PIC16LF15325T-I/ST Tech Specifications
Microchip - PIC16LF15325T-I/ST technical specifications, attributes, parameters and parts with similar specifications to Microchip - PIC16LF15325T-I/ST

Product Attribute	Attribute Value
Part Number	PIC16LF15325T-I/ST
Package	TSSOP-14
Description	TSSOP-14
Stock Condition	Get 10500 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	Microchip Technology
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Parts Introduction

Manufacturer Part Number

PIC16LF15325T-I/ST

Manufacturer

microchip-technology

Introduction

The PIC16LF15325T-I/ST is a powerful and versatile 8-bit microcontroller from Microchip Technology. It features a PIC core, 14KB of FLASH program memory, and a wide range of on-chip peripherals, making it suitable for a variety of embedded applications.

Product Features and Performance

8-bit PIC core with 32MHz operating speed

14KB FLASH program memory, 1KB RAM, and 224 bytes of EEPROM

Supports I2C, LIN bus, SPI, and UART/USART communication interfaces

Integrated peripherals including brown-out detect/reset, power-on reset (POR), PWM, and watchdog timer

12 I/O pins for flexible interfacing with external devices

11-channel 10-bit ADC and 1-channel 5-bit DAC for analog signal processing

Internal oscillator for easy system design

Product Advantages

Highly integrated and cost-effective 8-bit microcontroller solution

Low-power XLP technology for extended battery life in portable applications

Robust on-chip peripherals for versatile system integration

Broad operating voltage range of 1.8V to 3.6V

Key Reasons to Choose This Product

Proven reliability and performance of the PIC microcontroller architecture

Ease of use and extensive development tools and resources from Microchip

Ideal for a wide range of embedded applications, from home automation to industrial control

Long-term product availability and support from a leading semiconductor manufacturer

Quality and Safety Features

Industrial-grade operating temperature range of -40°C to 85°C

Robust package options, including surface-mount 14-TSSOP

Compliance with relevant safety and environmental standards

Compatibility

The PIC16LF15325T-I/ST is compatible with other PIC® XLP™ 16F series microcontrollers, allowing for easy migration and reuse of existing designs.

Application Areas

Home and building automation

Industrial control and monitoring

Portable and battery-powered devices

General-purpose embedded systems

Product Lifecycle

The PIC16LF15325T-I/ST is an active product in Microchip's portfolio. There are several equivalent or alternative models available, such as the PIC16LF15324 and PIC16LF15323, which offer similar features and capabilities. For the most up-to-date information on product availability and alternative options, please contact our website's sales team.

Frequently Asked Questions(FAQ)

How does the PIC16LF15325T-I/ST compare to other 8-bit microcontrollers in terms of power efficiency when operating at 32MHz with a 1.8V supply?: The PIC16LF15325T-I/ST achieves a balance between performance and low-power operation typical of Microchip’s XLP technology, enabling active-mode current consumption in the low hundreds of microamps at 32MHz and 1.8V. This level of efficiency makes it suitable for battery-powered applications where extended runtime is critical. When compared to similarly clocked devices from competing vendors, its sub-1mA active current at full speed is competitive, though some ultra-low-power ARM Cortex-M0+ alternatives may achieve lower sleep currents. However, the 8-bit PIC architecture provides sufficient computational throughput for many embedded control tasks without requiring higher-performance cores.

What considerations are important when selecting an oscillator configuration for the PIC16LF15325T-I/ST in automotive or industrial environments?: Given the -40°C to 85°C operating range and reliance on internal oscillators, users should evaluate temperature drift and stability requirements. While the device includes an internal FRC (Fast RC) oscillator calibrated to ±1% at room temperature, external crystals or ceramic resonators may be preferable if precise timing or synchronization across multiple nodes is required. In noisy industrial environments, adding external filtering capacitors near the OSC1/OSC2 pins helps reduce susceptibility to electromagnetic interference. For applications requiring I2C or LINbus communication over long cables, tighter clock accuracy becomes more significant, potentially justifying the use of an external 4–20 MHz crystal despite the added component count.

Can the PIC16LF15325T-I/ST reliably drive inductive loads using its PWM peripherals, and what protection mechanisms should be considered?: Yes, the device supports up to three independent CCP/PWM modules capable of driving motor control, LED dimming, and switching regulators. However, inductive loads such as relays or motors generate back EMF that can damage GPIO pins if not properly managed. Designers should include flyback diodes across inductive loads and consider using external MOSFET drivers when switching currents exceed 20 mA per pin. The microcontroller’s integrated dead-time generation in PWM mode helps prevent shoot-through in half-bridge configurations, but careful layout and decoupling remain essential for stable operation at high duty cycles.

How does the EEPROM memory size of the PIC16LF15325T-I/ST influence system design decisions regarding firmware updates or calibration data storage?: With 224 bytes of user-accessible EEPROM organized as 224 x 8 bits, this MCU is suitable for storing non-volatile configuration parameters such as trim values, serial numbers, or factory calibration offsets. However, due to limited write endurance (typically 100k cycles), frequent updates must be minimized. A common practice is to implement wear-leveling logic in software for critical data, writing only when changes occur rather than on every boot. Compared to devices with larger EEPROM blocks, this constraint encourages efficient data structures—for example, using delta encoding or compressing configuration payloads before storage.

Is the PIC16LF15325T-I/ST compatible with 5V systems, and how does voltage translation affect its I/O interface reliability?: The device operates from 1.8V to 3.6V, meaning direct connection to 5V signals without level shifting is not permitted and would likely cause permanent damage. To interface with 5V logic, bidirectional level translators such as the TXB0104 or discrete MOSFET-based solutions are recommended. These ensure clean transitions on UART, SPI, or I2C lines while maintaining signal integrity. Careful attention to propagation delay matching is necessary when translating high-speed signals; otherwise, setup and hold times on synchronous interfaces like SPI could be violated. Using Schottky clamping diodes at each I/O pin provides additional protection against transient overvoltages.

What trade-offs exist between using the internal ADC versus an external precision ADC when measuring sensor outputs with the PIC16LF15325T-I/ST?: The built-in 10-bit ADC offers 11 channels with sample-and-hold capability and can operate at up to 500 ksps in fast conversion mode. Its resolution and speed are adequate for many temperature, voltage, and basic current sensing applications. However, for measurements requiring better than 1% accuracy over temperature, an external precision ADC like the MCP3204 or ADS7830 may provide superior linearity and lower offset error. The decision hinges on whether the application demands calibration routines, multi-point linearization, or operation outside the -20°C to +85°C range where internal reference drift becomes more pronounced.

How should designers manage power-on reset behavior when integrating the PIC16LF15325T-I/ST into systems with variable startup conditions?: The device includes Power-on Reset (POR) and Brown-out Detect (BOD) circuitry that ensures reliable initialization across the full supply range. The BOD threshold is typically fixed at 1.9V or 2.7V depending on fuse settings, which prevents operation below safe levels during brownout events. During prototyping or battery-powered deployments, adding a soft-start circuit or bulk capacitor on VDD helps avoid excessive inrush current while allowing the BOD to function correctly. It's also advisable to monitor POR/BOR status flags in code to distinguish between normal boot and recovery from brownout, enabling appropriate fault handling.

What factors determine whether to use the internal vs. external watchdog timer implementation with the PIC16LF15325T-I/ST?: The PIC16LF15325T-I/ST integrates a Window Watchdog Timer (WDT) that operates independently of the CPU clock, making it highly reliable for detecting hangs or infinite loops. However, if deterministic timing is needed—such as enforcing periodic task execution within strict deadlines—an external RTC module with its own watchdog might offer finer granularity. Conversely, relying solely on the internal WDT simplifies PCB layout but limits flexibility; for complex systems with multiple software states, combining the WDT with software heartbeat monitoring increases robustness. Ultimately, the choice depends on system complexity, safety requirements, and whether the watchdog must interact with real-time scheduling.

How does the package thermal performance of the 14-TSSOP affect heat dissipation in densely populated PCBs with the PIC16LF15325T-I/ST?: The 14-TSSOP (4.4 mm width) provides limited exposed thermal pad options compared to QFN packages, resulting in higher junction-to-ambient thermal resistance. At 32MHz with all peripherals active, self-heating may push the die temperature above ambient by several degrees, particularly in confined enclosures. Designers should minimize copper pour under the IC, avoid placing heat-sensitive components nearby, and ensure adequate airflow or ground plane ventilation. In high-duty-cycle PWM applications, consider adding a small heatsink or relocating the IC away from other warm components. Thermal simulation tools or empirical testing under worst-case load conditions are recommended to validate reliability.

What steps should be taken to ensure reliable I2C communication when connecting multiple slaves to the PIC16LF15325T-I/ST in a noisy environment?: The device supports standard (100 kHz), fast (400 kHz), and high-speed (1 MHz) I2C modes. To enhance noise immunity, pull-up resistors should be chosen based on bus capacitance and target rise time—typically 2.2 kΩ to 10 kΩ for short traces. Adding series termination resistors (e.g., 100 Ω) near the master and slave inputs can dampen reflections. Ferrite beads on VDD lines and proper decoupling capacitors (1 µF + 0.1 µF) near the MCU further stabilize the supply. Additionally, implementing retry logic in firmware with exponential backoff improves robustness during transient faults. Avoid routing I2C lines parallel to high-speed digital signals to prevent crosstalk.

What limitations apply when using the internal voltage reference for ADC conversions in the PIC16LF15325T-I/ST?: The internal 1.024V or 2.048V reference has initial accuracy of ±10 mV and drifts approximately ±50 ppm/°C over temperature. This limits absolute measurement precision unless calibrated. For relative measurements (e.g., comparing two sensor readings), this drift may be acceptable. However, for applications requiring high-resolution absolute voltage measurement, an external precision bandgap reference such as the LT6654 provides much tighter tolerance (±0.05% over -40°C to +85°C). If using the internal reference, always enable the ADREF fuse and verify reference stability before initiating conversions.

How does the flash memory organization of the PIC16LF15325T-I/ST impact bootloader development and field firmware update strategies?: With 14 KB of program memory divided into pages of 64 words each, the flash can be erased and rewritten in page increments. This structure supports simple in-application programming (IAP) routines but requires careful management to avoid corrupting active code during writes. Bootloaders must reserve a dedicated section for new firmware and perform verification after download—commonly using checksums or CRC validation. Because flash erase/write cycles are limited (~10k cycles), bootloaders should minimize unnecessary reprogramming. Some designs use dual-bank flash or store firmware in external SPI flash, offloading wear from the MCU.

What precautions are necessary when configuring the LINbus transceiver interface on the PIC16LF15325T-I/ST?: The LINbus peripheral operates at 12 V logic levels, but the MCU itself runs at 1.8–3.6V. Therefore, a dedicated LIN transceiver IC (e.g., TJA1020 or MCP2021A) is required to handle voltage translation and differential signaling. Proper biasing resistors and TVS diodes are essential for protecting against automotive transients. Firmware must adhere to LIN protocol timing specifications, including inter-byte delays and response window alignment. Baud rate selection affects both compatibility and noise resilience—lower rates (e.g., 19.2 kbps) improve reliability in electrically noisy environments.

Can the PIC16LF15325T-I/ST support real-time clock functionality without an external crystal?: No, the device lacks an integrated RTC module. Without an external crystal, there is no accurate timekeeping mechanism. To add timing capabilities, an external RTC chip (e.g., DS3231 or PCF85063A) connected via I2C is typically used. Alternatively, a low-cost 32.768 kHz crystal can be added directly to OSC1/OSC2 pins with appropriate load capacitors (e.g., 12 pF), effectively turning the MCU into a real-time clock controller. This approach trades simplicity for slightly increased power consumption and component count but remains viable for many battery-backed timing applications.

How should designers address ESD protection when mounting the PIC16LF15325T-I/ST in production environments?: Although the device has inherent ESD protection diodes on each pin, they are rated for HBM Class 2 (~2 kV). Production handling, especially in manual assembly or rework scenarios, risks exceeding these limits. Implementing ESD-safe practices—such as using grounded wrist straps, ESD mats, and ionizers—is crucial. Additionally, placing transient voltage suppressors (TVS) close to connectors or exposed pads can divert high-energy events away from sensitive nodes. For final product qualification, IEC 61000-4-2 testing at Level 3 (±4 kV contact discharge) should be performed to validate robustness.

What role does the Moisture Sensitivity Level (MSL) rating of MSL 1 play in manufacturing and storage of the PIC16LF15325T-I/ST?: An MSL rating of 1 indicates unlimited floor life under dry conditions, meaning the device can be stored indefinitely without baking before reflow soldering. This simplifies inventory management and reduces post-reflow inspection costs. However, it assumes packaging remains intact and humidity exposure is minimal. In humid climates or prolonged storage, even sealed tape and reel packs can accumulate moisture over months. Following IPC/JEDEC J-STD-033 guidelines, periodic visual checks and adherence to shelf-life labels remain prudent. For high-reliability applications, implementing bake-out protocols preemptively protects against popcorning during reflow.

How do the available communication peripherals (UART, SPI, I2C, LIN) on the PIC16LF15325T-I/ST influence network topology choices in distributed control systems?: The combination of UART (asynchronous point-to-point), SPI (high-speed master-slave), I2C (multi-drop low-speed), and LIN (automotive-grade single-master) allows flexible system architectures. For sensor networks requiring moderate bandwidth, I2C enables up to 100 devices on shared lines with minimal wiring. SPI suits faster data acquisition from ADCs or displays with dedicated chip selects. LIN provides cost-effective daisy-chaining for actuator nodes in vehicles. UART remains ideal for debug output or interfacing with legacy modules. Designers must balance line capacitance, baud rate, and addressing overhead when selecting the dominant protocol for scalability and latency constraints.

What implications does the 8-bit core size have on algorithm complexity when using the PIC16LF15325T-I/ST for digital signal processing tasks?: The 8-bit PIC® core executes instructions in one cycle but lacks hardware multiply-accumulate units, limiting native support for complex DSP operations like FIR filtering or FFTs. Floating-point calculations require software libraries with reduced precision, increasing code size and execution time. While acceptable for low-order filters or envelope detection, computationally intensive tasks may exceed real-time deadlines. In such cases, downsampling input data, using lookup tables, or offloading math to external co-processors becomes necessary. The trade-off favors simplicity and power efficiency over peak performance, making the PIC16LF15325T-I/ST better suited for control-oriented rather than signal-processing-heavy applications.

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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