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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersPIC16F716T-I/SO
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PIC16F716T-I/SO - Microchip Technology

Manufacturer Part Number
PIC16F716T-I/SO
Manufacturer
Microchip Technology
Allelco Part Number
32D-PIC16F716T-I/SO
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
29,169 pcs available, New & Original
Parts Description
IC MCU 8BIT 3.5KB FLASH 18SOIC
Package
18-SOIC
Data sheet
PIC16F716T-I/SO.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 29169
  • Unit Price: $1.296
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $1.296 $1.30
10+ $1.197 $11.97
30+ $1.135 $34.05
100+ $1.072 $107.20
500+ $1.044 $522.00
1100+ $1.031 $1,134.10
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

PIC16F716T-I/SO Tech Specifications
Microchip Technology - PIC16F716T-I/SO technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - PIC16F716T-I/SO

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 2V ~ 5.5V
Supplier Device Package 18-SOIC
Speed 20MHz
Series PIC® 16F
RAM Size 128 x 8
Program Memory Type FLASH
Program Memory Size 3.5KB (2K x 14)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 18-SOIC (0.295', 7.50mm Width)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 13
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 4x8b
Core Size 8-Bit
Core Processor PIC
Connectivity -
Base Product Number PIC16F716

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

PIC16F716T-I/SO Image
PIC16F716T-I/SO (1)

Manufacturer Part Number

PIC16F716T-I/SO

Manufacturer

Microchip Technology

Introduction

The PIC16F716T-I/SO is an 8-bit microcontroller from Microchip Technology’s PIC® 16F Series designed for embedded applications.

Product Features and Performance

Core Processor: PIC

Core Size: 8-Bit

Speed: 20MHz

Program Memory Size: 3.5KB (2K x 14)

Program Memory Type: FLASH

Peripherals include Brown-out Detect/Reset, Power-on Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT)

Number of I/O: 13

Data Converters: 4 x 8-bit Analog-to-Digital Converter

Oscillator Type: External

Product Advantages

Optimal balance of performance and power consumption

Robust peripheral set supports complex applications

Flexible voltage range from 2V to 5.5V

Key Technical Parameters

Speed: 20MHz

Program Memory: 3.5KB FLASH

I/O count: 13

Voltage Supply: 2V ~ 5.5V

Operating Temperature Range: -40°C ~ 85°C

Quality and Safety Features

Brown-out Detect/Reset ensures proper functioning under low voltage conditions

Power-on Reset (POR) for reliable operation on power-up

Watchdog Timer (WDT) for system recovery in erroneous states

Compatibility

Compatible with external oscillators for flexible clock options

Mounting Type: Surface Mount

Supplier Device Package: 18-SOIC

Package / Case: 18-SOIC (0.295", 7.50mm Width)

Application Areas

Ideal for automotive, industrial, and consumer electronics applications

Product Lifecycle

Product Status: Active

No indication of discontinuation, ensuring long-term availability

Several Key Reasons to Choose This Product

Highly cost-effective for complex embedded designs

Extended operating temperature suitable for harsh environments

Flexible and extensive peripheral set reduces additional component needs

High reliability with integrated safety features

Supports wide range of power supply options for different application needs

Frequently Asked Questions(FAQ)

How does the PIC16F716T-I/SO compare to other 8-bit microcontrollers in terms of power efficiency and program memory capacity when used in battery-powered embedded systems?
The PIC16F716T-I/SO operates across a wide voltage range from 2V to 5.5V, enabling use in low-power applications such as portable devices or sensor nodes where energy harvesting is involved. With 3.5KB of FLASH program memory (2K x 14), it offers sufficient code space for moderately complex control algorithms without requiring external program storage. When compared to similar-density MCUs like the PIC16F690 or PIC16LF1827, this device provides comparable peripheral integration—including four 8-bit ADCs and PWM modules—while maintaining a compact 18-pin SOIC footprint. Its instruction cycle time of 200 ns at 20 MHz allows efficient execution, but the lack of EEPROM means data retention relies on volatile RAM unless augmented with external non-volatile memory.
What are the implications of using the PIC16F716T-I/SO in high-noise industrial environments, particularly regarding reset behavior and analog input integrity?
In electrically noisy settings such as motor control or power supply monitoring, the PIC16F716T-I/SO includes built-in brown-out detection and power-on reset (POR) circuitry that help maintain stable operation during voltage dips or transient disturbances. However, its analog front-end consists of only four 8-bit successive approximation ADCs with no mention of shielding or differential inputs, making it vulnerable to electromagnetic interference if not properly laid out with ground planes and filtering capacitors near sensitive pins. Unlike more robust MCUs designed for automotive use, it lacks enhanced ESD protection beyond standard levels, so PCB-level isolation and layout discipline become critical for reliable field deployment.
Can the PIC16F716T-I/SO drive multiple inductive loads directly through its GPIO pins, and what precautions should be taken during switching?
No, the PIC16F716T-I/SO does not include integrated MOSFET drivers or high-current output stages. Its 13 general-purpose I/O pins are rated for standard logic-level driving capability, typically around 25–50 mA per pin depending on package and operating conditions. Driving inductive loads such as relays or solenoids directly could exceed these limits and risk damaging the microcontroller. A common design practice involves using external transistors (e.g., BJTs or MOSFETs) with flyback diodes across the load to suppress back-EMF generated during turn-off transitions. Additionally, software debouncing and current-limiting resistors should be implemented to protect both the MCU and interfacing components.
Is it feasible to upgrade existing firmware on the PIC16F716T-I/SO in production without removing the IC from the board, and what programming interface supports this?
Yes, the PIC16F716T-I/SO supports in-circuit serial programming (ICSP) via two dedicated pins—usually MCLR/VPP and PGD/PGC—allowing firmware updates after assembly. This enables field reprogramming or calibration adjustments without hardware disassembly. However, due to its FLASH-based program memory architecture, erasing requires block-level operations that can take several milliseconds, which may affect real-time responsiveness during an update. Users must ensure adequate hold times between erase/write cycles and avoid interrupting power during programming, as incomplete writes could corrupt the bootloader or application code.
How does the operating temperature range of the PIC16F716T-I/SO influence its suitability for outdoor or harsh environment deployments?
Rated for -40°C to 85°C, the PIC16F716T-I/SO meets industrial-grade thermal specifications, making it appropriate for applications exposed to ambient temperature swings such as HVAC controls, agricultural sensors, or lighting fixtures. However, unlike extended-temperature variants (e.g., those rated up to 125°C), it cannot withstand prolonged exposure to extreme heat sources like engine compartments or direct solar loading without supplemental thermal management. Derating of clock speed or peripheral usage may be necessary near the upper limit to prevent timing drift or latch-up, especially since internal oscillator accuracy degrades with temperature.
What considerations apply when selecting decoupling capacitors for the PIC16F716T-I/SO in space-constrained PCB designs?
Given its 18-SOIC packaging and mixed-signal features (including ADCs), stable power delivery is crucial. A typical recommendation includes placing a 0.1 µF ceramic capacitor as close as possible to each VDD and VSS pair, particularly near analog and clock-related pins. Due to limited internal capacitance and absence of advanced power management, noise on the supply rail can significantly impact ADC linearity and oscillator stability. Larger bulk capacitance (e.g., 10 µF tantalum or ceramic) may be needed if the system experiences rapid current transients, though size constraints might necessitate careful trade-offs between performance and board real estate.
How does the lack of EEPROM in the PIC16F716T-I/SO affect long-term data logging applications, and what alternatives exist?
Since the PIC16F716T-I/SO contains no non-volatile data storage, any configuration parameters, calibration values, or event logs stored in RAM will be lost upon power loss. For continuous logging, users must implement external FRAM or EEPROM chips interfaced via SPI or I²C. Alternatively, periodic saving of critical data to FLASH memory—though technically possible—is discouraged because repeated write cycles degrade FLASH endurance (typically 10k cycles minimum). This limitation makes the part less ideal for high-frequency data recording compared to devices with integrated EEPROM blocks.
In what scenarios would choosing the PIC16F716T-I/SO over a higher-pin-count variant offer measurable advantages in system cost and complexity?
The PIC16F716T-I/SO’s 18-pin SOIC form factor reduces PCB footprint and simplifies assembly, benefiting space-limited projects such as handheld instruments or modular sensor hubs. Compared to larger packages like DIP or QFN versions of the same core family, it lowers material costs and enables hand-soldering during prototyping. For applications requiring fewer than 13 I/O lines and basic analog sensing (e.g., thermistor reading, button inputs), its integrated peripherals eliminate the need for discrete comparators or ADCs, reducing bill-of-materials cost and software overhead. However, migration to higher-pin models becomes necessary when additional communication interfaces (like UART or CAN) or more ADC channels are required.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology PIC16F716T-I/SO

Product Attribute PIC16F716-I/SO PIC16F716-I/SS PIC16F716-I/P PIC16F716-E/SS
Part Number PIC16F716-I/SO PIC16F716-I/SS PIC16F716-I/P PIC16F716-E/SS
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Oscillator Type - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Number of I/O - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
RAM Size - - - -
Program Memory Type - - - -
Speed - - - -
EEPROM Size - - - -
Core Size - - - -
Peripherals - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Connectivity - - - -
Program Memory Size - - - -
Core Processor - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Data Converters - - - -

PIC16F716T-I/SO Datasheet PDF

Download PIC16F716T-I/SO pdf datasheets and Microchip Technology documentation for PIC16F716T-I/SO - Microchip Technology.

Datasheets
PICmicro™ Reference Manual.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Design/Specification
Die Attach Material Add 13/Oct/2015.pdf PdCu Wire Update 18/Feb/2015.pdf
HTML Datasheet
MPLAB® ICE2000 Spec.pdf PIC16F716.pdf Tips N Tricks Guide.pdf
PCN Packaging
Packing Changes 10/Oct/2016.pdf Reel Design Update 07/May/2015.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
PIC16F716T-I/SO Image

PIC16F716T-I/SO

Microchip Technology
32D-PIC16F716T-I/SO

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