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HomeProductsIntegrated Circuits (ICs)Logic - Translators, Level ShiftersSY89329VMG-TR
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SY89329VMG-TR - Microchip Technology

Manufacturer Part Number
SY89329VMG-TR
Manufacturer
Microchip Technology
Allelco Part Number
32D-SY89329VMG-TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,776 pcs available, New & Original
Parts Description
IC TRANSLTR UNIDIRECTIONAL 8MLF
Package
8-MLF® (2x2)
Data sheet
SY89329VMG-TR.pdf

PCN Assembly/Origin

2.73KHz.pdf

PCN Part Number

2.73KHz.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 6776
  • Unit Price: $2.824
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.824 $2.82
200+ $1.094 $218.80
500+ $1.055 $527.50
1000+ $1.035 $1,035.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

SY89329VMG-TR Tech Specifications
Microchip Technology - SY89329VMG-TR technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - SY89329VMG-TR

Product Attribute Attribute Value
Manufacturer Microchip Technology
Translator Type Mixed Signal
Supplier Device Package 8-MLF® (2x2)
Series SY89
Package / Case 8-VFDFN Exposed Pad, 8-MLF®
Package Tape & Reel (TR)
Output Type Differential
Output Signal LVPECL
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Number of Circuits 1
Mounting Type Surface Mount
Input Signal LVCMOS, LVTTL
Features -
Data Rate -
Channels per Circuit 1
Channel Type Unidirectional
Base Product Number SY89329

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SY89329VMG-TR Image
SY89329VMG-TR (1)

Manufacturer Part Number

SY89329VMG-TR

Manufacturer

Microchip Technology

Introduction

High-Speed Logic Translator from LVCMOS/LVTTL to Differential LVPECL

Product Features and Performance

Unidirectional signal translation

Single-channel operation

Supports LVCMOS/LVTTL input signals

Converts to LVPECL output signals

Differential output for reduced noise and increased signal integrity

Product Advantages

High-speed operation for fast signal translation

Compact 8-VFDFN Exposed Pad, 8-MLF® package

Reliability of Microchip Technology as manufacturer

Key Technical Parameters

Channels per Circuit: 1

Output Type: Differential LVPECL

Operating Temperature Range: -40°C to 85°C

Surface Mount Package

Quality and Safety Features

Built to stringent quality standards

Ensures signal integrity and performance

Compatibility

Compatible with LVCMOS, LVTTL input signals

Converts to LVPECL levels suitable for high-speed communication

Application Areas

Communication infrastructure

Data networking

High-speed digital systems

Signal conversion applications

Product Lifecycle

Active product status

Not nearing discontinuation

Replacements or upgrades are currently available

Several Key Reasons to Choose This Product

Optimum solution for high-speed logic translation needs

Trustworthiness of Microchip Technology as semiconductor manufacturer

Meets industry needs for temperature range and packaging

Suited for advanced electronics requiring fast signal level translation

Space-saving design with surface-mount technology

Frequently Asked Questions(FAQ)

What are the key electrical characteristics and signal compatibility considerations when using the SY89329VMG-TR for LVCMOS to LVPECL translation in high-speed digital designs?
The SY89329VMG-TR is designed to translate LVCMOS or LVTTL input signals into differential LVPECL outputs, making it suitable for clock distribution and high-speed signaling applications. When selecting this component, designers must ensure that the input voltage levels from the source (typically 1.8V or 3.3V LVCMOS) fall within the acceptable input thresholds defined by the device’s datasheet. Additionally, since LVPECL outputs require a stable VCC reference (commonly 2.5V or 3.3V), proper power sequencing and decoupling are essential to maintain signal integrity. The differential nature of the LVPECL output reduces susceptibility to noise, which enhances signal quality over longer traces or in electrically noisy environments. Careful attention to termination resistors (typically 50Ω between each output and VCC - 2.0V) is required to prevent reflections and ensure proper swing levels.
How does the SY89329VMG-TR compare to other unidirectional mixed-signal translators in terms of propagation delay and jitter performance for clock distribution applications?
Compared to similar unidirectional translators such as the SY89328 or generic buffer ICs, the SY89329VMG-TR offers optimized propagation delay characteristics due to its monolithic design and low-skew architecture. While specific timing parameters like tPD may not be explicitly listed in public summaries, the part’s architecture suggests sub-nanosecond delays, which are critical in synchronous systems requiring tight skew control. In practice, this results in better timing margin when cascading multiple translation stages or interfacing with PLLs and FPGA clock inputs. However, compared to dedicated LVPECL fanout buffers, the SY89329VMG-TR may exhibit slightly higher jitter accumulation under heavy capacitive loading, so layout and load management remain important.
Can the SY89329VMG-TR be used in bidirectional signal translation scenarios, and what modifications would be necessary if attempting such an application?
No, the SY89329VMG-TR is strictly unidirectional—it translates only from LVCMOS/LVTTL input to LVPECL output and does not support reverse direction. Attempting bidirectional communication would require additional components such as tri-state buffers or dedicated bidirectional level shifters capable of handling both voltage domains. Designers seeking bidirectional functionality should instead consider alternatives like the Microchip SY89330VMG-TR, which supports bidirectional translation, or implement discrete solutions using MOSFET-based level translators. Direct use of the SY89329VMG-TR in bidirectional paths could lead to signal contention, latch-up risks, or damage to the device.
What layout and thermal considerations should be addressed when mounting the SY89329VMG-TR in a compact PCB footprint?
The SY89329VMG-TR comes in an 8-MLF® package (2x2 mm), which presents challenges for heat dissipation and signal routing due to its small size and exposed pad. Proper thermal management includes soldering the exposed pad to a solid ground plane to enhance heat spreading and improve reliability. High-current applications or prolonged operation near the upper end of the operating temperature range (up to 85°C ambient) may necessitate careful PCB stack-up and airflow planning. Additionally, minimizing trace lengths on high-speed differential pairs helps reduce EMI and impedance mismatches. Avoid placing nearby high-frequency switching nodes to prevent coupling noise into sensitive input lines.
What impact does supply voltage variation have on the output swing and noise immunity of the SY89329VMG-TR?
The SY89329VMG-TR typically operates with a VCC supply ranging from 2.375V to 3.63V. Deviations outside this window can affect output amplitude and rise/fall times. For example, reducing VCC below 2.5V may result in LVPECL outputs falling short of standard compliance thresholds, potentially causing downstream receiver errors. Conversely, operating at higher voltages improves drive strength but increases power consumption and electromagnetic emissions. Since LVPECL receivers expect a consistent differential swing (e.g., ~700 mV), maintaining stable VCC ensures reliable detection across varying load conditions. Power supply ripple should be kept below 50 mV p-p to avoid introducing jitter.
Is the SY89329VMG-TR suitable for automotive-grade applications, and what certifications or qualification standards apply?
The SY89329VMG-TR is specified for industrial temperature range (-40°C to 85°C TA), but it is not qualified to automotive-grade standards such as AEC-Q100 unless explicitly stated by the manufacturer. While RoHS3 compliance and MSL 1 indicate good handling and environmental suitability, automotive systems often demand extended temperature testing, functional safety analysis, and long-term reliability validation. If deploying in automotive contexts, engineers should verify with Microchip whether a qualified variant exists or consider alternative parts specifically designed for AEC-Q100 Grade 2 or higher requirements.
How should input termination be handled when driving the SY89329VMG-TR from long traces or external clock sources?
The SY89329VMG-TR accepts LVCMOS/LVTTL inputs without requiring external termination beyond standard pull-up/pull-down resistors if needed for logic state definition. However, when driven by long PCB traces or cables, impedance matching becomes critical to prevent ringing and overshoot. A series termination resistor near the source (typically 22–33 Ω) can dampen reflections, especially if the line exhibits significant capacitance or inductance. The input structure has limited ESD protection, so care must be taken during handling and routing to avoid static discharge. Avoid stubs on input paths and keep them short relative to the signal wavelength at expected data rates.
What are the implications of using the SY89329VMG-TR in multi-drop configurations or with multiple LVPECL loads?
The SY89329VMG-TR is intended for point-to-point LVPECL connections. Driving multiple loads simultaneously can overload its output drivers, leading to degraded rise times, increased jitter, or failure to meet minimum voltage swings. Each LVPECL receiver typically draws 3–5 mA, so cascading several may exceed the driver capability. Instead, use fanout buffers or re-drive ICs designed for multiple loads. In multi-drop scenarios, consider differential signaling protocols like CML or LVDS, which offer better drive efficiency and common-mode rejection. The SY89329VMG-TR lacks enable/disable features, so disabling unused outputs isn’t possible, further complicating shared bus topologies.
How does the SY89329VMG-TR perform in terms of power consumption during typical operation, and what strategies minimize energy usage in battery-powered systems?
Although the datasheet does not specify exact quiescent current, typical LVPECL translators consume around 5–10 mA per channel at nominal VCC (e.g., 3.3V). For the single-channel SY89329VMG-TR, total supply current is likely in the range of 6–12 mA. In power-sensitive designs, this can be significant if left enabled continuously. Since there is no built-in shutdown mode, system-level power gating is required—disconnecting VCC via a switch or enabling the upstream clock only when needed. Alternatively, consider lower-power translator families if duty cycling is feasible. Always verify actual consumption under real-world operating conditions with oscilloscope current probing.
Are there any known interoperability issues between the SY89329VMG-TR and common FPGA or ASIC I/O banks, particularly regarding setup/hold times and edge alignment?
Interoperability depends on matching timing budgets. The SY89329VMG-TR introduces fixed propagation delay, so clock edges arrive at the destination after a predictable latency. This simplifies synchronization with FPGA clocks, provided the internal delay is accounted for in constraint files. However, without explicit tSU/tH parameters listed, designers must derive these from characterization or rely on worst-case margins. When connecting to FPGA global clocks, ensure the input slew rate meets LVCMOS specifications to avoid misinterpretation. Edge alignment with data paths should be verified using IBIS models or simulation tools; marginal timing may cause metastability if not properly managed.
What precautions should be taken during reflow soldering when integrating the SY89329VMG-TR into automated assembly processes?
As an MSL 1 component, the SY89329VMG-TR can be stored indefinitely before use and does not require baking prior to reflow. However, adherence to the manufacturer’s recommended thermal profile is essential—typically peak temperatures between 240–260°C with limited time above liquidus (~60 seconds). Excessive thermal stress can delaminate the die or compromise solder joints, especially given the small pitch and exposed pad. Use nitrogen-assisted reflow if available to improve wetting. Inspect under magnification post-assembly for bridging or insufficient fillet formation, particularly around the corners of the MLF package.
How does the SY89329VMG-TR handle input glitches or noise spikes, and what filtering techniques are recommended for robust operation?
The device incorporates basic input filtering through internal clamping diodes and threshold hysteresis inherent to CMOS logic. However, very fast transients (>1 ns wide) may propagate if they exceed the noise margin. To enhance robustness, a small RC filter (e.g., 100 Ω + 10 pF) can be placed at the input to attenuate high-frequency noise without significantly affecting valid transitions. Ensure the RC time constant is much shorter than the shortest expected pulse width. Avoid excessive capacitance, which could slow down edge rates and increase susceptibility to crosstalk. Shielded routing and separation from noisy supplies also help maintain clean input signals.
What is the significance of the exposed pad in the 8-MLF® package, and how does it contribute to the performance and reliability of the SY89329VMG-TR?
The exposed pad serves dual purposes: electrical grounding and thermal dissipation. Connecting it directly to a low-impedance ground plane improves signal return paths, reduces ground bounce, and enhances EMI performance. Thermally, it acts as a heat spreader, lowering junction temperatures during operation and improving long-term reliability. Poor connection to the pad (e.g., via vias or inadequate copper area) leads to elevated thermal resistance, potentially triggering thermal shutdown or reducing MTBF. Best practices include using multiple vias under the pad and ensuring sufficient copper coverage in inner layers to maximize conduction and convection cooling.
Can the SY89329VMG-TR be used as a substitute for a crystal oscillator driver or clock generator in frequency synthesis applications?
No, the SY89329VMG-TR is not an oscillator—it functions purely as a translator and requires an external clock source to drive its input. It cannot generate frequencies or synthesize signals. Attempting to use it in place of an oscillator would result in no output activity. For frequency generation, designers must pair it with an appropriate crystal oscillator, MEMS resonator, or dedicated clock generator IC. The translator merely conditions and formats the incoming clock into LVPECL format for distribution to multiple receivers.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology SY89329VMG-TR

Product Attribute SY89329VMI-TR SY89328LMG-TR SY89327LMI-TR SY89328LMI-TR
Part Number SY89329VMI-TR SY89328LMG-TR SY89327LMI-TR SY89328LMI-TR
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Translator Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Output Type - Current - Unbuffered Voltage - Buffered -
Series - - - -
Features - - - Simultaneous Sampling
Data Rate - - - -
Channel Type - - - -
Input Signal - - - -
Output Signal - - - -
Channels per Circuit - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Circuits - - - -

SY89329VMG-TR Datasheet PDF

Download SY89329VMG-TR pdf datasheets and Microchip Technology documentation for SY89329VMG-TR - Microchip Technology.

Datasheets
Cylindrical Battery Holders.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Part Number
2.73KHz.pdf
PCN Packaging
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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SY89329VMG-TR Image

SY89329VMG-TR

Microchip Technology
32D-SY89329VMG-TR

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