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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430F5522IRGCT~~

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MSP430F5522IRGCT - Texas Instruments

Name: Texas Instruments MSP430F5522IRGCT
Brand: Texas Instruments
SKU: MSP430F5522IRGCT
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: MSP430F5522IRGCT

Manufacturer: Texas Instruments

Allelco Part Number: 32D-MSP430F5522IRGCT

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 8,348 pcs available, New & Original

Parts Description: IC MCU 16BIT 32KB FLASH 64VQFN

Package: 64-VQFN (9x9)

Data sheet: MSP430F5522IRGC.pdf

PCN Design/Specification
CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf

PCN Other
Multiple Changes 19/Sep/2014.pdf

PCN Assembly/Origin
UTAC site 25/Jan/2016.pdf

RoHs Status: ROHS3 Compliant

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In stock: 8348

Specifications

MSP430F5522IRGCT Tech Specifications
Texas Instruments - MSP430F5522IRGCT technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F5522IRGCT

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	64-VQFN (9x9)
Speed	25MHz
Series	MSP430F5xx
RAM Size	10K x 8
Program Memory Type	FLASH
Program Memory Size	32KB (32K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	64-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	47
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 12x12b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Base Product Number	MSP430F5522

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Parts Introduction

MSP430F5522IRGCT (1)

Manufacturer Part Number

MSP430F5522IRGCT

Manufacturer

Texas Instruments

Introduction

High-performance, low-power, 16-bit MSP430 microcontroller

Product Features and Performance

MSP430 CPUXV2 core, 25MHz speed

Integrated DMA, PWM, WDT

Internal oscillator

Low power consumption

Product Advantages

Optimized for battery-powered applications

Robust I/O with 47 pins

Advanced control peripherals

Key Technical Parameters

32KB FLASH memory

10KB RAM

8V ~ 3.6V supply voltage

12x12b A/D converters

Quality and Safety Features

Brown-out Detect/Reset

Power-on Reset (POR)

Extended operating temperature range

Compatibility

I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB interfaces

Application Areas

Industrial control

Sensing and instrumentation

Wireless connectivity

Product Lifecycle

Currently active

Information on discontinuation or replacements available if necessary

Several Key Reasons to Choose This Product

Low-power architecture suitable for energy-sensitive applications

High integration reduces system cost and complexity

Flexible interfacing with multiple communication protocols

Technical support and extensive community resources from Texas Instruments

Robust operation in harsh environmental conditions

Frequently Asked Questions(FAQ)

How does the MSP430F5522IRGCT compare to other MSP430 devices in terms of power consumption and clock speed for battery-powered applications?: The MSP430F5522IRGCT operates at 25MHz with a core voltage range of 1.8V to 3.6V, enabling efficient performance while maintaining low power consumption typical of the MSP430 family. When compared to lower-speed variants like the MSP430G2xx series, this device offers significantly higher processing capability without sacrificing the energy efficiency that makes MSP430 microcontrollers ideal for portable or energy-harvesting designs. Its active mode current draw is typically under 290µA/MHz, which allows it to balance computational throughput with extended battery life—critical for applications such as wireless sensors or data loggers where both speed and energy efficiency are essential.

What are the key differences between the MSP430F5522IRGCT and the MSP430FRxx series in terms of memory architecture and non-volatile storage behavior?: Unlike the MSP430FRxx series, which uses ferroelectric RAM (FRAM) for non-volatile data storage, the MSP430F5522IRGCT relies on traditional flash memory. This means write endurance for external flash operations is limited—typically around 10,000 cycles per sector—and requires careful management during firmware updates. While FRAM offers near-infinite writes and faster byte-level access, flash-based systems like the MSP430F5522IRGCT require erase-before-write sequences and block management, increasing software complexity. For applications requiring frequent data logging or configuration changes, this trade-off must be evaluated against the benefits of FRAM’s deterministic write performance and power savings during data retention.

Can the MSP430F5522IRGCT support full-speed USB communication, and what hardware considerations are necessary for reliable USB operation?: Yes, the MSP430F5522IRGCT includes an integrated USB controller capable of supporting USB 2.0 full-speed (12 Mbps) communication. However, stable USB operation demands precise timing, so an external 12 MHz crystal oscillator is typically required alongside internal PLL circuitry to generate the 48 MHz clock needed by the USB module. Additionally, proper PCB layout practices—such as controlled impedance traces, adequate decoupling near VCC pins, and isolation from noisy digital lines—are critical. Without these, enumeration failures or intermittent disconnects can occur, especially in environments with electromagnetic interference or poor grounding.

What is the maximum number of analog inputs available on the MSP430F5522IRGCT, and how should input configuration affect ADC performance?: The MSP430F5522IRGCT provides 12 programmable analog input channels via its integrated 12-bit SAR ADC. These inputs can be multiplexed across multiple GPIO pins, allowing flexible sensor interfacing. To optimize accuracy, each channel should be sampled with sufficient settling time after switching, and care must be taken to avoid crosstalk when adjacent channels are active simultaneously. For best results, use differential measurements only when signal levels exceed single-ended ranges, and ensure reference voltage stability—especially if using internal references, which may drift with temperature. In multi-sensor applications, staggered sampling or buffered inputs may reduce conversion overhead and improve effective resolution.

How does the interrupt latency of the MSP430F5522IRGCT compare across different peripheral modules, and what design strategies minimize response delay?: Interrupt latencies vary depending on the source and current CPU state. On average, maskable interrupts are serviced within 7–10 clock cycles (~300–400ns at 25MHz), but nested interrupts or high-priority tasks can introduce variability. Peripherals like the DMA controller reduce CPU intervention by handling data transfers autonomously, indirectly improving responsiveness for time-critical I/O tasks. Designers should prioritize critical interrupts, avoid long ISRs, and leverage the MSP430’s fast context save/restore mechanism. Additionally, configuring unused peripherals in low-power modes reduces spurious wake-ups and preserves real-time performance.

What thermal limitations exist for the MSP430F5522IRGCT, and how do they impact long-term reliability in compact enclosures?: Operating within the specified -40°C to +85°C junction temperature range ensures reliability under normal conditions, but continuous full-load operation near 85°C increases stress on the flash memory cells. Flash programming and erasure degrade over time with temperature cycling, so minimizing write frequency and avoiding sustained high ambient temperatures extend device lifespan. In sealed or poorly ventilated enclosures, thermal buildup can accelerate electromigration effects, particularly in the 64-VQFN package’s exposed pad. Proper soldering profiles and thermal vias under the package enhance heat dissipation, helping maintain junction temperatures well below absolute maximum ratings even during prolonged operation.

Is the MSP430F5522IRGCT suitable for automotive-grade applications, and what environmental qualifications should be verified before deployment?: No, the MSP430F5522IRGCT is not qualified to AEC-Q100 standards and is intended for industrial and commercial use only. While it meets RoHS3 compliance and has an MSL rating of 3 (168 hours), its operating temperature range (-40°C to +85°C) falls short of typical automotive requirements (up to +125°C). Deploying this part in automotive systems exposes it to potential failure modes including solder joint cracking under thermal expansion, latch-up susceptibility, or accelerated degradation of flash memory. Designers targeting automotive environments must select alternative TI devices specifically validated for functional safety and extended temperature ranges.

What are the recommended bypass capacitor values and placement guidelines for stable operation of the MSP430F5522IRGCT?: Stable operation requires decoupling capacitors placed as close as possible to the VCC and AVSS pins. A 0.1 µF ceramic capacitor per power pin, combined with one 1 µF bulk capacitor near the power entry point, mitigates high-frequency noise and voltage droop during switching transients. Particular attention should be paid to analog supplies (AVDD/AVSS) since ADC linearity depends on clean reference voltages. Avoid placing decoupling caps on shared nets with digital switching loads unless adequately isolated. Poor decoupling can cause erratic behavior, especially during USB transmission bursts or ADC conversions, leading to false resets or data corruption.

How does the watchdog timer configuration affect system robustness in the MSP430F5522IRGCT, and what common pitfalls should be avoided?: The MSP430F5522IRGCT includes a windowed or interval-mode watchdog timer (WDT) that resets the MCU if not periodically cleared within a defined window. Proper use prevents runaway code due to stack overflows or infinite loops. However, failing to re-enable the WDT after sleep modes or using incorrect prescaler settings can lead to premature resets. Another common mistake is disabling the WDT without implementing redundant fault detection, effectively removing a key safety net. For mission-critical systems, consider pairing the WDT with brown-out detection and POR circuits to ensure graceful recovery from transient faults.

What are the implications of using the internal DCO versus an external crystal on startup time and power consumption in the MSP430F5522IRGCT?: The MSP430F5522IRGCT supports both internal digitally controlled oscillator (DCO) and external crystal configurations. Startup from DCO is faster (~1–2 ms) and consumes slightly less quiescent current, making it preferable for wake-from-sleep scenarios. However, DCO accuracy (±2% over temperature/voltage) may be insufficient for USB or precision timing applications. External crystals (e.g., 32.768 kHz for RTC or 12 MHz for USB) provide better stability but increase startup time and component count. Choosing between them involves balancing timing precision, power budget, and system complexity—especially important in always-on or time-sensitive deployments.

Can the MSP430F5522IRGCT drive capacitive loads directly on GPIO outputs, and what precautions apply?: While the MSP430F5522IRGCT GPIOs can source/sink up to 20 mA, driving large capacitive loads (e.g., >100 pF) risks exceeding slew rate limits and generating electromagnetic interference. Inductive kickback can also damage output drivers if no flyback diode is present. In such cases, external buffer transistors or dedicated driver ICs are recommended. Alternatively, software-controlled slew rate limiting via GPIO drive strength settings (if available) can mitigate ringing. Always verify output waveforms with an oscilloscope to ensure rise/fall times meet target specifications and do not violate setup/hold margins for downstream logic.

What role does the DMA controller play in optimizing data transfer efficiency in the MSP430F5522IRGCT-based systems?: The MSP430F5522IRGCT features a DMA controller that offloads repetitive data movement from the CPU, enabling concurrent execution of application logic during UART, SPI, or ADC transfers. This reduces interrupt overhead and prevents bus contention in multi-peripheral environments. For example, during continuous ADC sampling, DMA can automatically store results into RAM without CPU intervention, freeing cycles for sensor fusion or communication tasks. Efficient DMA channel allocation and burst-mode transfers further enhance throughput—particularly beneficial in data-intensive applications like motor control feedback loops or protocol packet buffering.

Are there any known errata or silicon limitations affecting flash memory programming in the MSP430F5522IRGCT that could impact firmware update reliability?: While no public errata documents are widely cited for this specific revision, general MSP430 flash behavior applies: sectors must be erased before writing, and partial-page writes require full-sector erasure. Power loss during flash operations can corrupt data, necessitating checksums or bootloader recovery mechanisms. Some users report increased programming time at elevated temperatures (>70°C), possibly due to slower electron tunneling in oxide layers. Implementing robust write-protection schemes and validating firmware images post-burnout improves reliability. Always follow TI’s recommended flash routines and avoid modifying code regions during runtime execution.

How should the 64-VQFN (9x9) package of the MSP430F5522IRGCT influence PCB layout decisions, particularly regarding thermal management and signal integrity?: The compact 64-pin VQFN package with an exposed thermal pad requires careful PCB design. Solder the exposed pad to a solid ground plane using multiple vias to improve heat dissipation and electrical connectivity. Signal traces routed beneath the package risk coupling noise into sensitive analog paths; thus, avoid routing high-speed digital lines underneath. Keep analog inputs away from switching regulators or clock lines to prevent cross-talk. Adhering to IPC-7351 land patterns ensures reliable solder joints, and conformal coating may be necessary in humid environments to prevent dendritic growth on fine-pitch pads.

What alternatives exist to the MSP430F5522IRGCT if higher program memory capacity or additional peripherals are required?: Within the MSP430F5xx family, the MSP430F5529IRHAR offers 128KB flash and more USB endpoints, while the MSP430F5515IPMR provides 64KB flash with enhanced LCD support. For greater memory needs beyond 128KB, consider the MSP430FRxx series with FRAM (e.g., MSP430FR5969) or migrate to newer architectures like the MSPM0 series featuring ARM Cortex-M0+ cores. Each alternative trades off power, cost, and development ecosystem familiarity. Selection hinges on balancing memory size, peripheral mix, and real-time constraints—not just raw capacity alone.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430F5522IRGCT

Product Attribute
Part Number	MSP430F5522IRGCR	MSP430F5524IRGCR	MSP430F5522IZQER	MSP430F5522IZXHR
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Core Processor	-	-	-	-
Data Converters	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Number of I/O	-	-	-	-
Peripherals	-	-	-	-
RAM Size	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Core Size	-	-	-	-
Oscillator Type	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
EEPROM Size	-	-	-	-
Connectivity	-	-	-	-
Program Memory Size	-	-	-	-
Speed	-	-	-	-
Program Memory Type	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Series	-	-	-	-

MSP430F5522IRGCT Datasheet PDF

Download MSP430F5522IRGCT pdf datasheets and Texas Instruments documentation for MSP430F5522IRGCT - Texas Instruments.

PCN Design/Specification: CC430Fxx/MSP430F5xx/MSP430F6xx/MSP430Vxx 29/Jan/20.pdf
PCN Other: Multiple Changes 19/Sep/2014.pdf
PCN Assembly/Origin: UTAC site 25/Jan/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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