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HomeProductsIntegrated Circuits (ICs)Specialized ICsKSZ8873RLLI-TR
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KSZ8873RLLI-TR - Microchip

Manufacturer Part Number
KSZ8873RLLI-TR
Manufacturer
Microchip Technology
Allelco Part Number
41D-KSZ8873RLLI-TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,100 pcs available, New & Original
Parts Description
LQFP-64
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 10100
  • Unit Price: $6.774
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $6.774 $6.77
10+ $6.479 $64.79
30+ $5.968 $179.04
100+ $5.521 $552.10
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

KSZ8873RLLI-TR Tech Specifications
Microchip - KSZ8873RLLI-TR technical specifications, attributes, parameters and parts with similar specifications to Microchip - KSZ8873RLLI-TR

Product Attribute Attribute Value
Part Number KSZ8873RLLI-TR
Package LQFP-64
Description LQFP-64
Stock Condition Get 10100 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Microchip Technology
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Parts Introduction

KSZ8873RLLI-TR Image
KSZ8873RLLI-TR (1)

Manufacturer Part Number

KSZ8873RLLI-TR

Manufacturer

microchip-technology

Introduction

The KSZ8873RLLI-TR is a highly integrated, compact, and low-power Ethernet switch controller from Microchip Technology. It provides a flexible and cost-effective solution for adding Ethernet connectivity to a wide range of applications, including industrial automation, home networking, and consumer electronics.

Product Features and Performance

Integrated 3-port 10/100 Mbps Ethernet switch with 2 MII/RMII interfaces

Supports advanced switching features such as VLAN, QoS, and port mirroring

Integrated PHY with AutoMDIX and auto-negotiation capabilities

Supports various power supply voltages (1.8V, 2.5V, 3.3V)

Low power consumption of 115mA typically

Product Advantages

Compact 64-LQFP package for space-constrained designs

Flexible interface options (I2C, SPI) for easy integration

Robust operating temperature range of -40°C to 85°C

Reliable and long-lasting performance

Key Reasons to Choose This Product

Highly integrated solution reducing system complexity and cost

Excellent power efficiency for battery-powered or low-power applications

Broad operating temperature range for industrial and harsh environments

Proven reliability and performance from a trusted manufacturer

Quality and Safety Features

RoHS-compliant and lead-free for environmentally-friendly manufacturing

Rigorous quality control and testing processes

Compatibility

The KSZ8873RLLI-TR is compatible with a wide range of Ethernet-enabled devices and systems, making it a versatile choice for various applications.

Application Areas

Industrial automation and control systems

Home networking equipment

Consumer electronics with Ethernet connectivity

Embedded systems requiring compact Ethernet switching functionality

Product Lifecycle

The KSZ8873RLLI-TR is an active and currently available product from Microchip Technology. There are no immediate plans for discontinuation, and customers can expect continued support and availability of this product. If you have any questions or require assistance, please contact our sales team through our website.

Frequently Asked Questions(FAQ)

How does the KSZ8873RLLI-TR handle auto-negotiation and link detection across its three Ethernet ports in mixed 10/100 Mbps environments?
The KSZ8873RLLI-TR supports IEEE 802.3u-compliant auto-negotiation on all three ports, enabling automatic speed and duplex mode selection between 10Base-T and 100Base-TX. Each port independently negotiates with connected devices, allowing seamless operation in heterogeneous networks. Link integrity is continuously monitored via differential signal detection and carrier sense, with status accessible through internal registers via I2C or SPI. In practice, this means a port connected to a legacy 10 Mbps hub will not disrupt 100 Mbps links on other ports, maintaining full non-blocking switching performance.
What are the power supply sequencing requirements for the KSZ8873RLLI-TR, and how does it behave during brownout conditions?
The KSZ8873RLLI-TR accepts 1.8V, 2.5V, and 3.3V supply rails, but proper sequencing is critical: the 3.3V I/O supply (VDDIO) should be stable before or simultaneously with the 1.8V core supply (VDDCORE). Reverse sequencing can cause latch-up or excessive inrush current. During brownout, the device lacks a built-in power-on reset (POR) circuit, so external monitoring is recommended. If VDDCORE drops below ~1.5V, internal state machines may become unstable, potentially corrupting MAC address tables or register settings—designs should include a supervisor IC to assert reset until all rails are valid.
Can the KSZ8873RLLI-TR support VLAN tagging and priority queuing in a cost-sensitive embedded switch design?
The KSZ8873RLLI-TR does not support hardware-based VLAN tagging (IEEE 802.1Q) or advanced QoS features like priority queuing or traffic shaping. It operates as a basic Layer 2 switch with store-and-forward architecture and basic frame filtering based on MAC addresses. For applications requiring VLAN segmentation or traffic prioritization, an external processor must handle tagging in software, which increases CPU load and latency. This limitation makes the KSZ8873RLLI-TR better suited for simple connectivity rather than managed switch applications.
How does the KSZ8873RLLI-TR compare to the KSZ8863FL in terms of interface flexibility and power consumption for industrial gateway designs?
The KSZ8873RLLI-TR offers dual-host interface options (I2C and SPI), providing greater flexibility in microcontroller selection compared to the KSZ8863FL, which typically uses a reduced MII (RMII) interface. However, the KSZ8873RLLI-TR consumes approximately 115mA under typical load, while the KSZ8863FL draws around 95mA, making the latter more suitable for ultra-low-power applications. Additionally, the KSZ8873RLLI-TR includes three PHYs versus two in the KSZ8863FL, enabling direct connection to more endpoints without external PHYs—ideal when board space and BOM count are constrained.
What thermal considerations should be addressed when deploying the KSZ8873RLLI-TR in an enclosed industrial enclosure with ambient temperatures up to 70°C?
The KSZ8873RLLI-TR operates from -40°C to 85°C, but power dissipation of ~380mW (at 115mA from 3.3V) generates measurable heat, especially in still air. In a sealed enclosure at 70°C ambient, junction temperature can approach 100°C without airflow or thermal vias. The 64-LQFP (10x10) package relies on PCB copper pour for heat spreading; a 2-layer board with minimal ground plane may require derating or forced convection. Thermal vias under the exposed pad and a solid ground plane on adjacent layers are recommended to maintain reliability over temperature cycling.
Is the KSZ8873RLLI-TR suitable for daisy-chaining multiple switches in a distributed sensor network without external magnetics?
The KSZ8873RLLI-TR requires external Ethernet magnetics on all RJ45-connected ports; it does not integrate onboard transformers. While one port can be used to uplink to another switch, each connection still needs discrete magnetics for signal integrity and isolation. Daisy-chaining multiple KSZ8873RLLI-TR-based nodes increases BOM complexity and board area. For compact multi-drop topologies, consider devices with integrated magnetics or alternative protocols like RS-485, unless the design already accommodates magnetics for EMI compliance.
How does the KSZ8873RLLI-TR manage broadcast storm mitigation and unknown unicast flooding in unmanaged switch mode?
The KSZ8873RLLI-TR lacks configurable broadcast storm control or rate limiting. In its default unmanaged mode, it forwards all broadcast, multicast, and unknown unicast frames to all ports except the source, per standard Layer 2 behavior. In networks with high broadcast traffic (e.g., DHCP-heavy environments), this can lead to bandwidth saturation. Engineers should implement network segmentation or rely on upstream managed switches for storm control. The device does support basic MAC address learning (up to 1K entries), which reduces flooding once the address table is populated.
What are the implications of the KSZ8873RLLI-TR’s MSL 3 rating for high-volume manufacturing and rework processes?
With an MSL 3 (168-hour floor life), the KSZ8873RLLI-TR must be baked at 125°C for 24 hours if exposed to ambient conditions beyond 168 hours post-dessicant seal. This affects just-in-time assembly lines where trays may sit between shifts. During rework, the 64-LQFP package is sensitive to thermal stress; reflow profiles should not exceed 260°C peak temperature, and dual-sided reflow should be avoided unless absolutely necessary. Proper handling and moisture barrier bagging are essential to prevent popcorning and ensure long-term reliability in humid environments.
Can the KSZ8873RLLI-TR operate reliably in a 2.5V-only supply system, and what performance trade-offs exist compared to 3.3V operation?
The KSZ8873RLLI-TR supports 2.5V operation on VDDIO, reducing I/O power consumption and enabling compatibility with lower-voltage MCUs. However, 2.5V signaling reduces noise margin on MDI lines, potentially affecting link stability in electrically noisy environments or with long cable runs (>50m). Additionally, SPI/I2C timing margins tighten slightly at 2.5V, requiring careful validation of setup/hold times with the host controller. For most industrial applications under 30m cable lengths, 2.5V operation is viable and offers a meaningful reduction in system power.
How does the KSZ8873RLLI-TR handle packet forwarding latency, and is it suitable for real-time control applications with deterministic timing requirements?
The KSZ8873RLLI-TR uses store-and-forward switching with typical latency of 30–50 μs per hop at 100 Mbps, depending on frame size. This latency is non-deterministic due to queuing delays during congestion and lack of traffic prioritization. For real-time control systems requiring sub-10 μs jitter or synchronized communication (e.g., EtherCAT or PROFINET), this device is not ideal. It is better suited for soft real-time applications like HMI communication or sensor data aggregation, where occasional latency variation is acceptable.
What level of ESD protection does the KSZ8873RLLI-TR provide on its Ethernet ports, and what external protection is recommended for outdoor installations?
The KSZ8873RLLI-TR includes basic ESD protection (~2kV HBM) on MDI pins, sufficient for office environments. However, for outdoor or industrial installations exposed to lightning-induced transients or cable discharge, external TVS diodes (e.g., Semtech RClamp2451ZA) should be placed near the RJ45 connector. A common-mode choke and gas discharge tube may also be needed for IEC 61000-4-5 compliance. Relying solely on internal protection risks latent damage or field failures under surge events.
How does the KSZ8873RLLI-TR compare to the LAN9353 in terms of integration level and host interface options for compact IoT edge nodes?
The KSZ8873RLLI-TR integrates three PHYs and a switch fabric in a single 64-LQFP package, reducing component count compared to discrete PHY + switch solutions. However, the LAN9353 offers USB 2.0 and RMII interfaces, enabling direct connection to application processors without a separate MAC, which the KSZ8873RLLI-TR lacks. For MCU-based designs using SPI or I2C, the KSZ8873RLLI-TR simplifies firmware development, while the LAN9353 is better suited for systems with USB hosts. Power consumption is comparable, but the KSZ8873RLLI-TR offers finer supply voltage granularity.
What debugging and monitoring capabilities are available through the KSZ8873RLLI-TR’s I2C/SPI interface during field deployment?
The KSZ8873RLLI-TR provides access to key status registers via I2C or SPI, including link status per port, auto-negotiation results, and error counters (e.g., CRC errors, alignment errors). These can be polled periodically to detect deteriorating links or EMI issues. However, it lacks advanced diagnostics like per-port bandwidth monitoring or packet capture. For remote diagnostics, firmware can log register snapshots and trigger alerts on threshold breaches, enabling predictive maintenance in distributed systems without requiring physical access.
Is the KSZ8873RLLI-TR compliant with automotive Ethernet standards, and can it be used in vehicle infotainment subsystems?
The KSZ8873RLLI-TR is not qualified to AEC-Q100 standards and lacks automotive-specific features such as extended temperature validation, radiated emissions control per CISPR 25, or fault-tolerant power management. While its -40°C to 85°C range overlaps with some automotive under-hood requirements, the absence of formal automotive certification makes it unsuitable for safety-critical or regulated vehicle systems. It may be used in non-critical applications like cabin accessories, but long-term reliability in automotive environments is not guaranteed.
How should the KSZ8873RLLI-TR be configured for lowest power consumption in a battery-powered remote monitoring device?
To minimize power, disable unused ports via software control to halt their PHYs, reducing current draw by ~30mA per disabled port. Operate the host interface at the lowest supported clock frequency (e.g., 100 kHz I2C) and use the 1.8V core supply to reduce dynamic power. Place the device in software-controlled sleep mode when network activity is absent, though wake-up latency (~10–20 ms) must be factored into system response time. Total current can drop below 50mA in light-load, single-port operation, extending battery life in intermittent-use scenarios.
What PCB layout practices are critical for maintaining signal integrity on the KSZ8873RLLI-TR’s MDI and host interface traces?
MDI traces (RX±, TX±) must be routed as 100Ω differential pairs with length matching within 5 mm and minimal vias to preserve signal integrity. Avoid crossing splits in reference planes. Keep SPI/I2C lines away from MDI traces to prevent crosstalk; if parallel routing is unavoidable, maintain 3x trace-width spacing. The 64-LQFP package requires a solid ground plane beneath the device, with thermal vias connecting to internal ground layers. Decoupling capacitors (0.1μF) should be placed within 2 mm of each VDD pin to suppress high-frequency noise.

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

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KSZ8873RLLI-TR Image

KSZ8873RLLI-TR

Microchip
41D-KSZ8873RLLI-TR

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