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- Apr 17, 2026
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M(A,X,XL)PLAD7.5KPxxA(e3).pdfPCN Assembly/Origin
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| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $21.24 | $21.24 |
MXPLAD7.5KP17AE3 Tech Specifications
Microchip Technology - MXPLAD7.5KP17AE3 technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - MXPLAD7.5KP17AE3
| Product Attribute | Attribute Value | |
|---|---|---|
| Manufacturer | Microchip Technology | |
| Voltage - Reverse Standoff (Typ) | 17V | |
| Voltage - Clamping (Max) @ Ipp | 27.6V | |
| Voltage - Breakdown (Min) | 18.9V | |
| Unidirectional Channels | 1 | |
| Type | Zener | |
| Supplier Device Package | Mini-PLAD | |
| Series | Military, MIL-PRF-19500 | |
| Power Line Protection | No |
| Product Attribute | Attribute Value | |
|---|---|---|
| Power - Peak Pulse | 7500W (7.5kW) | |
| Package / Case | Nonstandard SMD | |
| Package | Bulk | |
| Operating Temperature | -55°C ~ 150°C (TJ) | |
| Mounting Type | Surface Mount | |
| Current - Peak Pulse (10/1000µs) | 272A | |
| Capacitance @ Frequency | - | |
| Base Product Number | PLAD7.5 | |
| Applications | General Purpose |
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHs Status | ROHS3 Compliant |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8541.10.0080 |
The three parts on the right have similar specifications to Microchip Technology MXPLAD7.5KP17AE3
| Product Attribute | ![]() |
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||
|---|---|---|---|---|
| Part Number | MXPLAD7.5KP170AE3 | MXPLAD7.5KP170CAE3 | MXPLAD7.5KP17CAE3 | MXPLAD7.5KP18CAE3 |
| Manufacturer | Microsemi | Microsemi | Microchip Technology | Microchip Technology |
| Power - Peak Pulse | - | - | - | - |
| Type | - | - | - | - |
| Applications | - | - | - | - |
| Package | - | Tape & Reel (TR) | Tube | Tape & Reel (TR) |
| Series | - | - | - | - |
| Voltage - Clamping (Max) @ Ipp | - | - | - | - |
| Mounting Type | - | Surface Mount | Through Hole | Surface Mount |
| Unidirectional Channels | - | - | - | - |
| Base Product Number | - | DAC34H84 | MAX500 | ADS62P42 |
| Power Line Protection | - | - | - | - |
| Package / Case | - | 196-LFBGA | 16-DIP (0.300', 7.62mm) | 64-VFQFN Exposed Pad |
| Voltage - Breakdown (Min) | - | - | - | - |
| Current - Peak Pulse (10/1000µs) | - | - | - | - |
| Voltage - Reverse Standoff (Typ) | - | - | - | - |
| Supplier Device Package | - | 196-NFBGA (12x12) | 16-PDIP | 64-VQFN (9x9) |
| Capacitance @ Frequency | - | - | - | - |
| Operating Temperature | - | -40°C ~ 85°C | 0°C ~ 70°C | -40°C ~ 85°C |
Download MXPLAD7.5KP17AE3 pdf datasheets and Microchip Technology documentation for MXPLAD7.5KP17AE3 - Microchip Technology.
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MXPLAD7.5KP170CAE3MicrosemiTVS DIODE
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MXPLAD7.5KP170AE3MicrosemiTVS DIODEYour Email address will not be published.
| Common Countries Logistic Time Reference | ||
|---|---|---|
| Region | Country | Logistic Time(Day) |
| America | United States | 5 |
| Brazil | 7 | |
| Europe | Germany | 5 |
| United Kingdom | 4 | |
| Italy | 5 | |
| Oceania | Australia | 6 |
| New Zealand | 5 | |
| Asia | India | 4 |
| Japan | 4 | |
| Middle East | Israel | 6 |
| DHL & FedEx Shipment Charges Reference | |
|---|---|
| Shipment charges(KG) | Reference DHL(USD$) |
| 0.00kg-1.00kg | USD$30.00 - USD$60.00 |
| 1.00kg-2.00kg | USD$40.00 - USD$80.00 |
| 2.00kg-3.00kg | USD$50.00 - USD$100.00 |
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