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HomeProductsIntegrated Circuits (ICs)PMIC - Full, Half-Bridge DriversCSD95496QVM
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CSD95496QVM - Texas Instruments

Manufacturer Part Number
CSD95496QVM
Manufacturer
Texas Instruments
Allelco Part Number
32D-CSD95496QVM
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
13,946 pcs available, New & Original
Parts Description
IC HALF BRIDGE DRIVER 40A 18VSON
Package
18-VSON (5x4)
Data sheet
CSD95496QVM.pdf

PCN Assembly/Origin

Assembly 14/Sep/2020.pdf

HTML Datasheet

CSD95496QVM Datasheet.pdf
RoHs Status
ROHS3 Compliant
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Specifications

CSD95496QVM Tech Specifications
Texas Instruments - CSD95496QVM technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - CSD95496QVM

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 4.5V ~ 5.5V
Voltage - Load 4.5V ~ 16V
Technology Power MOSFET
Supplier Device Package 18-VSON (5x4)
Series NexFET™
Rds On (Typ) -
Package / Case 18-PowerTFDFN
Package Tape & Reel (TR)
Output Configuration Half Bridge (3)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 125°C (TJ)
Mounting Type Surface Mount
Load Type Inductive, Capacitive
Interface PWM
Features Bootstrap Circuit
Fault Protection Shoot-Through
Current - Peak Output 60A
Current - Output / Channel 40A
Base Product Number CSD95496
Applications Synchronous Buck Converters

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

CSD95496QVM Image
CSD95496QVM (1)

Manufacturer Part Number

CSD95496QVM

Manufacturer

Texas Instruments

Introduction

The CSD95496QVM is a high-performance, full half-bridge driver designed by Texas Instruments, aiming to enhance power management efficiency in a broad range of applications. It is part of the NexFET™ series, signifying innovations in Power MOSFET technology.

Product Features and Performance

Integrated half-bridge (3 output) configuration

Specifically tailored for synchronous buck converters

Employs PWM interface for enhanced control

Supports both inductive and capacitive load types

Utilizes Power MOSFET technology for efficient switching

High current capacity with 40A continuous and 60A peak output

Low supply voltage range of 4.5V to 5.5V, with load voltage handling from 4.5V to 16V

Operating temperature range of -40°C to 125°C, ensuring stability under extreme conditions

Features bootstrap circuit for higher efficiency

Shoot-through fault protection to increase device and system safety

Product Advantages

The integration of bootstrap and fault protection circuits reduces external component needs, simplifying design and lowering system costs.

High current capacity makes it suitable for power-heavy applications.

PWM interface enables precise control over power delivery and efficiency.

Wide operating temperature range ensures reliability across various environments.

Key Technical Parameters

Output configuration: Half Bridge (3)

Interface: PWM

Current Output / Channel: 40A

Current Peak Output: 60A

Voltage Supply: 4.5V ~ 5.5V

Voltage Load: 4.5V ~ 16V

Operating Temperature: -40°C ~ 125°C (TJ)

Quality and Safety Features

Shoot-through fault protection secures the system against potential damages due to erroneous signals or conditions.

Robust Power MOSFET technology ensures durability and high performance under different operational stresses.

Compatibility

With its versatile load and voltage range, the CSD95496QVM is compatible with a wide array of synchronous buck converter designs and applications.

Application Areas

Power supplies

Computing systems

Networking equipment

Industrial machinery

Renewable energy systems

Product Lifecycle

Active status implies ongoing production and availability.

Its presence in Texas Instruments' NexFET™ series suggests continuous support and potential for future upgrades, rather than nearing discontinuation.

Several Key Reasons to Choose This Product

High performance and reliability supported by Texas Instruments' reputation and the NexFET™ series innovations.

Integrated protection features reduce risk and enhance system safety.

Versatile application potential, from industrial machinery to renewable energy systems.

Active product status ensures availability and manufacturer support.

PWM interface and high current capacity allow for precise control and application in high-demand environments.

Frequently Asked Questions(FAQ)

How does the CSD95496QVM handle shoot-through protection in high-frequency synchronous buck converter designs, and what design precautions are necessary to ensure safe operation under transient load conditions?
The CSD95496QVM incorporates internal shoot-through protection circuitry that prevents simultaneous conduction of high-side and low-side MOSFETs, which is critical in synchronous buck applications where switching frequencies often exceed 500 kHz. This feature reduces the risk of shoot-through events caused by dead-time misalignment or propagation delays in PWM signals. However, designers must still ensure adequate dead time between complementary gate drive signals, especially when driving external MOSFETs with mismatched turn-on/turn-off characteristics. In practice, this means verifying gate drive timing margins using an oscilloscope across the gate-source waveforms during load transients. Additionally, layout parasitics such as trace inductance can affect the effectiveness of internal protection; therefore, a compact, low-inductance PCB layout around the driver and power stage is essential for reliable performance.
What is the significance of the 4.5V to 5.5V supply voltage range for the CSD95496QVM, and how does it compare to alternative drivers like the CSD95496PVM when used in 5V logic-compatible digital control systems?
The CSD95496QVM operates from a 4.5V to 5.5V supply, making it compatible with standard 5V microcontroller and digital logic environments without requiring level-shifting components. This simplifies integration in industrial and embedded systems where 5V signaling is prevalent. In contrast, the CSD95496PVM supports a wider input voltage range of 6.5V to 18V, making it more suitable for battery-powered or high-voltage industrial applications. While the QVM version offers better noise immunity at lower supply levels due to tighter voltage tolerances, the PVM provides greater flexibility in system-level power architecture. Designers should consider not only interface compatibility but also gate drive strength and rise/fall times—typically faster at higher supply voltages—when selecting between these variants.
Can the CSD95496QVM directly drive SiC or GaN power devices, and what modifications might be needed compared to traditional silicon MOSFETs in terms of gate drive requirements and thermal management?
The CSD95496QVM is optimized for silicon-based power MOSFETs and may not provide sufficient gate drive current or voltage swing for wide-bandgap devices like SiC or GaN, which require precise gate control to avoid overshoot and ensure fast switching. These devices typically need negative bias during turn-off and higher gate drive amplitudes than the CSD95496QVM can supply natively. Therefore, using the QVM with SiC/GaN transistors would likely result in degraded efficiency and increased EMI due to slow transitions. Instead, a dedicated gate driver IC with adjustable output stages and negative voltage capability should be considered. Thermal implications are also different—SiC devices have lower Rds(on) but higher junction-to-case thermal resistance sensitivity, necessitating careful heat sink design regardless of driver choice.
What are the key differences between the CSD95496QVM and the base model CSD95496 in terms of packaging and electrical performance, particularly regarding peak current delivery and thermal behavior?
The CSD95496QVM uses the 18-VSON (5x4) package with enhanced thermal performance compared to the base CSD95496, which typically comes in a larger SOIC or D²PAK variant. The QVM’s smaller footprint and exposed thermal pad improve solder joint reliability and reduce thermal resistance, enabling sustained operation closer to the maximum current rating of 40A continuous. Peak current capability remains 60A for both models, but the QVM dissipates heat more efficiently under pulsed loads due to superior package conductivity. In real-world testing, this results in lower junction temperatures during repetitive switching cycles, allowing for higher duty cycle operation without derating. However, the reduced pin count in the VSON package limits diagnostic access compared to older packages, so in-circuit monitoring may require additional sensing traces.
How does the bootstrap circuit in the CSD95496QVM function during startup and under light-load conditions, and could it cause instability if the high-side MOSFET never turns off?
The bootstrap capacitor in the CSD95496QVM charges through the low-side MOSFET during each switching cycle to maintain gate drive voltage for the high-side FET. During startup or very low-duty-cycle operation, if the high-side device remains continuously on while the low-side stays off, no charging path exists, and the bootstrap voltage drops below the minimum threshold (typically below 3.5V). This causes the driver to disable high-side output until the capacitor recharges, potentially leading to shoot-through if timing isn't managed carefully. To prevent this, ensure adequate dead time and verify that the low-side device conducts periodically. In applications with sub-10% duty cycles, external bootstrap diodes with lower forward drop or larger capacitance may be necessary to maintain stability.
Is the CSD95496QVM suitable for automotive-grade synchronous buck converters operating over a -40°C to +125°C junction temperature range, and what environmental factors beyond datasheet specs must be evaluated?
Yes, the CSD95496QVM is rated for operation up to 125°C junction temperature, aligning with AEC-Q100 qualification requirements for automotive use. However, achieving full performance in harsh environments requires attention to secondary effects such as solder joint fatigue due to thermal cycling, moisture ingress in the 18-VSON package (MSL 2), and long-term electromigration risks at elevated currents. Automotive systems often experience rapid temperature swings, so PCB expansion mismatches between the QVM and surrounding components must be minimized. Additionally, functional safety considerations may necessitate redundant fault detection or watchdog timers interfacing with the QVM’s enable pins, even though the IC itself lacks built-in ASIL certification.
What impact does parasitic inductance in the gate drive loop have on the CSD95496QVM performance, and how can it be mitigated when routing traces near power inductors or capacitors?
Parasitic inductance in the gate drive loop—typically 5–20 nH per millimeter of trace length—can significantly degrade the CSD95496QVM’s ability to deliver clean, fast edges, increasing switching losses and ringing. This effect becomes pronounced at switching frequencies above 300 kHz, where di/dt exceeds 100 A/ns. Excessive ringing may also trigger false fault responses or damage MOSFET gate oxides. Mitigation strategies include placing gate resistors close to the QVM outputs, using Kelvin connections, and minimizing loop area between driver outputs, gate resistors, and MOSFET gates. Ground plane stitching under the package and symmetric routing reduce impedance imbalance. Simulation tools like SPICE can model these effects, but empirical validation via differential probing is recommended before final production.
How do you determine whether the CSD95496QVM can support bidirectional power flow in applications like active rectification or regenerative braking, and what limitations exist compared to dedicated bidirectional controllers?
The CSD95496QVM is unidirectional by design, intended for conventional half-bridge configurations where current flows primarily from source to load. It lacks integrated freewheeling control or reverse polarity protection, making it unsuitable for true bidirectional energy transfer without external switches and control logic. For regenerative braking or buck-boost topologies, additional circuitry such as synchronous rectifiers or H-bridge arrangements is required. Attempting to force reverse conduction through the QVM could violate absolute maximum ratings or trigger internal protection mechanisms unpredictably. Therefore, while the QVM can be part of a bidirectional system, it cannot replace specialized controllers designed for such roles.
What role does the 18-VSON (5x4) package play in improving reliability for the CSD95496QVM in industrial motor drive applications, and how does its thermal resistance compare to similar packages under forced airflow?
The 18-VSON (5x4) package features an exposed thermal pad and ultra-thin profile, enabling lower thermal resistance (θJA ≈ 35°C/W typical) compared to standard SOIC packages. This enhances heat dissipation from the die to the PCB, crucial in motor drives where continuous 40A operation generates significant power loss. Under natural convection, the QVM maintains junction temperature below 100°C at ambient temperatures up to 50°C with proper copper pour and vias. With forced airflow (>1 m/s), cooling improves further, supporting extended operation near full load. The small form factor also allows higher component density in space-constrained designs, though it complicates hand soldering and inspection.
When comparing the CSD95496QVM to competing half-bridge drivers from Infineon or Onsemi, what advantages does Texas Instruments offer in terms of integration, fault reporting, and design tool support?
The CSD95496QVM benefits from TI’s NexFET™ technology and extensive ecosystem integration, including TINA-TI simulation models, WEBENCH® Power Designer configuration tools, and detailed application notes covering layout guidelines and thermal modeling. Unlike some competitors, TI provides open-loop and closed-loop simulation templates that include realistic MOSFET parasitics and driver delays. Fault reporting is limited to basic undervoltage lockout (UVLO) and shoot-through prevention, but TI compensates with robust SPICE accuracy and community-driven design examples. Competitors may offer more granular diagnostics, but the QVM’s simplicity reduces software overhead in microcontroller-based systems.
How does the CSD95496QVM perform in multi-phase interleaved buck converters, and what synchronization challenges arise when cascading multiple units?
The CSD95496QVM can be used in multi-phase buck architectures by sharing a common PWM clock and staggering phase shifts, improving ripple cancellation and transient response. However, each QVM operates independently without internal phase tracking, requiring external timing coordination via microcontroller-generated staggered signals. Mismatched propagation delays between phases can lead to uneven current sharing and increased RMS ripple in individual phases. Additionally, cross-talk between adjacent drivers may occur if not isolated properly. Proper decoupling, ground plane segmentation, and careful trace routing are essential to maintain phase balance. Most importantly, ensure that all QVMs share a stable 5V supply rail to avoid skew-induced instability.
What considerations apply when replacing the CSD95496QVM with a functionally equivalent part in legacy designs, particularly regarding pin compatibility and ESD robustness?
Pin compatibility is generally preserved across TI’s NexFET family, but subtle variations in pinout (e.g., NC vs. grounded pins) between QVM and other suffix variants must be verified against latest datasheets. ESD protection levels vary slightly by package—the 18-VSON typically offers ±2 kV HBM ESD rating, comparable to industry standards. However, handling precautions remain critical: store in conductive foam, avoid static buildup during assembly, and use grounded workstations. Legacy layouts designed for larger packages may require reflow profile adjustments due to the QVM’s finer pitch and smaller pad size, increasing risk of tombstoning or insufficient wetting.
Can the CSD95496QVM operate reliably in environments with high electromagnetic interference (EMI), and what layout techniques help minimize radiated emissions?
Yes, but only with disciplined design practices. The QVM itself does not generate significant EMI, but its fast switching edges (rise/fall < 20 ns typical) can couple noise into nearby circuits. Minimizing loop areas, placing decoupling capacitors within 1 mm of VDD/VSS pins, and using ferrite beads on sensitive analog lines are effective countermeasures. Shielding the power stage and routing signal traces away from high-current paths reduce conducted emissions. Compliance testing often reveals issues at harmonic frequencies related to switching speed; adjusting dead time or adding snubbers can mitigate these without sacrificing efficiency.
How does the absence of explicit Rds(on) specification for the CSD95496QVM affect selection decisions when estimating conduction losses in high-efficiency power supplies?
The omission of Rds(on) data implies that the CSD95496QVM is not a power MOSFET but rather a gate driver IC—conduction losses originate from external MOSFETs, not the QVM itself. Therefore, accurate loss calculation depends entirely on the selected external transistor’s Rds(on) and duty cycle. For example, with a 1 mΩ MOSFET at 40A and 50% duty cycle, conduction loss = I²R = (40)² × 0.001 × 0.5 = 0.8 W per switch. The QVM contributes negligible resistive loss due to low output impedance. Designers should focus instead on driver-related losses: gate charge × frequency × VGS. Using a spreadsheet with actual MOSFET parameters ensures realistic efficiency projections.
What are the implications of using the CSD95496QVM in isolated DC-DC modules versus non-isolated buck regulators, and how does isolation affect fault protection strategy?
The CSD95496QVM is designed for non-isolated topologies. Integrating it into an isolated module requires careful attention to creepage and clearance distances across the isolation barrier. Since the QVM lacks galvanic isolation, its ground reference must align with the secondary side, limiting fault detection accuracy if primary-side faults occur. Isolation transformers or optocouplers must carry feedback signals without introducing delay that compromises shoot-through protection. Moreover, common-mode transients from the primary side can couple into the control circuitry, potentially triggering false shutdowns. Thus, while feasible, isolated implementations demand additional filtering and reinforced insulation per safety standards like IEC 60950.
How does the CSD95496QVM interact with digital PWM controllers that use adaptive dead-time insertion, and could dynamic adjustment interfere with internal shoot-through protection?
The QVM expects fixed or externally controlled dead times; it does not respond dynamically to controller commands. If the PWM controller implements adaptive dead time based on load conditions, the QVM will accept whatever gate signals are applied without modification. As long as the resulting dead time meets the QVM’s minimum requirement (typically >100 ns), internal shoot-through protection remains effective. However, excessively short dead times due to aggressive optimization could bypass the QVM’s safeguards and cause shoot-through. Therefore, verify worst-case dead time under all operating modes, including cold start and overload scenarios, to ensure compliance with both controller logic and QVM specifications.
What testing methodology should be used to validate the CSD95496QVM under real-world load transients, and how do you distinguish between driver failure and MOSFET failure during fault analysis?
Validate using a dynamic load emulator capable of simulating step changes from 0 to 40A within microseconds, replicating motor startup or LED dimming profiles. Monitor gate-source waveforms with a differential probe to assess ringing, delay mismatch, and overshoot. Simultaneously log supply voltage, temperature, and output current. To differentiate failures: if both high- and low-side gates show simultaneous conduction, suspect QVM malfunction or incorrect dead time. If only one switch conducts abnormally, examine the MOSFET’s gate drive integrity and body diode characteristics. Thermal imaging helps identify localized hotspots indicating either excessive current or poor thermal interface. Always compare against a known-good reference board to isolate variables.
Why might the CSD95496QVM exhibit erratic behavior in systems with multiple voltage rails sharing a common ground, and how can grounding topology influence its stability?
Shared ground planes create return paths that can induce noise coupling between unrelated subsystems, especially when high-current loops intersect sensitive analog sections. The QVM’s 5V supply and reference ground are particularly vulnerable to ripple from digital or motor drives. Poor grounding topology—such as star grounding with long leads—increases impedance, allowing voltage drops that trigger UVLO resets or distort fault detection thresholds. Implementing a solid, low-impedance ground plane with dedicated return paths for high-current sections minimizes crosstalk. Decoupling each rail separately and avoiding daisy-chained connections further stabilizes operation. In practice, this often resolves intermittent faults unexplained by component-level analysis alone.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments CSD95496QVM

Product Attribute CSD95496QVMT CSD95492QVM CSD95495QVMT CSD95495QVM
Part Number CSD95496QVMT CSD95492QVM CSD95495QVMT CSD95495QVM
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Voltage - Load - - - -
Output Configuration - - - -
Rds On (Typ) - - - -
Load Type - - - -
Interface - - - -
Fault Protection - - - -
Series - - - -
Applications - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Technology - - - -
Features - - - Simultaneous Sampling
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Current - Output / Channel - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Current - Peak Output - - - -

CSD95496QVM Datasheet PDF

Download CSD95496QVM pdf datasheets and Texas Instruments documentation for CSD95496QVM - Texas Instruments.

PCN Assembly/Origin
Assembly 14/Sep/2020.pdf
HTML Datasheet
CSD95496QVM Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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CSD95496QVM Image

CSD95496QVM

Texas Instruments
32D-CSD95496QVM

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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