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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138BZWTA3
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OMAPL138BZWTA3 - Texas Instruments

Manufacturer Part Number
OMAPL138BZWTA3
Manufacturer
Texas Instruments
Allelco Part Number
32D-OMAPL138BZWTA3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,710 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 375MHZ 361NFBGA
Package
361-NFBGA (16x16)
Data sheet
OMAPL138BZWTA3.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 15710

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Specifications

OMAPL138BZWTA3 Tech Specifications
Texas Instruments - OMAPL138BZWTA3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138BZWTA3

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (16x16)
Speed 375MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers SDRAM
Package / Case 361-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 105°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL138
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

OMAPL138BZWTA3 Image
OMAPL138BZWTA3 (1)

Manufacturer Part Number

OMAPL138BZWTA3

Manufacturer

Texas Instruments

Introduction

The OMAPL138BZWTA3 is a high-performance application processor based on ARM926EJ-S core, designed for embedded microprocessor applications.

Product Features and Performance

ARM926EJ-S Core Processor

32-Bit Single Core

Operating speed of 375MHz

Integrated C674x DSP for Signal Processing

System Control Co-Processor CP15

Supports SDRAM memory interfaces

Product Advantages

Integrated DSP enhances signal processing for multimedia and audio applications

Flexible SDRAM memory interface for various memory needs

Robust connectivity options including Ethernet, SATA, USB

Operates at industrial temperature ranges, making it suitable for harsh environments

Key Technical Parameters

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 375MHz

Co-Processors/DSP: C674x, CP15

RAM Controllers: SDRAM

Ethernet: 10/100Mbps

SATA: SATA 3Gbps

USB: USB 1.1 + PHY, USB 2.0 + PHY

Voltage I/O: 1.8V, 3.3V

Operating Temperature: -40°C ~ 105°C (TJ)

Package / Case: 361-LFBGA

Quality and Safety Features

Boot security and cryptographic features for secure operation

Compatibility

Interfacing with various peripherals through HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

Application Areas

Suitable for embedded applications in multimedia, automotive, industrial control, and telecommunications

Product Lifecycle

Status: Obsolete

Replacement or upgrade options may vary; contact Texas Instruments for more information

Key Reasons to Choose This Product

Optimal balance between processing power and energy efficiency

High integration to minimize external components and reduce system costs

Flexible I/O voltage capability accommodating a wide range of peripheral devices

Industrial operating temperature range suitable for harsh environment applications

Texas Instruments reliability and support for embedded processors

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the OMAPL138BZWTA3 for a power-constrained embedded system requiring real-time signal processing?
The OMAPL138BZWTA3 integrates an ARM926EJ-S core clocked at 375MHz alongside a C674x DSP, enabling efficient dual-processing of control and signal-intensive tasks. However, this integration increases dynamic power consumption compared to standalone microcontrollers, particularly during concurrent execution on both the ARM and DSP cores. Designers must account for peak current draw under full load—typically exceeding 200mA at 1.8V I/O—and ensure adequate thermal dissipation given the compact 361-NFBGA package. While the device supports dynamic voltage scaling via CP15 coprocessor controls, aggressive clock gating is limited by shared memory controllers and peripherals like McASP or McBSP that may remain active even during low-duty-cycle operations.
How does the OMAPL138BZWTA3 compare to newer AM3x or AM43 series processors in terms of peripheral integration and development complexity?
Unlike TI’s Cortex-A8/A9-based AM3x devices, the OMAPL138BZWTA3 lacks hardware accelerators such as IVA-HD for video encoding/decoding and uses only USB 1.1/2.0 interfaces without native support for high-speed protocols like PCIe or Gigabit Ethernet. Its peripheral set—centered around legacy interfaces like HPI, MMC/SD, and UART—is less suitable for modern IoT gateways but remains effective for industrial automation with moderate data throughput. Development tooling is more mature due to its longer lifecycle, but debugging capabilities are constrained by the ARM9 architecture’s limited trace support compared to ARM Cortex-A series with ETM or CoreSight. For applications requiring Linux BSPs or complex driver stacks, migration to AM43 would reduce porting effort significantly.
What are the implications of the OMAPL138BZWTA3’s -40°C to +105°C operating temperature range for automotive or industrial deployment?
The extended junction temperature rating up to 105°C allows reliable operation in harsh environments common to industrial controls and transportation systems. However, PCB layout must minimize thermal resistance from the die to ambient air, especially since the 361-NFBGA lacks exposed thermal pads. Without direct heat sinking, sustained CPU utilization above 70% can push die temperatures beyond safe thresholds during prolonged operation near 85°C ambient. Additionally, solder joint reliability under thermal cycling must be validated using accelerated life testing models such as Coffin-Manson, considering the package’s fine-pitch ball grid array (16x16 mm) geometry and typical reflow profiles used in surface-mount assembly.
Can the OMAPL138BZWTA3 directly interface with DDR2 SDRAM, and what timing considerations apply when designing its memory subsystem?
Yes, the OMAPL138BZWTA3 includes integrated SDRAM memory controllers compatible with DDR2-667 or lower speeds. However, achieving stable operation requires careful attention to trace length matching (<5mm skew between DQS and DQ signals), termination strategies (ODT resistors often necessary at board edges), and power supply decoupling (>10μF bulk capacitance near VDD_CORE). Timing closure becomes challenging beyond 400MHz equivalent bus frequency due to internal routing delays and lack of programmable DLLs; thus, most designs target 300–400 MHz effective memory bandwidth. Failure to adhere to these constraints results in intermittent data corruption or boot failures during initialization sequences.
Is it feasible to run Linux on the OMAPL138BZWTA3, and what are the main limitations compared to ARM Cortex-A platforms?
Official support for mainline Linux kernels is limited after kernel 3.14 due to deprecated device tree bindings and lack of upstream maintenance for the ARM926EJ-S MMU implementation. Most functional builds rely on older patches from TI’s Processor SDK, which include a custom uClinux variant lacking full POSIX threading support. Real-time performance is also inferior to Cortex-A8/A9 equivalents because the ARM9 lacks out-of-order execution and has higher context-switch overhead (~15μs vs ~2μs on A8). While basic networking and filesystem operations function, complex applications demanding preemptive scheduling or high-resolution timers should consider real-time extensions or migrate to a more capable SoC.
What security features does the OMAPL138BZWTA3 provide, and how do they impact secure boot implementations?
The OMAPL138BZWTA3 implements hardware-based boot security through ROM code that verifies digital signatures of the first-stage loader using RSA-2048 or ECC algorithms. This prevents unauthorized firmware execution but requires careful management of cryptographic keys stored in one-time-programmable fuses. Unlike modern TrustZone-enabled devices, there is no isolated execution environment; thus, software-level isolation must be enforced through hypervisor-like partitioning or trusted OS modules running on the DSP side. Cryptographic acceleration is minimal—SHA-1 and AES are handled by software libraries unless leveraging the optional crypto co-processor block, which adds latency for large payloads. Secure updates over-the-air (OTA) are possible but demand robust rollback protection mechanisms due to flash wear-leveling constraints.
How does the absence of GPU acceleration affect graphics rendering on the OMAPL138BZWTA3 when driving LCD displays?
The OMAPL138BZWTA3 includes an LCD controller capable of driving up to 1024x768 resolution at 60Hz via RGB or parallel interface, but all pixel data must be generated by the ARM or DSP cores. Rendering complex UIs with gradients, animations, or video overlays places significant CPU/DSP load, reducing available resources for background tasks. Frame rates below 30fps become impractical for smooth scrolling text or touch feedback, necessitating frame buffering and double-scanning techniques. In contrast, Cortex-A series parts offload display duties to dedicated GPUs, freeing general-purpose processors for application logic. For simple alphanumeric displays or static bitmaps, the LCD controller remains adequate, but richer GUIs require external display drivers or FPGA-based pixel engines.
What is the expected lifetime and obsolescence risk associated with the OMAPL138BZWTA3 in long-term product design?
As part of TI’s discontinued OMAP-L1x family, the OMAPL138BZWTA3 is not recommended for new designs requiring >10-year lifecycle support. While some distributors maintain limited inventory, lead times exceed 26 weeks during shortages, and pricing fluctuates unpredictably. Substitute models like the OMAPL138EZWTA3 offer minor enhancements (e.g., improved yield or alternate packaging) but share identical architectural constraints. End-of-life announcements typically precede actual stock depletion by 12–18 months, leaving insufficient time for qualification of alternative components. For mission-critical systems, evaluating newer families such as Sitara AM2x or AM4x provides better continuity, albeit with increased pin count and power requirements.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138BZWTA3

Product Attribute OMAPL138BZWTA3E OMAPL138BZWTA3R OMAPL138BZWT3 OMAPL138BZWTA4
Part Number OMAPL138BZWTA3E OMAPL138BZWTA3R OMAPL138BZWT3 OMAPL138BZWTA4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Series - - - -
Display & Interface Controllers - - - -
Voltage - I/O - - - -
RAM Controllers - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
USB - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Graphics Acceleration - - - -
Speed - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Security Features - - - -
Ethernet - - - -
Number of Cores/Bus Width - - - -
Co-Processors/DSP - - - -
Core Processor - - - -
SATA - - - -
Additional Interfaces - - - -

OMAPL138BZWTA3 Datasheet PDF

Download OMAPL138BZWTA3 pdf datasheets and Texas Instruments documentation for OMAPL138BZWTA3 - Texas Instruments.

PCN Obsolescence/ EOL
Freon/Netra/SubArtic EOL 06/Oct/2015.pdf Freon/Netra/SubArtic EOL Update 4/Nov/2015.pdf
PCN Design/Specification
Hybrid Au/Cu Wire Bond Flow 08/Apr/2014.pdf Multiple Changes Revision B 23/Jun/2014.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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OMAPL138BZWTA3 Image

OMAPL138BZWTA3

Texas Instruments
32D-OMAPL138BZWTA3

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