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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersPIC18F252T-I/SO
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PIC18F252T-I/SO - Microchip Technology

Manufacturer Part Number
PIC18F252T-I/SO
Manufacturer
Microchip Technology
Allelco Part Number
32D-PIC18F252T-I/SO
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,384 pcs available, New & Original
Parts Description
IC MCU 8BIT 32KB FLASH 28SOIC
Package
28-SOIC
Data sheet
PIC18F252T-I/SO.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 5384

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Specifications

PIC18F252T-I/SO Tech Specifications
Microchip Technology - PIC18F252T-I/SO technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - PIC18F252T-I/SO

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 4.2V ~ 5.5V
Supplier Device Package 28-SOIC
Speed 40MHz
Series PIC® 18F
RAM Size 1.5K x 8
Program Memory Type FLASH
Program Memory Size 32KB (16K x 16)
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT
Package / Case 28-SOIC (0.295", 7.50mm Width)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 23
Mounting Type Surface Mount
EEPROM Size 256 x 8
Data Converters A/D 5x10b
Core Size 8-Bit
Core Processor PIC
Connectivity I²C, SPI, UART/USART
Base Product Number PIC18F252

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

Manufacturer Part Number

PIC18F252T-I/SO

Manufacturer

Microchip Technology

Introduction

The PIC18F252T-I/SO is a high-performance 8-bit microcontroller featuring 32KB of flash program memory, designed for advanced embedded applications.

Product Features and Performance

Core Processor: PIC operating at a speed of 40MHz,

Connectivity options include I2C, SPI, and UART/USART,

Comprehensive set of peripherals including Brown-out Detect/Reset, LVD, POR, PWM, WDT,

23 programmable I/O lines,

A program memory size of 32KB and EEPROM size of 256 x 8,

RAM Size of 1.5K x 8,

Integrated A/D converter with 5 channels at 10 bits resolution,

External Oscillator Type for flexibility in system design,

Operates within a supply voltage range of 4.2V to 5.5V.

Product Advantages

High-speed operation at 40MHz facilitates rapid processing and responsiveness,

Extensive connectivity and peripheral integration offer flexibility in application design,

Robust memory architecture enables complex program and data storage,

A/D conversion supports interfacing with analog sensors and inputs,

Designed for easy surface mount applications with a 28-SOIC package.

Key Technical Parameters

Speed: 40MHz,

Number of I/O: 23,

Program Memory Size: 32KB,

EEPROM Size: 256 x 8,

RAM Size: 1.5K x 8,

Data Converters: A/D 5x10b,

Voltage Supply: 4.2V ~ 5.5V,

Operating Temperature: -40°C ~ 85°C.

Quality and Safety Features

Features such as Brown-out Detect/Reset and Low Voltage Detection for system reliability,

Watchdog Timer to prevent system hang-ups.

Compatibility

Compatible with a wide range of development tools and software from Microchip Technology,

Flexibility in system design with support for various communication protocols.

Application Areas

Industrial control systems,

Automotive electronics,

Home automation,

Internet of Things (IoT) devices,

Consumer electronics.

Product Lifecycle

Currently marked as Active with ongoing manufacturer support,

Not nearing discontinuation, ensuring long-term availability for designs and projects.

Several Key Reasons to Choose This Product

High performance and speed for demanding embedded applications,

Broad connectivity and peripheral set enhances design versatility,

Large memory capacity supports complex applications and software,

Reliable operation ensured by robust quality and safety features,

Supported by Microchip's extensive development ecosystem,

Active product lifecycle status guarantees long-term availability and support.

Frequently Asked Questions(FAQ)

What are the key electrical and performance differences between the PIC18F252T-I/SO and other 28-pin SOIC microcontrollers in the same family, such as the PIC18F242T-I/SO?
The PIC18F252T-I/SO features a larger program memory of 32KB (16K x 16) compared to the PIC18F242T-I/SO’s 16KB, allowing it to support more complex firmware. It also includes an enhanced instruction set and improved peripheral integration, including five 10-bit ADC channels, which provides greater flexibility in analog sensing applications. While both share the same 40MHz speed and 4.2V–5.5V supply range, the PIC18F252T-I/SO is better suited for projects requiring expanded code storage and moderate analog input handling without external ADCs.
How does the operating temperature range of -40°C to 85°C impact real-world deployment of the PIC18F252T-I/SO in industrial or automotive environments?
The industrial temperature grade (-40°C to 85°C) ensures reliable operation in harsh environments such as factory automation, outdoor sensor nodes, or HVAC systems where ambient temperatures fluctuate significantly. This specification allows designers to deploy the PIC18F252T-I/SO in applications outside consumer-grade conditions, provided proper thermal management and layout practices are followed. However, junction temperature must still be monitored during high-load scenarios due to power dissipation in the 28-SOIC package.
Can the PIC18F252T-I/SO operate reliably at the lower end of its voltage range (e.g., 4.2V) when driving multiple I/O pins with capacitive loads, and what design considerations apply?
Yes, the device maintains full functionality down to 4.2V, but performance may degrade under heavy I/O switching with large capacitive loads due to increased propagation delay and potential signal integrity issues. Designers should minimize trace lengths on output lines, avoid long unterminated cables, and consider using pull-up/pull-down resistors to reduce ringing. Additionally, firmware should include adequate debouncing or filtering if used with mechanical switches connected to GPIO pins operating near voltage limits.
In what scenarios would it be preferable to use the PIC18F252T-I/SO over a Cortex-M0-based MCU despite its lower processing power?
The PIC18F252T-I/SO is advantageous in cost-sensitive, battery-powered, or legacy-compatible designs where 8-bit simplicity suffices. Its smaller code footprint, deterministic interrupt response, and compatibility with existing PIC toolchains make it ideal for educational kits, simple motor controllers, or retrofitted control modules in older equipment. Unlike ARM-based MCUs, it avoids licensing overhead and supports real-time tasks with predictable timing—useful in safety-critical loops where jitter matters more than peak throughput.
How does the presence of internal peripherals like WDT, BOR, and LVD affect system reliability when using the PIC18F252T-I/SO in unattended deployments?
These integrated protections enhance robustness by automatically resetting the device during brown-out events (BOR), watchdog timeouts (WDT), or low-voltage conditions (LVD). For remote or battery-operated systems, this reduces dependency on external supervisory circuits and lowers bill-of-materials cost. However, developers must configure and enable these features appropriately in firmware; otherwise, undetected faults could lead to silent failures. The LVD threshold is fixed per silicon revision, so verification against actual supply droop is necessary.
What are the implications of using the Cut Tape packaging format for the PIC18F252T-I/SO in automated assembly versus standard tape-and-reel?
Cut Tape delivers individual devices on carrier strips, simplifying manual inspection and prototyping but increasing risk of ESD damage during handling. It's less efficient for high-volume manufacturing than standard reel tape, which feeds continuously into pick-and-place machines. For Digi-Reel® variants, automated lines benefit from standardized feed patterns. Designers sourcing PIC18F252T-I/SO via Cut Tape should implement strict ESD protocols and consider anti-static storage solutions to maintain yield.
How does the 23 general-purpose I/O count constrain or enable interfacing with common sensors and actuators using the PIC18F252T-I/SO?
With 23 available GPIOs across two ports (PORTA and PORTB), the PIC18F252T-I/SO can directly drive LEDs, read buttons, interface with shift registers, or connect to basic sensor arrays without multiplexing. However, shared functionality (e.g., PWM on PORTC) limits simultaneous use of certain pins for digital I/O. Careful pin mapping is required when combining UART, SPI, and I²C buses—each consuming dedicated pins that cannot be repurposed arbitrarily. Expansion via external ICs (like port extenders) becomes necessary for larger systems.
Why might a designer choose the PIC18F252T-I/SO instead of a newer 32-bit PIC despite its 8-bit architecture and lower clock speed?
Legacy codebases, existing PCB footprints, or certification requirements may mandate continued use of the PIC18F series. The PIC18F252T-I/SO offers backward compatibility, proven reliability in fielded products, and reduced migration effort. Though slower than 32-bit variants, it remains sufficient for non-math-intensive applications like data logging, relay control, or protocol conversion. Its mature development ecosystem and extensive third-party libraries further justify selection in stable product lines with long lifecycles.
How do the oscillator type and external crystal requirement influence board layout and startup behavior when using the PIC18F252T-I/SO?
Being externally clocked, the PIC18F252T-I/SO demands precise crystal placement near XTAL1/XTAL2 pins with matched load capacitors (typically 22pF). Poor layout introduces parasitic capacitance or EMI, causing startup failure or frequency drift. Oscillator stability also affects timing-sensitive peripherals like UART baud rates. Designers must follow Microchip’s reference schematics for decoupling, grounding, and trace routing to ensure reliable oscillation across the entire -40°C to 85°C range.
What trade-offs exist between program memory size (32KB), RAM (1.5KB), and typical application complexity when using the PIC18F252T-I/SO?
The 32KB Flash accommodates moderately complex state machines or communication stacks, but large buffers or floating-point math quickly exhaust resources. The 1.5KB RAM limits dynamic allocation—global variables should be minimized, and ISRs kept short. Developers often optimize by using lookup tables, bit manipulation, and compiler flags to reduce footprint. Real-time data processing may require external SRAM unless compressed algorithms are employed. Memory usage must be profiled early to avoid runtime crashes.
How does the Moisture Sensitivity Level (MSL) rating of 1 impact storage and handling procedures for PIC18F252T-I/SO components before soldering?
MSL 1 indicates unlimited shelf life under proper storage (dry, ambient conditions), reducing need for baking before reflow. This simplifies inventory management and avoids unnecessary processing steps. However, once unpackaged, the component remains sensitive to humidity-induced popcorning during reflow unless baked within 24 hours. Facilities handling high-volume production should still adhere to JEDEC J-STD-033 guidelines for sealed bag storage and desiccant use regardless of MSL classification.
In embedded systems requiring both analog measurement and digital communication, how does the combination of ADC channels and UART/SPI/I²C peripherals in the PIC18F252T-I/SO facilitate system integration?
The five 10-bit ADCs allow direct sampling of up to five analog signals (e.g., temperature, pressure, voltage) without external muxes, while UART, SPI, and I²C enable flexible communication with displays, sensors, or host processors. For example, a single PIC18F252T-I/SO can measure five thermistor inputs and stream data via UART to a PC or log it over I²C to an RTC module. Resource conflicts arise if all interfaces are active simultaneously, necessitating careful scheduling in firmware to prioritize critical tasks.
What factors determine whether the PIC18F252T-I/SO meets RoHS3 compliance requirements for global market distribution?
RoHS3 compliance ensures absence of restricted substances (lead, mercury, cadmium, etc.) above mandated thresholds, validated through manufacturer testing. The PIC18F252T-I/SO qualifies for EU, China, and California markets, but importers may demand additional documentation like EC declarations. End-system manufacturers must still verify solder alloy compatibility and ensure no non-compliant materials are introduced during assembly. Non-RoHS versions are not offered, simplifying compliance planning for PIC18F252T-I/SO-based designs.
How does the choice of 28-SOIC package impact thermal performance and signal integrity compared to smaller alternatives like PDIP or TSSOP?
The 28-SOIC offers better thermal dissipation than TSSOP due to wider leads and larger copper pad area, aiding heat spread in compact layouts. However, its 7.5mm width increases PCB real estate versus narrower packages. Signal integrity benefits from shorter internal traces compared to PDIP, but routing density remains limited. For high-speed signals, termination strategies must account for lead inductance. Mechanical stability favors SOIC over thinner packages in vibration-prone environments.
When integrating the PIC18F252T-I/SO into a safety-critical system, what additional measures beyond datasheet specifications are recommended to ensure functional safety?
Beyond standard operation, redundancy, fault injection testing, and formal verification of firmware logic are advised. Independent monitoring of supply voltage and reset line adds layers of resilience. Firmware should validate peripheral states after resets and implement checksums for stored data. Although the device lacks built-in safety certifications (e.g., ISO 26262), careful design can achieve SIL-1 or PL-a equivalent levels for non-life-threatening applications like industrial controls. Third-party audits help align with industry standards.
How does the EEPROM size (256 x 8 bits) influence data retention strategies when using the PIC18F252T-I/SO in battery-backed or configuration-heavy applications?
At 256 bytes, EEPROM is suitable for storing calibration offsets, user preferences, or serial numbers, but insufficient for large datasets. Write endurance (~1 million cycles) means frequent updates (e.g., every second) will degrade memory quickly. Developers should batch writes, use wear-leveling algorithms, or offload data to external flash if persistence is critical. Voltage stability during writes is essential—brown-outs can corrupt data, so BOR and LVD must be enabled to protect EEPROM contents.
What considerations apply when selecting between the PIC18F252T-I/SO and similar 8-bit MCUs from other vendors (e.g., STMicroelectronics STM8) for a new embedded design?
Key differentiators include ecosystem maturity (PICtoolchain vs. proprietary IDEs), peripheral mix (STM8 offers faster ADCs or hardware CRC), and power efficiency (STM8 targets ultra-low-power modes). The PIC18F252T-I/SO wins in mixed-signal simplicity and legacy support, while STM8 excels in standalone operation with minimal external components. Cost, availability, and team expertise heavily influence choice—PIC18F252T-I/SO leverages deep familiarity for rapid prototyping, whereas STM8 may reduce BOM count in battery-powered nodes.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology PIC18F252T-I/SO

Product Attribute PIC18F2523T-I/SO PIC18F2525T-I/SO PIC18F2539T-I/SO PIC18F2525-I/SO
Part Number PIC18F2523T-I/SO PIC18F2525T-I/SO PIC18F2539T-I/SO PIC18F2525-I/SO
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Oscillator Type - - - -
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Connectivity - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Core Size - - - -
RAM Size - - - -
Speed - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Data Converters - - - -
Core Processor - - - -
EEPROM Size - - - -
Program Memory Type - - - -
Peripherals - - - -
Program Memory Size - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

PIC18F252T-I/SO Datasheet PDF

Download PIC18F252T-I/SO pdf datasheets and Microchip Technology documentation for PIC18F252T-I/SO - Microchip Technology.

Datasheets
PIC18Fxx2 Datasheet.pdf
PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf Reel Design Update 07/May/2015.pdf
PCN Assembly/Origin
Mult Devices Bond Wire 09/Mar/2018.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
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  • GB/T 27922-2011
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Microchip Technology

PIC18F252T-I/SO

Microchip Technology
32D-PIC18F252T-I/SO

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