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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MSP430G2453IRHB32T~~

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MSP430G2453IRHB32T - Texas Instruments

Name: Texas Instruments MSP430G2453IRHB32T
Brand: Texas Instruments
SKU: MSP430G2453IRHB32T
Price: 1.744 USD
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: MSP430G2453IRHB32T

Manufacturer: Texas Instruments

Allelco Part Number: 32D-MSP430G2453IRHB32T

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 19,425 pcs available, New & Original

Parts Description: IC MCU 16BIT 8KB FLASH 32VQFN

Package: 32-VQFN (5x5)

Data sheet: MSP430G2453IRHB.pdf

PCN Assembly/Origin
Assembly/Test Site Revision A 15/Jan/2015.pdf

PCN Design/Specification
Material Set 30/Aug/2016.pdf

HTML Datasheet
MSP430G2x53,x13 Datasheet.pdf

RoHs Status: ROHS3 Compliant

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Specifications

MSP430G2453IRHB32T Tech Specifications
Texas Instruments - MSP430G2453IRHB32T technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430G2453IRHB32T

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V
Supplier Device Package	32-VQFN (5x5)
Speed	16MHz
Series	MSP430G2xx
RAM Size	512 x 8
Program Memory Type	FLASH
Program Memory Size	8KB (8K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	32-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	24
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 8x10b
Core Size	16-Bit
Core Processor	MSP430 CPU16
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART
Base Product Number	MSP430G2453

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	2 (1 Year)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001

Parts Introduction

MSP430G2453IRHB32T (1)

Manufacturer Part Number

MSP430G2453IRHB32T

Manufacturer

Texas Instruments

Introduction

The MSP430G2453IRHB32T is an embedded microcontroller from Texas Instruments designed for low-power and high-performance applications in the MSP430G2xx series.

Product Features and Performance

Core Processor: MSP430 CPU16, 16-Bit

Operating Speed: 16MHz

Connectivity Options: I2C, IrDA, LINbus, SCI, SPI, UART/USART

Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT

Program Memory: 8KB FLASH

RAM: 512 Bytes

Data Converters: 8 channels of 10-bit ADC

Oscillator Type: Internal

Number of I/O Ports: 24

Product Advantages

Low power consumption suited for battery-operated applications

Rich set of connectivity and peripheral options for versatile use

Adequate program memory and RAM for complex operations

Key Technical Parameters

Core Size: 16-Bit

Speed: 16MHz

Supply Voltage: 1.8V to 3.6V

Operating Temperature: -40°C to 85°C

Mounting Type: Surface Mount

Package: 32-VQFN (5x5)

Quality and Safety Features

Integrated brown-out detect/reset maintains system integrity during voltage dips.

Watchdog timer to prevent system hang-ups or crashes.

Compatibility

Compatible with multiple communication protocol standards including I2C, SPI, and UART.

Application Areas

Consumer Electronics

Sensing and Instrumentation

Wireless Monitoring

Home and Building Automation

Product Lifecycle

Currently active with no announced discontinuation and supported by ongoing updates and replacements.

Several Key Reasons to Choose This Product

Extremely low power consumption extends battery life.

High integration of features reduces the need for additional components.

Robust temperature range suitable for diverse environments and applications.

Compact surface mount package facilitates miniaturized designs.

Extensive support and resources from Texas Instruments.

Frequently Asked Questions(FAQ)

How does the MSP430G2453IRHB32T handle brown-out conditions, and what design considerations should I account for when operating near the lower Vcc limit of 1.8V?: The MSP430G2453IRHB32T integrates a built-in brown-out detect/reset (BOR) circuit that monitors Vcc and holds the device in reset if the supply voltage drops below a threshold typically around 1.75V. This prevents erratic behavior during power-up or transient dips. However, near the 1.8V lower operating limit, noise margins shrink significantly—especially when driving external loads or using high-speed peripherals. Engineers should ensure clean power delivery with local decoupling (e.g., 100nF ceramic capacitor close to VDD pins) and avoid simultaneous switching of multiple I/Os that could induce supply sag below the BOR threshold.

What are the real-world implications of the 512 x 8 bytes RAM size in the MSP430G2453IRHB32T for embedded firmware development?: With only 512 bytes of RAM, the MSP430G2453IRHB32T demands careful memory management. Stack depth must be tightly controlled—deep function call nesting or large local arrays can easily exhaust available RAM. Dynamic allocation is generally discouraged; static or pool-based allocation is preferred. For applications involving communication buffers (e.g., UART or SPI), buffer sizes should be minimized and often limited to single-digit bytes unless data is immediately processed and discarded. This constraint favors event-driven, interrupt-based architectures over polling loops with large state buffers.

Can the MSP430G2453IRHB32T reliably support I2C communication at 400kHz with its internal oscillator, and what calibration steps are recommended?: Yes, the MSP430G2453IRHB32T can support 400kHz I2C using its internal digitally controlled oscillator (DCO), but accuracy depends on calibration. The uncalibrated DCO may drift ±10% over temperature and voltage, risking timing violations. TI provides factory-calibrated DCO values in flash information memory (address 0x10F0–0x10FF); using these values at startup ensures better initial accuracy. For critical applications, consider periodic recalibration via the REF module or external reference, or validate timing margins under worst-case conditions (e.g., -40°C, 1.8V).

How does the absence of integrated EEPROM in the MSP430G2453IRHB32T affect non-volatile data storage strategies?: Since the MSP430G2453IRHB32T lacks dedicated EEPROM, non-volatile data must be stored in its 8KB flash memory. Flash endurance is typically 10,000 write/erase cycles per segment, so frequent updates (e.g., logging) require wear-leveling algorithms or buffering in RAM with batch writes. Additionally, flash writes require sector erasure (512-byte segments), meaning partial updates aren’t atomic—power loss during write can corrupt data. Designers often reserve a dedicated flash segment for configuration data and implement checksums or dual-bank schemes to mitigate corruption risks.

What thermal and layout considerations apply when using the 32-VQFN (5x5) package of the MSP430G2453IRHB32T in high-density PCB designs?: The 32-VQFN package with an exposed thermal pad requires proper thermal and electrical grounding. The pad must be soldered to a grounded copper pour on the PCB to ensure reliable operation and meet MSL 2 handling requirements. Without adequate thermal relief, junction temperature may rise under sustained high I/O activity or elevated ambient temperatures, potentially pushing the device beyond its -40°C to 85°C operating range. Use multiple vias under the pad to conduct heat to inner or bottom layers, and maintain 0.2mm clearance around perimeter pads to prevent solder bridging during reflow.

How does the MSP430G2453IRHB32T compare to the MSP430G2553 in terms of peripheral availability and code portability for low-power sensor applications?: The MSP430G2453IRHB32T offers 8KB flash and 512B RAM versus the G2553’s 16KB/512B, making the latter better suited for larger firmware or protocol stacks. Both share the same core peripherals (UART, SPI, I2C, ADC), but the G2553 includes a comparator module absent in the G2453. Code portability is high due to identical instruction sets and register maps, but memory constraints on the G2453 may require code optimization or feature reduction. For simple sensor nodes with modest logic, the G2453 provides cost and space savings; for complex state machines or over-the-air updates, the G2553 is more future-proof.

Is the 10-bit ADC in the MSP430G2453IRHB32T sufficient for precision temperature sensing using an external thermistor, and what reference strategy optimizes accuracy?: The 8-channel, 10-bit ADC in the MSP430G2453IRHB32T provides ~3.5mV resolution at 3.3V reference, which is adequate for basic thermistor-based temperature monitoring (±1–2°C accuracy with proper calibration). However, using the internal 2.5V reference (if available via REF module) improves SNR and reduces supply noise sensitivity. Always enable ADC settling time after reference switching and use oversampling (e.g., 4x) to reduce quantization noise. For higher precision, consider ratiometric measurement with a precision reference resistor and compensate for self-heating via duty-cycled excitation.

What DMA capabilities does the MSP430G2453IRHB32T offer, and how can they be leveraged to reduce CPU load during multi-channel ADC sampling?: The MSP430G2453IRHB32T includes a single-channel DMA controller that can transfer ADC results directly to RAM without CPU intervention. This is particularly useful for capturing sequences from multiple ADC inputs (e.g., sensor arrays) at regular intervals. By configuring the DMA to trigger on ADC completion, the CPU can remain in low-power mode (LPM3) between samples, significantly reducing active duty cycle. Ensure the destination buffer is word-aligned and sized to match the sample count, and use double-buffering if continuous streaming is required to avoid data overwrite during processing.

How should I configure the watchdog timer (WDT) in the MSP430G2453IRHB32T for a battery-powered application requiring long sleep intervals?: In battery-powered designs, the WDT in the MSP430G2453IRHB32T can be configured as an interval timer using ACLK (typically sourced from a 32kHz crystal or internal VLO). Setting WDT to interval mode with a 1-second period allows periodic wake-up from LPM3 for housekeeping tasks while minimizing current draw (~1µA with VLO). Avoid using SMCLK or MCLK as the WDT source during sleep, as they remain active and increase power consumption. Always clear the WDT counter before entering deep sleep to prevent unintended resets.

What are the trade-offs between using the internal oscillator versus an external crystal with the MSP430G2453IRHB32T in timing-critical LINbus applications?: The internal oscillator in the MSP430G2453IRHB32T simplifies design and reduces BOM cost but introduces ±2% frequency tolerance, which may violate LIN 2.0 timing requirements (±1.5% for slave nodes). An external 16MHz crystal improves accuracy to ±50ppm but adds component cost, board space, and startup delay. For master nodes or non-critical LIN implementations, the internal oscillator suffices with careful baud rate calibration. For slave nodes requiring precise synchronization, an external crystal or resonator is recommended to ensure reliable header detection and bit timing compliance.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments MSP430G2453IRHB32T

Product Attribute
Part Number	MSP430G2513IRHB32T	MSP430G2513IRHB32R	MSP430G2453IN20	MSP430G2453IPW20
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Program Memory Type	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Connectivity	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Program Memory Size	-	-	-	-
EEPROM Size	-	-	-	-
Speed	-	-	-	-
Data Converters	-	-	-	-
Core Size	-	-	-	-
RAM Size	-	-	-	-
Oscillator Type	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Peripherals	-	-	-	-
Core Processor	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of I/O	-	-	-	-

MSP430G2453IRHB32T Datasheet PDF

Download MSP430G2453IRHB32T pdf datasheets and Texas Instruments documentation for MSP430G2453IRHB32T - Texas Instruments.

PCN Assembly/Origin: Assembly/Test Site Revision A 15/Jan/2015.pdf
PCN Design/Specification: Material Set 30/Aug/2016.pdf
HTML Datasheet: MSP430G2x53,x13 Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
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1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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