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Home Products Integrated Circuits (ICs)Specialized ICs~~MSP430F167IRTDT~~

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MSP430F167IRTDT - Texas Instruments

Name: Texas Instruments MSP430F167IRTDT
Brand: Texas Instruments
SKU: MSP430F167IRTDT
Price: 9.87 USD
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: MSP430F167IRTDT

Manufacturer: Texas Instruments

Allelco Part Number: 41D-MSP430F167IRTDT

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 16,660 pcs available, New & Original

Parts Description: VQFN-64(9x9)

Data sheet: -

Category: Integrated Circuits (ICs) > Specialized ICs

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In stock: 16660

Unit Price: $11.98
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Quantity	Unit Price	Ext. Price
1+	$11.98	$11.98
10+	$11.48	$114.80
30+	$10.62	$318.60
100+	$9.87	$987.00

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MSP430F167IRTDT Tech Specifications
Texas Instruments - MSP430F167IRTDT technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - MSP430F167IRTDT

Product Attribute	Attribute Value
Part Number	MSP430F167IRTDT
Package	VQFN-64(9x9)
Description	VQFN-64(9x9)
Stock Condition	Get 16660 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Parts Introduction

Manufacturer Part Number

MSP430F167IRTDT

Manufacturer

Texas Instruments

Introduction

The MSP430F167IRTDT is a high-performance, low-power embedded microcontroller from Texas Instruments' MSP430x1xx series. This 16-bit MCU offers a range of advanced features and peripherals, making it suitable for a wide variety of applications requiring efficient power management and robust performance.

Product Features and Performance

16-bit MSP430 CPU core running at up to 8MHz

32KB of Flash program memory and 1KB of RAM

Comprehensive communication interfaces including I2C, SPI, and UART/USART

Integrated peripherals such as Brown-out Detect/Reset, DMA, POR, PWM, and WDT

48 I/O pins for flexible interfacing

8-channel 12-bit ADC and 2-channel 12-bit DAC

Product Advantages

Extremely low-power consumption for extended battery life

Robust and reliable performance in various operating conditions

Flexible peripheral set for diverse application requirements

Ease of integration and development using the MSP430 ecosystem

Key Reasons to Choose This Product

Industry-leading low-power capabilities for battery-powered applications

Comprehensive communication and peripheral support for versatile designs

Proven reliability and performance of the MSP430 architecture

Scalable and cost-effective solution for embedded systems

Quality and Safety Features

Extended operating temperature range of -40°C to 85°C

Surface-mount VQFN package with exposed pad for improved thermal performance

Stringent quality control and testing procedures from Texas Instruments

Compatibility

The MSP430F167IRTDT is compatible with other MCUs in the MSP430x1xx series, allowing for easy migration and scalability across projects.

Application Areas

Portable and battery-powered devices

Industrial control and automation systems

Sensor-based applications

Wireless and IoT solutions

Medical and healthcare equipment

Product Lifecycle

The MSP430F167IRTDT is an active product in our website's sales team's portfolio. While equivalent or alternative models may be available, customers are advised to contact our website's sales team for the most up-to-date information on product availability and recommended options.

Frequently Asked Questions(FAQ)

How does the MSP430F167IRTDT compare to other 16-bit microcontrollers in terms of power efficiency and peripheral integration for battery-powered industrial sensor nodes?: The MSP430F167IRTDT achieves ultra-low power operation through its MSP430 CPU16 architecture, enabling active mode current consumption as low as 270 µA/MHz at 8MHz with Vcc = 3V, which is critical for extending battery life in industrial applications. With integrated peripherals including 8-channel 12-bit ADC, 2-channel 12-bit DAC, DMA controller, and multiple low-power modes (LPM3 consuming ~1 µA), it eliminates the need for external components in many sensor node designs. This level of integration reduces system complexity compared to discrete solutions while maintaining the flexibility to handle analog front-ends, digital communication, and real-time control tasks within a single 9x9mm VQFN package.

What are the key limitations of the MSP430F167IRTDT when interfacing with high-speed serial protocols like USB or Ethernet, and how can designers work around these constraints?: The MSP430F167IRTDT lacks native USB or Ethernet support, limiting direct connectivity to modern high-speed interfaces. Its UART/USART module operates at a maximum baud rate determined by the 8MHz clock divider, typically up to 1.5 Mbps under ideal conditions—insufficient for full-speed USB or Gigabit Ethernet. Designers must implement protocol conversion using external transceivers or bridge ICs such as FTDI FT232H for USB-to-UART bridging, or leverage the SPI/I2C peripherals to connect to dedicated MAC/PHY chips. For time-critical applications requiring deterministic timing, software bit-banging on GPIO pins may be used but increases CPU load and reduces available resources.

Can the MSP430F167IRTDT reliably operate in automotive environments, and what design considerations are necessary given its specified operating temperature range?: While the MSP430F167IRTDT is rated for -40°C to 85°C (TA), this commercial temperature grade is insufficient for most automotive applications that require AEC-Q100 qualification and extended thermal ranges up to 125°C. However, it can be used in non-critical automotive subsystems where ambient temperatures remain below 85°C. If deployment near engine bays or exhaust components is anticipated, additional thermal management such as heat spreaders or forced airflow becomes essential. Designers should also verify long-term reliability through accelerated aging tests, as the internal flash memory endurance is rated for 10,000 write cycles—a limitation that may affect firmware update frequency in mission-critical systems.

How much flash memory overhead should be allocated for bootloader development on the MSP430F167IRTDT, and what factors influence this allocation?: The MSP430F167IRTDT contains 32KB of flash memory organized as 32K x 8 bits plus an additional 256B reserved for calibration data and configuration settings. Bootloaders typically consume between 2–4KB depending on complexity, communication protocol (e.g., UART vs. I2C), and security features. Given the limited address space, developers must carefully manage vector table relocation, interrupt service routine placement, and ensure alignment with flash memory sectors (usually 512-byte blocks). Over-allocation risks leaving insufficient space for application code, especially if using RTOS-based frameworks. Best practice involves reserving the upper portion of flash for bootloader use while keeping application code contiguous in lower addresses to simplify recovery procedures.

What is the impact of supply voltage fluctuations on ADC performance in the MSP430F167IRTDT, and how can accuracy be maintained across the 1.8V to 3.6V range?: The integrated 12-bit ADC on the MSP430F167IRTDT exhibits reference-dependent accuracy; its internal 2.5V bandgap reference maintains stability within ±1% over the full supply range, but absolute precision degrades slightly at lower voltages due to reduced signal headroom. At 1.8V, input signals above 1.5V risk saturation, while noise margins shrink proportionally to Vcc. To maintain measurement integrity, designers should apply internal references consistently, avoid switching loads during conversions, and consider oversampling and averaging techniques. Calibration routines using known reference voltages can compensate for offset errors introduced by process variations, particularly important in production units where silicon tolerances vary.

How does the choice between internal oscillator versus external crystal affect start-up time and system reliability in the MSP430F167IRTDT?: The MSP430F167IRTDT supports both internal 16MHz RC oscillator (with ±1% typical accuracy) and external crystals up to 8MHz. Using the internal oscillator reduces component count and enables faster wake-up from low-power modes—typically under 1ms—but introduces timing uncertainty that may violate communication protocol requirements like CAN or precise PWM generation. External crystals provide superior stability (±20ppm or better) and reduce clock drift over temperature, improving synchronization in networked systems. However, they increase board area, cost, and susceptibility to mechanical stress. In safety-critical applications where deterministic behavior outweighs startup speed, external crystals are preferred despite added complexity.

What trade-offs exist between using DMA versus polling for data transfer in the MSP430F167IRTDT when handling ADC results and UART transmission simultaneously?: The MSP430F167IRTDT includes a DMA controller capable of transferring ADC samples directly to RAM or peripherals without CPU intervention, significantly reducing ISR latency and freeing up cycles for background tasks. However, DMA channels are limited in number—typically four—and compete with other peripherals for bus access. Polling offers deterministic execution timing and simpler debugging but consumes CPU cycles continuously, potentially missing deadlines in time-sensitive loops. For continuous ADC sampling at >5ksps, DMA is nearly mandatory to prevent buffer overflows. In contrast, UART transmission with fixed packet sizes may suffice via polling if interrupt overhead is negligible. Optimal strategy often combines DMA for bulk data with interrupt-driven state machines for protocol handling.

Why might the MSP430F167IRTDT exhibit erratic behavior after deep discharges, and how can firmware mitigate this risk?: After prolonged discharge below 1.8V, the MSP430F167IRTDT’s internal brown-out reset (BOR) circuit may fail to trigger reliably, allowing the MCU to enter undefined states. Additionally, flash memory programming requires minimum Vcc thresholds; sub-threshold voltages can corrupt stored data during write operations. Firmware mitigation includes implementing a software BOR check on startup by reading the BOR status flag in the SFR register, followed by a controlled reset if triggered. Furthermore, all critical variables should reside in RAM with periodic backups to non-volatile storage only after verifying stable supply via ADC monitoring of Vcc. Redundant watchdog timers configured to ignore spurious resets during initialization sequences also enhance robustness in energy-scavenging applications.

What is the significance of the 256B additional flash region in the MSP430F167IRTDT, and how should it be utilized during device programming?: Beyond the main 32KB user program memory, the MSP430F167IRTDT reserves 256B of flash for factory-programmed calibration data including DCO frequency trimming values, temperature compensation coefficients, and device identification codes. This region is locked by default during mass production and cannot be modified by end users. During development, programmers must ensure firmware does not attempt writes to this area unless explicitly unlocked via secure fuse mechanisms—unlocking voids warranty and risks permanent damage. Application code should read these values at runtime to correct internal oscillator drift or ADC offsets, thereby improving system accuracy without requiring external calibration hardware.

How does the 64-VQFN (9x9) package of the MSP430F167IRTDT influence thermal dissipation and soldering reliability in high-density PCB layouts?: The exposed pad on the bottom of the 64-VQFN package improves thermal conduction to the PCB ground plane, enhancing heat dissipation by approximately 30% compared to conventional QFNs. This benefits sustained operation at elevated ambient temperatures near 85°C, though peak power dissipation remains modest (~100mW) due to the device’s low active current. From a manufacturing standpoint, proper solder joint inspection is crucial—voids under the thermal pad can lead to delamination or intermittent connections. IPC Class 2 standards recommend stencil apertures sized at 95% of pad dimensions with double-sided paste printing to ensure uniform wetting. Automated optical inspection (AOI) should verify pad coverage before reflow, especially in high-volume production where manual rework is impractical.

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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