its surface-mount packaging and Moisture Sensitivity Level (MSL) 3 classification?: Hot-swapping is possible but requires careful implementation due to potential inrush current and ESD risks. Although the device itself does not inherently support live insertion, proper PCB layout including series resistors on power rails, TVS diodes near connectors, and controlled slew rates can mitigate stress. Users must also ensure compliance with MSL 3 handling procedures—storing parts in dry packs and baking before use if stored beyond 168 hours—to prevent popcorning damage during reflow.

What is the maximum achievable I/O switching frequency for general-purpose digital signals using the LCMXO2-640UHC-4TG144I, and how does this compare to dedicated I/O expanders like the PCA9555?: The LCMXO2-640UHC-4TG144I can switch individual I/O pins at frequencies up to several MHz depending on routing and load capacitance, leveraging its configurable I/O standards (LVCMOS, LVTTL). In contrast, I/O expanders such as the PCA9555 typically operate at only 400 kHz (I²C mode), making the FPGA far superior for high-speed GPIO tasks. However, for low-bandwidth control signals or address decoding, an external expander may reduce BOM complexity and FPGA resource usage.

How should decoupling capacitors be sized and placed around the LCMXO2-640UHC-4TG144I when driving multiple capacitive loads through its 107 I/O pins?: Given the device’s moderate drive strength and potential for simultaneous switching noise (SSN), it is advisable to place 0.1 µF ceramic capacitors as close as possible to each VCCIO pin group and one bulk capacitor (e.g., 10 µF tantalum) near the core supply. The exact value depends on expected di/dt transients; for example, driving ten 50 pF loads simultaneously could require local bypassing exceeding 0.2 µF per bank to maintain stable voltage during transitions.

Is the LCMXO2-640UHC-4TG144I suitable for implementing USB-to-UART bridging, and what constraints exist regarding internal block RAM versus logic utilization?: Implementing full-speed USB 2.0 on this device is generally impractical due to lack of native USB transceivers and excessive logic overhead. However, a UART-only bridge using the FPGA’s 65Kb RAM for TX/RX buffering is feasible if logic usage remains below 80% of the 640 LEs. Since UART protocols are lightweight, the LCMXO2-640UHC-4TG144I can efficiently manage baud rate generation, framing, and handshaking while preserving resources for glue logic or protocol conversion.

What are the key differences between using the LCMXO2-640UHC-4TG144I in a single-supply 3.3V configuration versus mixed-voltage 2.5V/3.3V I/O domains, and how does this affect signal integrity?: Operating at 2.5V reduces power consumption and improves noise margins but limits compatibility with 3.3V peripherals unless level translation is added. The device supports multiple I/O standards independently per pin bank, enabling mixed-voltage operation. However, cross-domain signals must adhere to setup/hold times, and long traces may introduce skew requiring careful timing analysis—especially since propagation delays vary slightly across voltage rails.

How does the 144-pin TQFP package of the LCMXO2-640UHC-4TG144I influence thermal performance in compact enclosures, and what heatsinking strategies apply?: The 20x20mm footprint provides adequate solder pad area for conduction cooling, but without a heat sink, junction-to-ambient thermal resistance exceeds 40°C/W under heavy load. In sealed enclosures, ambient temperature rise can push the device toward its 100°C limit. Adding thermal vias under the package and minimizing copper pour density on adjacent layers helps dissipate heat, though active cooling may be required for sustained high toggle rates across all I/O.

Can the LCMXO2-640UHC-4TG144I be reprogrammed in-system without removing it from the board, and what security features prevent unauthorized firmware access?: Yes, the LCMXO2-640UHC-4TG144I supports in-system programming via JTAG or SPI flash interfaces, allowing field updates. It includes basic anti-cloning protection through configuration password storage, though it lacks hardware encryption engines found in higher-end FPGAs. For sensitive applications, combining password protection with external secure elements or obfuscated bitstreams is recommended to deter reverse engineering.

When selecting between the LCMXO2-640UHC-4TG144I and a CPLD like the GAL22V10, what factors favor choosing the FPGA despite higher power and complexity?: The LCMXO2-640UHC-4TG144I offers significantly greater flexibility than fixed-function CPLDs due to its reconfigurable logic fabric and abundant RAM. If the application requires sequential processing, state machines with memory, or protocol adaptation beyond combinatorial logic, the FPGA becomes essential. Even simple glue logic tasks benefit from parallel processing capabilities absent in older CPLDs, justifying the trade-off in quiescent power and development time.

What are the recommended pull-up/pull-down resistor values for unused I/O pins on the LCMXO2-640UHC-4TG144I to minimize leakage and EMI in automotive-grade systems?: To balance power dissipation and noise immunity, 4.7 kΩ to 10 kΩ resistors are typically appropriate for most CMOS inputs. On the LCMXO2-640UHC-4TG144I, internal weak pull-ups/pull-downs exist but have limited drive strength. For automotive environments subject to vibration and temperature extremes, external resistors ensure stable biasing while preventing floating nodes that could couple interference into adjacent circuits.

How does the MachXO2 architecture’s support for I²C, SPI, and UART macros simplify implementation compared to raw HDL coding on the LCMXO2-640UHC-4TG144I?: The built-in soft-IP blocks for serial protocols reduce HDL complexity by abstracting bit-banging logic and error handling. For instance, configuring an I²C master on the LCMXO2-640UHC-4TG144I takes minutes versus hours of manual coding. These macros also guarantee timing compliance across voltage and temperature variations, improving reliability in production deployments where software bugs or timing violations are costly.

What precautions should be taken during PCB assembly to avoid damaging the LCMXO2-640UHC-4TG144I, given its MSL 3 rating and fine-pitch QFP leads?: Adhering to IPC-J-STD-033 guidelines is critical: store parts in desiccant-controlled environments, bake before reflow if shelf life exceeded 168 hours, and use nitrogen reflow profiles to reduce oxidation. Handlers should wear grounded wrist straps, and pick-and-place machines must maintain precise alignment to prevent lead damage. Poor handling can cause open circuits or latent defects manifesting later under thermal cycling.

In battery-powered edge devices, how does the LCMXO2-640UHC-4TG144I’s low-power mode functionality help extend runtime, and what wake-up latency should be expected?: The MachXO2 family supports deep sleep modes where core current drops to under 1 µA, ideal for periodic sensor polling. On the LCMXO2-640UHC-4TG144I, wake-up from sleep typically takes 1–2 ms due to oscillator stabilization and state restoration overhead. Designers can optimize by keeping essential logic awake and using edge detection on wake-up pins, balancing responsiveness against energy savings.

Can multiple LCMXO2-640UHC-4TG144I devices be cascaded using SPI for daisy-chained configuration, and what limitations arise from shared clock domains?: Daisy-chaining is supported via SPI, but synchronization becomes challenging across multiple devices due to cumulative propagation delays and setup/hold window tightening. Each additional chip introduces skew that may violate timing specs unless carefully managed with staggered enable signals or synchronous reset sequences. Additionally, boot-up order must be strictly controlled to prevent contention on shared lines.

What tools and licenses are required to synthesize designs targeting the LCMXO2-640UHC-4TG144I, and how does Lattice Diamond compare to open-source alternatives like Yosys?: Lattice Diamond provides optimized synthesis, place-and-route, and bitstream generation specifically tuned for MachXO2 devices, offering better timing closure and resource utilization out-of-the-box. While Yosys can target the same architecture, it lacks vendor-specific optimizations and may yield suboptimal results without manual tuning. For commercial products requiring guaranteed performance, paid toolchains like Diamond or Radiant are preferred despite steeper learning curves.

How does the RoHS 3 compliance status of the LCMXO2-640UHC-4TG144I impact global regulatory submissions, particularly in the EU and China?: RoHS 3 certification confirms halogen-free materials and restricted hazardous substances, satisfying EU Directive 2011/65/EU and aligning with China RoHS requirements. This simplifies CE marking and avoids customs penalties in regulated markets. However, users must still validate full bill-of-materials compliance, as third-party components on the same PCB may introduce non-compliant materials regardless of the FPGA’s status.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LCMXO2-640UHC-4TG144I

Product Attribute
Part Number	LCMXO2-640UHC-4TG144C	LCMXO2-640UHC-6TG144I	LCMXO2-640UHC-5TG144C	LCMXO2-640HC-6TG100I
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Series	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Logic Elements/Cells	-	-	-	-
Number of I/O	-	-	-	-
Number of LABs/CLBs	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Total RAM Bits	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Voltage - Supply	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount

LCMXO2-640UHC-4TG144I Datasheet PDF

Download LCMXO2-640UHC-4TG144I pdf datasheets and Lattice Semiconductor Corporation documentation for LCMXO2-640UHC-4TG144I - Lattice Semiconductor Corporation.

Datasheets: MachXO2 Family Datasheet.pdf MachXO2 Family Handbook.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Assembly/Origin: Alternate Assembly/Test Site 14/Apr/2014.pdf
PCN Design/Specification: MachXO2 Family Datasheet 30/Sep/2013.pdf QFP Dev Marking Chgs 28/Sep/2020.pdf
Getting Started Guide: Product Selector Guide.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	United States	5
America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
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Middle East	Israel	6

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1.00kg-2.00kg	USD$40.00 - USD$80.00
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