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Home Products Integrated Circuits (ICs)Specialized ICs~~TMS320VC5502GBE200~~

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TMS320VC5502GBE200 - Texas Instruments

Name: Texas Instruments TMS320VC5502GBE200
Brand: Texas Instruments
SKU: TMS320VC5502GBE200
Price: 122.37 USD
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: TMS320VC5502GBE200

Manufacturer: Texas Instruments

Allelco Part Number: 41D-TMS320VC5502GBE200

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 17,890 pcs available, New & Original

Parts Description: NFBGA (GBE)

Data sheet: -

Category: Integrated Circuits (ICs) > Specialized ICs

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Unit Price: $122.37
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Quantity	Unit Price	Ext. Price
1+	$122.37	$122.37
3+	$122.37	$367.11
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Specifications

TMS320VC5502GBE200 Tech Specifications
Texas Instruments - TMS320VC5502GBE200 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TMS320VC5502GBE200

Product Attribute	Attribute Value
Part Number	TMS320VC5502GBE200
Package	NFBGA (GBE)
Description	NFBGA (GBE)
Stock Condition	Get 17890 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Parts Introduction

Manufacturer Part Number

TMS320VC5502GBE200

Manufacturer

texas-instruments

Introduction

The TMS320VC5502GBE200 is a high-performance fixed-point digital signal processor (DSP) from Texas Instruments, designed for a wide range of embedded applications. This DSP offers a powerful combination of processing capabilities, low power consumption, and advanced peripherals, making it a versatile choice for developers working on projects in the fields of industrial automation, consumer electronics, and communication systems.

Product Features and Performance

200 MHz clock rate for efficient signal processing

32 kB of on-chip ROM and 80 kB of on-chip RAM for flexible memory configuration

Supports a variety of interfaces, including Host Interface, I2C, McBSP, and UART

Operates on a 1.26 V core voltage and 3.3 V I/O voltage for power-efficient performance

Wide operating temperature range of -40°C to 85°C (TC) for use in diverse environmental conditions

Surface mount package (201-LFBGA) for compact integration into embedded systems

Product Advantages

Excellent performance-to-power ratio for energy-efficient designs

Comprehensive peripheral set for seamless integration into a variety of applications

Flexible memory configuration options to accommodate different project requirements

Wide operating temperature range ensures reliable operation in challenging environments

Key Reasons to Choose This Product

Proven track record of reliability and performance from a trusted industry leader

Versatile design suitable for a wide range of embedded applications

Robust peripheral support and flexible memory configuration for design flexibility

Power-efficient operation for extended battery life or reduced cooling requirements

Quality and Safety Features

Rigorously tested to meet industry standards for quality and reliability

Designed with robust safety features to ensure reliable and secure operation

Compatibility

The TMS320VC5502GBE200 is compatible with other TMS320C55x series DSPs, allowing for easy migration and integration into existing or future projects.

Application Areas

Industrial automation and control systems

Consumer electronics, such as audio and video processing

Communication systems, including voice and data processing

Portable and battery-powered devices requiring low power consumption

Product Lifecycle

The TMS320VC5502GBE200 is an active product in our website's sales team's portfolio. There are several equivalent or alternative models available, including the TMS320C5505, TMS320C5515, and TMS320C5535. Customers are advised to contact our website's sales team for the most up-to-date information on product availability and potential alternatives.

Frequently Asked Questions(FAQ)

How does the TMS320VC5502GBE200 compare to other fixed-point DSPs in terms of core voltage and power efficiency for battery-operated embedded systems?: The TMS320VC5502GBE200 operates at a core voltage of 1.26V, which is significantly lower than many contemporary fixed-point DSPs that typically require 1.8V or higher. This reduced voltage directly contributes to lower dynamic power consumption, making it suitable for energy-sensitive applications such as portable medical devices or industrial sensors where thermal dissipation and battery life are critical constraints.

What is the significance of the 80kB on-chip RAM in the TMS320VC5502GBE200, and how does it impact real-time signal processing performance compared to models with smaller memory blocks?: The 80kB of integrated RAM eliminates external memory access latency and reduces system complexity, enabling faster data throughput for real-time algorithms. In comparison to DSPs with only 16–32kB of on-chip memory, this larger block supports more complex filtering, FFT computations, and multitasking without reliance on slower external SDRAM or SRAM, resulting in improved execution determinism and reduced jitter in time-critical applications.

Can the TMS320VC5502GBE200 interface with legacy UART-based sensor modules, and what design considerations are necessary to ensure reliable communication?: Yes, the TMS320VC5502GBE200 includes a dedicated UART peripheral compatible with standard asynchronous serial protocols. However, level shifting may be required if interfacing with 5V logic devices, since its I/O operates at 3.3V. Additionally, baud rate tolerance must be considered—designers should verify clock accuracy and use buffered FIFO modes to prevent data loss during high-throughput bursts typical in sensor fusion scenarios.

How does the TMS320VC5502GBE200 handle temperature variations between -40°C and 85°C, and what implications does this have for automotive or industrial deployment?: The operating range of -40°C to 85°C indicates compliance with extended industrial standards, but users must account for timing drift and leakage current effects at extremes. At 85°C, internal oscillator stability and RAM retention become more sensitive, potentially requiring margining in clock generation circuits or periodic self-diagnostics in safety-critical deployments such as factory automation or remote monitoring systems.

What trade-offs exist when using the TMS320VC5502GBE200 versus floating-point DSPs like the C674x series for audio decoding applications?: While the TMS320VC5502GBE200 lacks hardware floating-point support, its fixed-point architecture delivers deterministic execution and lower power consumption compared to floating-point alternatives. For audio decoding, this means acceptable performance in formats like MP3 or AAC at moderate bitrates, provided software libraries are optimized using Q-format arithmetic. However, complex spectral operations may suffer from quantization noise unless careful scaling strategies are applied.

Is the ROM in the TMS320VC5502GBE200 user-modifiable, and how does the presence of 32kB of embedded ROM affect firmware update workflows?: No, the 32kB of ROM is factory-programmed and non-volatile but not field-reprogrammable via standard interfaces. This limits post-deployment firmware updates to OTA mechanisms that patch application code in external flash, adding complexity to maintenance cycles. Designers must therefore plan initial bootloaders and recovery routines carefully to avoid bricking devices during updates.

How does the McBSP interface on the TMS320VC5502GBE200 perform in multi-channel audio sampling scenarios compared to SPI-based ADC interfaces?: The McBSP offers synchronized multi-drop capability and frame-synchronization signals ideal for parallel ADC chains such as those used in 24-bit stereo or microphone array systems. Unlike SPI, which requires separate chip selects and higher pin count, McBSP consolidates clock and data lines, reducing PCB routing congestion and improving timing consistency across channels—critical in professional audio or beamforming applications.

What is the impact of the 200MHz clock rate on instruction-level parallelism in the TMS320C55x architecture when running DSP kernels on the TMS320VC5502GBE200?: The 200MHz clock enables up to two instructions per cycle under optimal conditions due to dual-issue pipeline capabilities in the C55x core. However, actual throughput depends heavily on memory bandwidth and loop overhead. For example, a FIR filter with 64 taps may achieve only ~150 MIPS effective throughput if data must be fetched from external memory, highlighting the importance of on-chip cache or tightly coupled memory planning.

Can the TMS320VC5502GBE200 coexist with analog front-end components in the same PCB stackup, and what EMC precautions are essential?: Yes, but careful layout is required due to mixed-signal operation. The 1.26V core and 3.3V I/O rails demand separate power planes and decoupling networks to minimize digital switching noise coupling into sensitive analog paths. Ground plane segmentation and guard rings around analog sections are recommended, especially when driving ADCs or DACs with resolution exceeding 16 bits.

How does the Moisture Sensitivity Level (MSL) of 3 for the TMS320VC5502GBE200 influence reflow soldering procedures in mass production?: With an MSL rating of 3 and a floor life of 168 hours, the TMS320VC5502GBE200 must be baked before reflow if exposed beyond one week after opening packaging. Production facilities must track bake schedules and implement nitrogen-assisted reflow where possible to prevent void formation in the fine-pitch BGA package, which could lead to solder joint fatigue over time.

What role does the I2C interface play in configuring peripherals connected to the TMS320VC5502GBE200, and can it be used simultaneously with other buses without contention?: The I2C module allows configuration of sensors, EEPROMs, or codec registers using minimal pins, freeing GPIO for control tasks. It can operate concurrently with McBSP and UART as each peripheral uses independent arbitration domains. However, shared bus loading must be managed—pull-up resistors and slew rates should match slave device specifications to maintain signal integrity at speeds above 400 kbps.

How does the absence of external memory controller support in the TMS320VC5502GBE200 limit system scalability compared to microprocessors with DDR interfaces?: Without an integrated memory controller, the TMS320VC5502GBE200 cannot directly interface high-capacity DRAM, restricting maximum program size and data buffers. Systems requiring more than ~128KB of executable code must rely on external NOR flash or use bank-switching techniques, increasing software complexity. This makes it less suited for large OS-driven applications but still viable for deeply embedded, algorithm-heavy workloads.

What are the key differences between the TMS320VC5502GBE200 and the TMS320VC5509A in terms of power management and peripheral integration?: The VC5502 features a more advanced power-down mode with granular clock gating and retains register states during sleep, whereas the VC5509A uses coarse power domains. Additionally, the VC5502 integrates UART and I2C natively, while the VC5509A often requires external transceivers for serial communication, making the former preferable for compact, low-pin-count designs.

Does the TMS320VC5502GBE200 support secure boot, and how can developers protect firmware integrity during initial programming?: The device does not include hardware cryptographic engines or secure boot ROM by default. Developers must implement software-based signature verification using SHA-1 or similar hashes stored in external secure flash, combined with checksum validation during boot sequences—adding layers of abstraction that increase development effort but provide basic tamper resistance.

How does the 201-LFBGA package affect thermal performance and reworkability in high-volume manufacturing of the TMS320VC5502GBE200?: The small 15×15mm BGA footprint concentrates heat near the die, necessitating adequate copper pour under the package and possibly thermal vias in the PCB. Rework is challenging due to tight pitch; X-ray inspection is essential after assembly to detect bridging or voids. Automated optical inspection (AOI) alone may miss subtle defects, increasing failure rates in manual repair scenarios.

In what ways can the TMS320VC5502GBE200 leverage its host interface for debugging and real-time tracing compared to JTAG-only solutions?: Beyond JTAG, the host interface enables background memory access and register read/write operations without halting execution, facilitating non-intrusive profiling. Combined with TI’s Code Composer Studio, this allows live variable monitoring and breakpoint insertion, offering richer visibility than JTAG alone, especially during runtime algorithm tuning.

What considerations apply when cascading multiple TMS320VC5502GBE200 units in a distributed signal processing system using McBSP daisy-chaining?: Daisy-chaining requires precise synchronization of frame clocks and careful delay matching across devices to maintain phase alignment in multi-stage filters or FFT pipelines. Each node introduces propagation delay, so buffer management and clock domain crossing logic must be implemented to prevent skew accumulation, particularly when processing wideband RF samples at 200MIPS aggregate throughput.

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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