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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMSP430F135IPAG
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MSP430F135IPAG - Texas Instruments

Manufacturer Part Number
MSP430F135IPAG
Manufacturer
Texas Instruments
Allelco Part Number
32D-MSP430F135IPAG
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
3,901 pcs available, New & Original
Parts Description
IC MCU 16BIT 16KB FLASH 64TQFP
Package
64-TQFP (10x10)
Data sheet
MSP430F135IPAG.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 3901

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Specifications

MSP430F135IPAG Tech Specifications
Texas Instruments - MSP430F135IPAG technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F135IPAG

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Supplier Device Package 64-TQFP (10x10)
Speed 8MHz
Series MSP430x1xx
RAM Size 512 x 8
Program Memory Type FLASH
Program Memory Size 16KB (16K x 8 + 256B)
Peripherals POR, PWM, WDT
Package / Case 64-TQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 8x12b
Core Size 16-Bit
Core Processor MSP430 CPU16
Connectivity SPI, UART/USART
Base Product Number MSP430F135

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

MSP430F135IPAG Image
MSP430F135IPAG (1)

Manufacturer Part Number

MSP430F135IPAG

Manufacturer

Texas Instruments

Introduction

The MSP430F135IPAG is a low-power 16-bit microcontroller from Texas Instruments, designed for embedded applications requiring a combination of efficient data processing and minimal power consumption.

Product Features and Performance

16-Bit RISC Architecture

Up to 8MHz Clock Speed

16KB Flash Memory

512B Random Access Memory (RAM)

Integrated Watchdog Timer (WDT)

Pulse-Width Modulation (PWM) Support

Power On Reset (POR) Feature

Serial Peripheral Interface (SPI)

UART/USART Communications Interface

48 Programmable Input/Output (I/O) Pins

12-Bit Analog-to-Digital Converter (ADC) with 8 Channels

On-Chip Oscillator for Clock Generation

Low Power Consumption

Product Advantages

Optimized for Battery-Powered Applications

Flexible Power Management System

Extensive Code Compatibility Across MSP430 Family

Robust and Versatile I/O Capabilities

Key Technical Parameters

Core Size: 16-Bit

Speed: 8MHz

Program Memory Size: 16KB

RAM Size: 512B

Voltage Supply: 1.8V to 3.6V

Operating Temperature Range: -40°C to 85°C

Mounting Type: Surface Mount

Package: 64-TQFP (10x10)

Quality and Safety Features

Extended Temperature Operation

Reliable Reset Circuitry

Enhanced Watchdog Timer

Compatibility

Compatible with MSP430 Peripheral Component Ecosystem

Support for MSP430 Development Tools and Software Libraries

Application Areas

Consumer Electronics

Portable Instrumentation

Sensor Systems

Energy Management

Home Automation

Product Lifecycle

Active Product Status

Not Currently Nearing Discontinuation

Replacement and Upgrade Options Typically Available

Several Key Reasons to Choose This Product

Extremely Low Power Consumption for Prolonged Battery Life

Powerful Processing Capabilities With a 16-Bit RISC Processor

Comprehensive Set of Integrated Peripherals Reducing BOM Costs

Highly Scalable and Compatible within MSP430 Product Family

Ideal for Design Flexibility in Both Industrial and Consumer Applications

Strong Support Network from Texas Instruments Including Software Libraries and Development Tools

Frequently Asked Questions(FAQ)

How does the MSP430F135IPAG compare to other MSP430x1xx series microcontrollers in terms of power consumption and program memory size for battery-operated sensor node applications?
The MSP430F135IPAG offers a balanced combination of low active-mode current (typically 270μA/MHz at 8MHz with Vcc = 3V) and 16KB of flash memory, which is sufficient for implementing complex sensor data processing algorithms. Compared to the MSP430F110 and MSP430G2x53 variants in the same family, it provides significantly more program memory—16KB versus 512B or 1KB—while maintaining similar ultra-low power sleep modes down to 0.8μA with SRAM retention. This makes it particularly suitable for applications requiring extended battery life without sacrificing computational capacity, such as wireless environmental monitoring nodes.
What are the key differences between the MSP430F135IPAG and MSP430F149IPM in terms of peripheral integration and package footprint for industrial control systems?
While both belong to the MSP430x1xx series, the MSP430F135IPAG uses a 64-pin TQFP (10x10mm) package with 48 GPIOs and includes an 8-channel 12-bit ADC, whereas the MSP430F149IPM features a larger LQFP-100 package with more I/Os and additional peripherals like a second UART and DMA controller. The F135IPAG’s compact footprint and moderate peripheral set make it ideal for space-constrained embedded designs where cost and board area are critical, while the F149 offers higher connectivity at the expense of increased package size and pin count.
Can the MSP430F135IPAG reliably operate in automotive environments, and what design considerations are necessary to ensure long-term stability under temperature stress?
The MSP430F135IPAG is specified for operation over -40°C to +85°C, meeting standard industrial temperature requirements but not full automotive grade (-40°C to +125°C). For most non-automotive industrial applications—such as factory automation or building control systems—it performs reliably within this range. Designers should implement proper thermal management, avoid localized hotspots near high-power components, and consider derating voltage margins during prolonged high-temperature operation to mitigate aging effects on internal oscillators and flash memory endurance.
What is the impact of using the internal oscillator versus an external crystal on system timing accuracy when deploying the MSP430F135IPAG in precision measurement applications?
The MSP430F135IPAG includes a calibrated internal DCO (Digital Controlled Oscillator) that runs at 8MHz with typical accuracy of ±1% after factory calibration. However, this may drift by up to ±2% over temperature and voltage variations. In contrast, using a 32kHz watch crystal improves real-time clock accuracy significantly, while a 8MHz fundamental mode crystal can achieve ±10ppm stability. For time-critical or frequency-sensitive tasks like data logging with timestamp precision better than milliseconds, an external crystal is strongly recommended despite added component count and layout complexity.
How much RAM does the MSP430F135IPAG provide, and how should engineers manage data buffering and stack allocation when developing multitasking firmware?
The MSP430F135IPAG contains 512 bytes of general-purpose RAM organized as 512 x 8 bits. Given its limited memory footprint, developers must optimize data structures, minimize dynamic allocations, and carefully plan interrupt service routines to avoid stack overflow. Typical best practices include using static buffers for sensor data, disabling interrupts during critical sections, and leveraging compiler optimizations to reduce function call overhead—especially important in cooperative RTOS-like scheduling models common in resource-constrained MSP430 designs.
What trade-offs exist between the MSP430F135IPAG and ARM Cortex-M0+ based MCUs in low-power IoT edge devices, and why might one choose this MSP430 despite newer architectures?
The MSP430F135IPAG consumes less than 1mA in active mode and enters sub-microampere sleep states quickly, outperforming many Cortex-M0+ parts in duty-cycled applications. However, it lacks floating-point units and has lower clock speeds (8MHz vs. typically 32–64MHz), limiting algorithmic throughput. Choosing the F135IPAG makes sense when minimizing total system power budget, reducing BOM cost, and simplifying analog front-end integration outweigh raw computational needs—common in simple sensor hubs or legacy protocol gateways where compatibility and proven reliability dominate.
Is it feasible to upgrade from MSP430F135IPAG to MSP430FRxx series FRAM-based MCUs in existing designs, and what challenges arise during migration?
Migrating from MSP430F135IPAG to an MSP430FRxx device involves significant architectural changes due to FRAM’s non-volatile RAM characteristics, different register maps, and altered power management behavior. Although code structure can often be preserved, developers must redesign memory-mapped access patterns, re-evaluate flash erase/write cycles replaced by instant write capability, and adapt bootloaders if present. Additionally, supply voltage tolerances and oscillator configurations differ slightly, necessitating thorough regression testing under worst-case conditions to ensure functional parity.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F135IPAG

Product Attribute MSP430F135IPMR MSP430F135IPM MSP430F135IRTDT MSP430F133IPM
Part Number MSP430F135IPMR MSP430F135IPM MSP430F135IRTDT MSP430F133IPM
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
EEPROM Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of I/O - - - -
Speed - - - -
Peripherals - - - -
Oscillator Type - - - -
Data Converters - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Connectivity - - - -
Core Processor - - - -
Series - - - -
Core Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Program Memory Type - - - -
RAM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Program Memory Size - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)

MSP430F135IPAG Datasheet PDF

Download MSP430F135IPAG pdf datasheets and Texas Instruments documentation for MSP430F135IPAG - Texas Instruments.

HTML Datasheet
MSP430x13x, 14x(1) Datasheet.pdf
PCN Assembly/Origin
2.73KHz.pdf

Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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This is achieved through our commitment to the continual improvement of our processes, services, and products.


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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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MSP430F135IPAG Image

MSP430F135IPAG

Texas Instruments
32D-MSP430F135IPAG

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