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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430FR5720IRGER~~

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MSP430FR5720IRGER - Texas Instruments

Name: Texas Instruments MSP430FR5720IRGER
Brand: Texas Instruments
SKU: MSP430FR5720IRGER
Price: 0.875 USD
Availability: InStock
Rating: 5 (6 reviews)

Manufacturer Part Number: MSP430FR5720IRGER

Manufacturer: Texas Instruments

Allelco Part Number: 32D-MSP430FR5720IRGER

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 32,178 pcs available, New & Original

Parts Description: IC MCU 16BIT 4KB FRAM 24VQFN

Package: 24-VQFN (4x4)

Data sheet: MSP430FR5720IRG.pdf

Datasheets
MSP430FR57xx Family User Guide.pdf

Errata
MSP430FR5720 Errata.pdf

HTML Datasheet
MSP430FR573x,2x Datasheet.pdf

PCN Other
2.73KHz.pdf

PCN Assembly/Origin
2.73KHz.pdf

RoHs Status: ROHS3 Compliant

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100+	$0.963	$96.30
500+	$0.902	$451.00
1000+	$0.875	$875.00

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Specifications

MSP430FR5720IRGER Tech Specifications
Texas Instruments - MSP430FR5720IRGER technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430FR5720IRGER

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V
Supplier Device Package	24-VQFN (4x4)
Speed	8MHz
Series	MSP430™ FRAM
RAM Size	1K x 8
Program Memory Type	FRAM
Program Memory Size	4KB (4K x 8)
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT
Package / Case	24-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	17
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 8x10b
Core Size	16-Bit
Core Processor	MSP430 CPUXV2
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART
Base Product Number	MSP430FR5720

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	2 (1 Year)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Parts Introduction

MSP430FR5720IRGER (1)

Manufacturer Part Number

MSP430FR5720IRGER

Manufacturer

Texas Instruments

Introduction

The MSP430FR5720IRGER is a low-power 16-bit microcontroller from the MSP430™ FRAM series, tailored for efficient handling and processing capabilities within embedded systems.

Product Features and Performance

Core Processor: MSP430 CPUXV2, 16-Bit

Speed: 8MHz

Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART

Peripherals: Brown-out Detect/Reset, POR, PWM, WDT

Program Memory Size: 4KB (FRAM)

RAM Size: 1K x 8

Data Converters: A/D 8x10b

Oscillator Type: Internal

Product Advantages

Ultra-low power consumption

FRAM enables faster writing speeds and higher endurance than flash

Extensive communication support for versatile interfacing

Small form factor with 24-VQFN packaging

MSP430FR5720IRGER (2)

Key Technical Parameters

RAM: 1K x 8

Program Memory: 4KB (FRAM)

Voltage Supply: 2V ~ 3.6V

Operating Temperature: -40°C ~ 85°C

Number of I/O: 17

Quality and Safety Features

Built-in Brown-out Detect/Reset for system reliability

Power-on Reset (POR) function safeguards initialization process

Compatibility

Works seamlessly with other components in the MSP430 series

Supports multiple communication protocols for system integration

Application Areas

Industrial automation

Consumer electronics

Power management systems

Sensors and instrumentation

Product Lifecycle

Currently active with no announced discontinuation

Replacement or upgrade options available as technology progresses

Several Key Reasons to Choose This Product

High reliability and extended operational lifespan with FRAM technology

Ideal for power-sensitive applications due to low power requirements

Robust peripheral set and multi-protocol connectivity enhance versatility

Small package size suitable for compact designs

Suitable for a wide temperature range making it adaptable for harsh environments

Frequently Asked Questions(FAQ)

What are the key performance characteristics of the MSP430FR5720IRGER microcontroller, particularly regarding its memory architecture and power efficiency in embedded applications?: The MSP430FR5720IRGER integrates 4KB of ferroelectric RAM (FRAM) as program memory, offering near-infinite endurance and fast write speeds compared to traditional flash. It operates at an 8MHz clock with a core voltage range of 2V to 3.6V, supporting ultra-low-power operation typical of the MSP430 family. With 1K x 8 bytes of RAM and integrated peripherals such as I2C, SPI, UART, and an 8-channel 10-bit ADC, it is optimized for battery-powered or energy-constrained embedded systems requiring reliable non-volatile data storage without write fatigue concerns.

How does the MSP430FR5720IRGER compare to standard flash-based MSP430 microcontrollers like the MSP430G2553 in terms of write endurance and real-time data logging applications?: Unlike the MSP430G2553, which uses conventional flash memory limited to approximately 10,000 erase/write cycles, the MSP430FR5720IRGER leverages FRAM technology with virtually unlimited write endurance—typically exceeding 10^14 cycles. This makes the FR5720 significantly more suitable for continuous data logging or configuration updates where frequent writes occur, reducing system complexity by eliminating external EEPROMs and improving reliability in harsh operating conditions up to 85°C.

What are the thermal and electrical limitations when deploying the MSP430FR5720IRGER in industrial control environments with high ambient temperatures?: The MSP430FR5720IRGER is rated for operation from -40°C to 85°C, making it suitable for many industrial applications but not extreme environments beyond this range. Electrically, it requires stable supply voltages between 2V and 3.6V; deviations can lead to unreliable operation or reset events. Careful layout and decoupling are necessary to maintain signal integrity on its 17 GPIO pins, especially when interfacing with sensors or communication buses like LIN or IrDA in electrically noisy settings.

Can the MSP430FR5720IRGER support real-time clock (RTC) functionality, and what design considerations apply if implementing one using its internal peripherals?: While the MSP430FR5720IRGER does not include a dedicated RTC module, it can implement software-based timing using Timer_A with ACLK sourced from the internal 32kHz oscillator or an external crystal. Given the limited RAM (1KB), efficient ISR design is critical to avoid stack overflow. Developers must account for clock drift over temperature and validate timing accuracy against application requirements, particularly in time-stamped data acquisition tasks.

What packaging options are available for the MSP430FR5720IRGER, and how do they influence PCB footprint and thermal management in compact designs?: The MSP430FR5720IRGER is offered in a 24-pin VQFN package measuring 4x4 mm with an exposed pad for enhanced heat dissipation. This compact form factor enables high component density in space-constrained designs but demands proper soldering practices and thermal vias under the pad during PCB assembly. The MSL 2 classification indicates shelf life of one year after opening moisture barrier, necessitating controlled storage and handling per JEDEC standards.

How does the MSP430FR5720IRGER handle brown-out detection and power-on reset, and what role do these features play in robust system initialization?: The device includes both brown-out detect (BOD) and power-on reset (POR) circuitry that monitors Vcc within the 2–3.6V range. If voltage drops below programmable thresholds (e.g., 2.7V or 2.2V depending on configuration), BOD triggers a reset to prevent erratic behavior. Combined with watchdog timer support, this ensures deterministic startup sequences even during transient power dips, enhancing system reliability in battery-powered or unstable supply scenarios common in field-deployed devices.

What communication protocols does the MSP430FR5720IRGER natively support, and how might one choose between SPI and UART for sensor integration in a multi-node network?: The MSP430FR5720IRGER supports multiple interfaces including SPI, UART/USART, I2C, SCI, LINbus, and IrDA. For short-distance, high-speed sensor readout, SPI offers full-duplex communication with minimal pin count. In contrast, UART simplifies point-to-point links and is ideal for asynchronous serial protocols like MODBUS or custom command structures. Selection depends on distance, noise environment, and whether handshaking or flow control is needed—SPI excels in dense sensor arrays, while UART suits isolated peripheral connections.

Is it feasible to use the MSP430FR5720IRGER for firmware updates over-the-air (OTA), and what memory constraints should be considered?: Yes, OTA updates are possible due to FRAM’s high write endurance, allowing frequent firmware patches. However, only 4KB of program memory is available, limiting update payloads and requiring delta-firmware techniques or compressed binary formats. Additionally, the 1KB RAM restricts buffering capacity during transmission, so developers must implement efficient parsing algorithms and ensure atomic updates to prevent corruption—critical when using bootloader frameworks like TI’s Flash Bootloader.

How does the internal oscillator of the MSP430FR5720IRGER perform across temperature variations, and what impact does this have on timing-critical applications?: The internal DCO (digitally controlled oscillator) runs at 8MHz nominal frequency but exhibits ±2% variation over temperature and voltage. While sufficient for most embedded tasks, this variability may affect precise baud rate generation in UART or PWM output accuracy. For stricter timing needs (e.g., motor control), an external crystal provides better stability (±10 ppm typical), though at added cost and board area—a trade-off that must be evaluated based on system requirements versus power budget.

What development tools and programming environments are recommended for prototyping and debugging the MSP430FR5720IRGER in production-ready workflows?: Texas Instruments recommends Code Composer Studio (CCS) with MSP430Ware libraries and eZ-FET Lite or LaunchPad platforms for rapid prototyping. These tools provide cycle-accurate simulation, FRAM-aware debugging, and automated register configuration. Since the device lacks on-chip emulation resources like JTAG debug memory, boundary scan (via Spy-Bi-Wire) becomes essential for production testing, ensuring traceability and compliance with manufacturing inspection protocols.

Can the MSP430FR5720IRGER interface directly with analog sensors requiring 12-bit resolution, and how would you mitigate quantization errors in such configurations?: No, the device only includes an 8-channel 10-bit SAR ADC, limiting native sensor resolution to 10 bits. For higher precision, external 12-bit ADCs (e.g., ADS7881) can be connected via SPI, trading speed for accuracy. Alternatively, oversampling and averaging techniques can improve effective resolution by 1–2 bits, though noise floor and sampling rate become design constraints. Always verify signal integrity on analog inputs given the tight supply ripple tolerance of the internal reference.

What are the implications of the MSP430FR5720IRGER’s RoHS3 compliance and REACH status for global product certification and supply chain logistics?: The MSP430FR5720IRGER meets RoHS3 directives, excluding hazardous substances like lead, mercury, and cadmium above specified limits, facilitating CE marking in Europe. Its REACH unaffected status confirms absence of SVHCs (Substances of Very High Concern), simplifying export documentation and reducing audit burden. These attributes lower regulatory risk for OEMs targeting international markets but do not eliminate need for end-product compliance verification, especially in automotive or medical sectors with stricter material requirements.

How should PCB layout best practices be applied when routing signals associated with the MSP430FR5720IRGER to minimize electromagnetic interference and ensure reliable operation?: Critical traces—especially clock lines, reset, and high-speed digital buses—should be kept short and away from noisy components. Use ground planes beneath the 24-VQFN package to reduce impedance and thermal resistance. Decouple Vcc with 100nF ceramic capacitors close to each power pin. Avoid running signal lines parallel to power rails to prevent crosstalk. The exposed pad must connect to a solid ground pour with multiple vias to chassis or plane for EMI reduction and heat sinking in thermally demanding layouts.

What is the significance of the Moisture Sensitivity Level (MSL) rating for the MSP430FR5720IRGER, and how does it affect assembly scheduling and failure prevention?: Classified as MSL 2 (Level 2a), the MSP430FR5720IRGER is sensitive to moisture absorption and must be assembled within 1 year after opening the dry pack. Exceeding this window risks popcorning during reflow, leading to delamination or solder joint defects. Manufacturers must follow IPC/JEDEC J-STD-033 guidelines: bake before use if stored >30°C/60% RH for >12 weeks, and use humidity indicator cards in packaging. Proper handling ensures yield and long-term reliability in mass production.

How does the limited program memory size of the MSP430FR5720IRGER influence code structure decisions, and what optimization strategies are effective for constrained environments?: With only 4KB of FRAM, firmware must be highly optimized—avoid large lookup tables, dynamic allocations, or recursive functions. Use compiler flags for size optimization (-Os in GCC) and leverage constant folding. Split code into modular units with shared libraries where possible. Since FRAM writes are fast but still consume energy, minimize flash writes by caching frequently updated variables in RAM or leveraging FRAM’s byte-write capability intelligently, reducing wear and power consumption simultaneously.

Can the MSP430FR5720IRGER support wireless communication modules like Bluetooth Low Energy (BLE), and what architectural challenges arise from its resource constraints?: Direct BLE integration is impractical due to lack of hardware support and severe memory limitations. Instead, external BLE modules (e.g., CC2640R2F) communicate via UART or SPI, offloading protocol stacks to dedicated chips. This hybrid approach increases latency and power usage but leverages the FR5720’s strengths in local sensing and actuation. Firmware must manage context switching efficiently to avoid missing interrupts, and buffer sizes must be tightly managed given only 1KB RAM.

What role does the watchdog timer play in the MSP430FR5720IRGER’s fault-tolerant design, and how should it be configured to balance responsiveness and false-trigger avoidance?: The watchdog timer (WDT) resets the MCU if software hangs or fails to clear it periodically. Configured via WDTCTL register, it can operate with ACLK (32kHz) for low-power monitoring or SMCLK for faster response. To avoid false resets, ensure ISRs complete within expected timeframes and disable WDT during critical sections using the password-protected register mechanism. Periodic clearing should align with main loop milestones, not arbitrary delays, to reflect actual task progress accurately.

How does the choice between Cut Tape and Digi-Reel packaging affect procurement strategy and assembly line compatibility for the MSP430FR5720IRGER in volume manufacturing?: Cut Tape (CT) suits small-scale prototyping or low-volume builds where reel unwinding isn’t practical. Digi-Reel® format enables automated pick-and-place machines, improving throughput and reducing handling errors in high-volume production. Suppliers typically bundle CT for samples and Digi-Reel for commercial orders. Procurement teams must confirm feeder compatibility (7" or 13" reels) and coordinate with assemblers to avoid manual placement bottlenecks, especially for tight-pitch QFN packages requiring precise alignment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430FR5720IRGER

Product Attribute
Part Number	MSP430FR5722IRGER	MSP430FR5043IRGCR	MSP430FR50431IRGCR	MSP430FR5720IPWR
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Program Memory Type	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Program Memory Size	-	-	-	-
RAM Size	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Oscillator Type	-	-	-	-
Speed	-	-	-	-
Peripherals	-	-	-	-
Core Processor	-	-	-	-
Core Size	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Connectivity	-	-	-	-
Series	-	-	-	-
EEPROM Size	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Data Converters	-	-	-	-
Number of I/O	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Voltage - Supply (Vcc/Vdd)	-	-	-	-

MSP430FR5720IRGER Datasheet PDF

Download MSP430FR5720IRGER pdf datasheets and Texas Instruments documentation for MSP430FR5720IRGER - Texas Instruments.

Datasheets: MSP430FR57xx Family User Guide.pdf
Errata: MSP430FR5720 Errata.pdf
HTML Datasheet: MSP430FR573x,2x Datasheet.pdf
PCN Other: 2.73KHz.pdf
PCN Assembly/Origin: 2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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