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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5328IRGCR~~

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MSP430F5328IRGCR - Texas Instruments

Name: Texas Instruments MSP430F5328IRGCR
Brand: Texas Instruments
SKU: MSP430F5328IRGCR
Price: 3.848 USD
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: MSP430F5328IRGCR

Manufacturer: Texas Instruments

Allelco Part Number: 32D-MSP430F5328IRGCR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,880 pcs available, New & Original

Parts Description: IC MCU 16BIT 128KB FLASH 64VQFN

Package: 64-VQFN (9x9)

Data sheet: MSP430F5328IRGC.pdf

Datasheets
MSP430x5xx,MSP430x6xx Family Guide.pdf

PCN Design/Specification
CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf Mult Dev Datasheet Rev 17/Dec/2018.pdf

Errata
MSP430F5328 Errata.pdf

HTML Datasheet
MSP430F532x Datasheet.pdf

PCN Other
2.73KHz.pdf

PCN Assembly/Origin
UTAC site 25/Jan/2016.pdf

RoHs Status: ROHS3 Compliant

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Specifications

MSP430F5328IRGCR Tech Specifications
Texas Instruments - MSP430F5328IRGCR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5328IRGCR

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	64-VQFN (9x9)
Speed	25MHz
Series	MSP430F5xx
RAM Size	10K x 8
Program Memory Type	FLASH
Program Memory Size	128KB (128K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	64-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	47
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 12x12b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART
Base Product Number	MSP430F5328

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Parts Introduction

MSP430F5328IRGCR (1)

Manufacturer Part Number

MSP430F5328IRGCR

Manufacturer

Texas Instruments

Introduction

16-bit ultra-low-power microcontroller

Product Features and Performance

25MHz operating speed

128KB flash program memory

10KB RAM

12-bit ADC

IrDA, LINbus, SCI, SPI, UART/USART connectivity

Brown-out detection and reset

DMA, power-on reset, PWM, watchdog timer peripherals

Operating voltage range: 1.8V to 3.6V

Operating temperature range: -40°C to 85°C

Product Advantages

Extremely low power consumption

Robust connectivity and peripheral options

Flexible memory and performance configurations

Wide operating temperature range

MSP430F5328IRGCR (2)

Key Technical Parameters

16-bit MSP430 core

25MHz maximum clock speed

128KB flash program memory

10KB RAM

12-bit ADC

Quality and Safety Features

RoHS3 compliant

Brown-out detection and reset

Watchdog timer for system integrity

Compatibility

Suitable for a wide range of embedded applications

Application Areas

Industrial automation

Portable medical devices

Metering and instrumentation

Home and building automation

Wireless sensor networks

Product Lifecycle

Current product, no discontinuation planned

Replacement/upgrade options available within the MSP430 family

Several Key Reasons to Choose This Product

Exceptional power efficiency for battery-powered applications

Extensive connectivity and peripherals for versatile design

Robust temperature range for industrial and harsh environments

Mature and well-supported microcontroller platform from Texas Instruments

Frequently Asked Questions(FAQ)

How does the power consumption profile of the MSP430F5328IRGCR compare to other 16-bit microcontrollers in the same voltage and speed range, particularly for battery-powered applications?: The MSP430F5328IRGCR is designed with ultra-low power characteristics that make it highly suitable for energy-constrained environments. In active mode at 25MHz, it typically consumes around 220µA/MHz when running from the main clock source. However, its true advantage lies in standby modes—when using the low-power oscillator, the device can operate at currents as low as 1.1µA while maintaining RAM contents. This represents a significant improvement over many competing 16-bit MCUs that often consume 5–10µA or more in similar low-power states. For applications such as wireless sensors or portable medical devices requiring weeks or months of operation on coin-cell batteries, this efficiency enables longer operational lifespans compared to alternatives like certain ARM Cortex-M0+ parts.

What are the key trade-offs between using the internal versus external crystal oscillator with the MSP430F5328IRGCR, and how do they affect system reliability and design complexity?: The MSP430F5328IRGCR integrates multiple internal oscillators including a calibrated DCO (Digital Controlled Oscillator) capable of achieving frequencies up to 25MHz, which simplifies PCB layout and reduces component count. However, these internal sources may exhibit frequency drift across temperature and supply variations, potentially impacting timing-critical protocols like UART baud rates or PWM accuracy. In contrast, an external crystal provides superior stability (±20ppm typical vs. ±1% for internal DCO), making it preferable for applications requiring precise timing such as data logging systems or communication interfaces operating near protocol tolerances. The use of an external resonator adds two passive components and increases board space by approximately 25mm², but ensures consistent performance across industrial temperature ranges (-40°C to +85°C). Designers must weigh this against the need for robustness in time-sensitive embedded control loops.

Can the MSP430F5328IRGCR be effectively used in automotive-grade applications, and what modifications would be necessary to meet AEC-Q100 qualification requirements?: While the MSP430F5328IRGCR itself is not automotive-qualified under AEC-Q100 standards, its architecture supports adaptation for harsh environments through careful design practices. Texas Instruments offers automotive versions of the MSP430F5xx family with extended temperature grades (-40°C to +125°C) and enhanced ESD protection, but the specific IRGCR variant listed here operates only to 85°C maximum ambient. For non-automotive industrial deployments within -40°C to +85°C, the part performs reliably provided adequate decoupling capacitors (typically four 100nF MLCCs placed close to Vcc pins) and proper thermal management due to the 64-VQFN package’s limited exposed pad dissipation capability (~0.8W max without heatsinking). True automotive compliance would require switching to a qualified part number such as MSP430F5329AQET or implementing additional fault injection testing during development.

How does the 128KB flash memory configuration of the MSP430F5328IRGCR impact firmware update strategies compared to smaller-memory alternatives?: With 128KB of flash organized as 128K x 8 bits, the MSP430F5328IRGCR provides sufficient program storage for complex state machines, real-time data processing algorithms, and even basic graphical user interfaces using character LCDs or OLED displays. Unlike smaller MSP430 variants limited to 32KB or 64KB, this capacity allows implementation of modular firmware architectures where multiple application layers coexist—such as a bootloader occupying the first 4KB, diagnostic routines in the middle segment, and primary logic in the upper portion. However, flash write cycles are finite (typically 10k endurance), so over-the-air (OTA) updates must include wear-leveling logic or restrict writes to designated blocks. Additionally, the lack of on-chip EEPROM means configuration data persistence requires either flash emulation (with associated cycle limits) or external serial FRAM/EEPROM chips, adding cost and complexity relative to integrated EEPROM solutions found in some STM32 or PIC32 families.

What considerations should be made regarding pin compatibility when migrating designs from older MSP430 models to the MSP430F5328IRGCR?: Although the MSP430F5328IRGCR shares the same 64-pin VQFN footprint as earlier F5xx series devices, direct pin-to-pin migration is not always feasible due to reconfigured peripheral mappings and increased I/O count from 47 pins. For instance, while GPIO port mapping remains consistent (Port 1–7), some alternate function assignments have shifted between revisions to accommodate new features like LINbus support or improved DMA routing. Designers should consult both the original target MCU’s reference manual and the MSP430F5328IRGCR’s specific datasheet for register-level differences, especially around clock control modules (FRCTL, CS module), interrupt vector tables, and analog subsystem configurations. Furthermore, the addition of 12x12b ADCs introduces shared resource conflicts that were absent in previous generations—careful planning of sensor multiplexing schedules is essential to avoid ADC contention during concurrent peripheral usage.

Is it possible to run the MSP430F5328IRGCR’s CPU at speeds exceeding 25MHz, and what are the implications for signal integrity and EMI?: Officially, the maximum CPU frequency for the MSP430F5328IRGCR is rated at 25MHz based on characterization under nominal conditions (3.3V supply, 25°C). Attempting to exceed this limit risks timing failures, metastability in synchronous circuits, and unpredictable behavior in peripherals relying on clock synchronization. Even if marginal operation appears stable, suboptimal phase noise in the internal DCO could degrade UART baud rate accuracy beyond acceptable margins (±2% tolerance for standard USART implementations). From an EMI perspective, higher-than-specified clock frequencies increase radiated emissions, potentially violating FCC Class B or CISPR 22 limits in compact enclosures. Therefore, unless absolutely required and thoroughly validated through lab testing, operating above 25MHz is strongly discouraged; instead, designers should leverage the device’s DMA and peripheral acceleration features to maintain throughput without increasing core clock rates.

How does the choice between polling and interrupt-driven I/O affect real-time responsiveness when using the MSP430F5328IRGCR for SPI communication?: For SPI transactions managed entirely by the MSP430F5328IRGCR’s hardware module, interrupt-driven approaches generally outperform polling in terms of CPU utilization and latency consistency. When configured in master mode with interrupts enabled on transmit/receive complete flags, the processor can sleep between transfers, reducing average current draw by orders of magnitude—critical for battery-operated systems communicating intermittently with external sensors. Polling, while simpler to implement, keeps the CPU awake continuously, consuming roughly 1–2mA per transaction even when idle. Moreover, interrupt latency on the MSP430F5328IRGCR is typically <50ns from flag assertion to ISR entry, enabling reliable handling of high-speed SPI slaves (up to 8MHz supported) without missed bytes. Care must be taken, however, to minimize ISR duration to prevent buffer overruns, particularly when interfacing with fast DACs or memory chips requiring burst transfers.

What factors influence the selection of decoupling capacitor values and placement for stable operation of the MSP430F5328IRGCR in production designs?: Stable operation of the MSP430F5328IRGCR demands effective suppression of supply rail transients caused by digital switching activity. Each Vcc/Vss pair (including the analog supply if used) should be bypassed with a combination of bulk capacitance (e.g., 10µF tantalum or ceramic) for low-frequency stabilization and high-frequency bypassing using 100nF X7R or NP0 capacitors placed within 5mm of the respective pins. Due to the 64-VQFN’s fine-pitch 0.4mm pads and exposed die attach paddle, ground return paths must be prioritized—the thermal pad should connect directly to a solid ground plane via multiple stitching vias to minimize inductance. Improper decoupling has led to observed issues such as brownout resets during rapid I/O toggling or erratic ADC readings, especially when driving capacitive loads like LED arrays or relay coils. Simulation tools like HyperLynx SI can model parasitic inductance effects, but empirical validation via scope probing of Vcc ripple (<50mVpp) remains essential before finalizing layouts.

How does the absence of integrated EEPROM in the MSP430F5328IRGCR affect data retention strategies for factory calibration parameters?: Without onboard EEPROM, the MSP430F5328IRGCR relies on emulated non-volatile storage using flash memory sectors reserved exclusively for configuration data. This approach incurs several limitations: each erase/write cycle consumes flash endurance budget (limited to ~10k cycles), necessitating wear-leveling algorithms for long-term reliability; write times extend from microseconds to milliseconds due to erase-before-write overhead, slowing boot sequences; and data corruption risks increase during power loss events if write operations aren’t atomic. Alternatives include pairing the MCU with an external serial EEPROM (e.g., AT24Cxx) for critical constants like gain offsets or trimming values, or adopting FRAM-based chips (MB85RSxxx) offering unlimited endurance at slightly higher cost. In mass-production scenarios, factory programming via JTAG/SWD interfaces preloads flash with calibrated coefficients, avoiding runtime writes altogether—a viable strategy given the MSP430F5328IRGCR’s robust SWD interface supporting in-circuit reprogramming.

What role does the watchdog timer (WDT) play in ensuring system robustness with the MSP430F5328IRGCR, and how should it be configured for mission-critical applications?: The MSP430F5328IRGCR embeds a windowed watchdog timer (WDT_A) capable of generating reset signals after a programmable timeout period, serving as a last-resort recovery mechanism during software hangs or infinite loops. Configured in interval mode (non-windowed), the WDT can wake the CPU from LPM3/LPM4 states at regular intervals to perform housekeeping tasks, thereby balancing power savings with responsiveness. However, improper handling—such as disabling the WDT without proper safeguards or failing to feed it within expected timeframes—can lead to spurious resets, complicating debug efforts. For safety-relevant systems, consider implementing dual-layer monitoring: a coarse WDT for catastrophic failures and a finer-grained task-watchdog implemented in software for detecting stalled foreground processes. Always initialize the WDT early in startup code, set appropriate intervals based on worst-case execution times, and never disable it permanently unless transitioning to a known-safe state.

Can the MSP430F5328IRGCR drive multiple parallel LEDs simultaneously without external buffering, and what are the current limitations?: The MSP430F5328IRGCR can sink or source up to 4mA per GPIO pin (with a total bank limit of 20mA for Port 1 and 10mA per port for others), allowing direct driving of small indicator LEDs or low-resolution LED matrices using current-limiting resistors. However, attempting to drive high-brightness LEDs (>10mA) or large displays (multiple segments) exceeds safe operating conditions and risks damaging bond wires or violating absolute maximum ratings. For higher-current loads, external drivers such as ULN2003 Darlington arrays or modern MOSFET gates (e.g., DMN3019LSS) are recommended. Additionally, simultaneous switching of numerous outputs creates ground bounce and supply droop, potentially triggering brownout resets—mitigated by distributing LED loads across multiple ports and incorporating local decoupling. Firmware-wise, use PWM outputs from the Timer_A module to dim LEDs smoothly, leveraging hardware-generated waveforms without CPU intervention.

How does the inclusion of IrDA functionality in the MSP430F5328IRGCR benefit wireless communication architectures, and what are its practical constraints?: The built-in IrDA transceiver interface enables short-range infrared communication compatible with legacy protocols like SIR (Serial Infrared) and MIR (Medium Infrared), facilitating contactless data exchange between handheld devices or industrial equipment without RF licensing concerns. This is advantageous in environments where electromagnetic interference must be minimized or regulatory restrictions apply. However, IrDA links suffer from line-of-sight requirements, limited range (<1 meter typical), and susceptibility to ambient light interference. Compared to BLE or Zigbee radios, IrDA offers lower power consumption and no antenna design complexity, but trades off bandwidth (up to 115.2 kbps in SIR mode) and flexibility. For the MSP430F5328IRGCR, IrDA operates independently of the main CPU, freeing resources for background tasks—ideal for simple remote control panels or barcode scanners requiring occasional peer-to-peer sync.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5328IRGCR

Product Attribute
Part Number	MSP430F5328IRGCT	MSP430F5328TRGCTEP	MSP430F5328IZXHR	MSP430F5329IPNR
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Core Processor	-	-	-	-
Program Memory Type	-	-	-	-
Program Memory Size	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Series	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Base Product Number	-	DAC34H84	MAX500	ADS62P42
RAM Size	-	-	-	-
Data Converters	-	-	-	-
Connectivity	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Speed	-	-	-	-
Peripherals	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Core Size	-	-	-	-
EEPROM Size	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of I/O	-	-	-	-
Oscillator Type	-	-	-	-

MSP430F5328IRGCR Datasheet PDF

Download MSP430F5328IRGCR pdf datasheets and Texas Instruments documentation for MSP430F5328IRGCR - Texas Instruments.

Datasheets: MSP430x5xx,MSP430x6xx Family Guide.pdf
PCN Design/Specification: CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf Mult Dev Datasheet Rev 17/Dec/2018.pdf
Errata: MSP430F5328 Errata.pdf
HTML Datasheet: MSP430F532x Datasheet.pdf
PCN Other: 2.73KHz.pdf
PCN Assembly/Origin: UTAC site 25/Jan/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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