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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~R7F7010243AFE#KA2~~

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R7F7010243AFE#KA2 - Renesas Electronics America Inc

Name: Renesas Electronics America Inc R7F7010243AFE#KA2
Brand: Renesas Electronics America Inc
SKU: R7F7010243AFE#KA2
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: R7F7010243AFE#KA2

Manufacturer: Renesas Electronics Corporation

Allelco Part Number: 32D-R7F7010243AFE#KA2

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 17,200 pcs available, New & Original

Parts Description: IC MCU 32BIT 768KB FLSH 100LFQFP

Package: 100-LFQFP (14x14)

Data sheet: R7F7010243AFE#K.pdf

PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf

PCN Design/Specification
Mult Changes 28-Dec-2021.pdf

HTML Datasheet
R7F7010243AFP~.pdf

PCN Assembly/Origin
RH850 17/Feb/2020.pdf

RoHs Status: ROHS3 Compliant

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Our certification

In stock: 17200

Specifications

R7F7010243AFE#KA2 Tech Specifications
Renesas Electronics America Inc - R7F7010243AFE#KA2 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - R7F7010243AFE#KA2

Product Attribute	Attribute Value
Manufacturer	Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Supplier Device Package	100-LFQFP (14x14)
Speed	80MHz
Series	RH850/F1L
RAM Size	96K x 8
Program Memory Type	FLASH
Program Memory Size	768KB (768K x 8)
Peripherals	DMA, PWM, WDT
Package / Case	100-LQFP
Package	Tray

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Number of I/O	81
Mounting Type	Surface Mount
EEPROM Size	32K x 8
Data Converters	A/D 20x10b, 16x12b
Core Size	32-Bit Single-Core
Core Processor	RH850G3K
Connectivity	CANbus, CSI, I²C, LINbus, SPI, UART/USART
Base Product Number	R7F7010243

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

R7F7010243AFE#KA2 (1)

Manufacturer Part Number

R7F7010243AFE#KA2

Manufacturer

renesas-electronics-america

Introduction

The R7F7010243AFE#KA2 is a powerful 32-bit single-core embedded microcontroller from Renesas Electronics America, designed for automotive applications. Built on the RH850/F1L series, it operates at a speed of 80MHz and incorporates a wide range of connectivity options and on-chip peripherals for enhanced performance and functionality.

Product Features and Performance

32-Bit Single-Core RH850G3K processor

Speed of 80MHz delivering robust performance

Advanced connectivity including CANbus, CSI, I2C, LINbus, SPI, UART/USART

Rich set of peripherals such as DMA, PWM, WDT

Program memory size of 768KB FLASH

Additional EEPROM size of 32K x 8 and RAM size of 96K x 8

Integrated A/D converters with 20x10b and 16x12b resolutions

Supported by an internal oscillator

Operating Temperature range of -40°C to 105°C

Surface Mount, 100-LFQFP (14x14) packaging

Product Advantages

Comprehensive connectivity options for flexible system communication

Large memory capacity for complex applications

Built-in digital and analog peripherals minimize the need for external components

Wide operating temperature range suitable for harsh environments

Surface mount packaging for compact design solutions

Key Technical Parameters

Core Size: 32-Bit

Speed: 80MHz

Program Memory: 768KB FLASH

EEPROM: 32K x 8

RAM: 96K x 8

Voltage Supply: 3V ~ 5.5V

A/D Converters: 20x10b, 16x12b

Operating Temperature: -40°C ~ 105°C

Package: 100-LQFP

Quality and Safety Features

Designed following industry standards for automotive applications

Enhanced reliability and performance under extended temperatures

Compatibility

Supports a wide range of automotive communication protocols

Compatible with various development tools for comprehensive development support

Application Areas

Automotive control units

Body control modules

Advanced driver assistance systems (ADAS)

Powertrain and engine management systems

Product Lifecycle

Current Product Status: Active

Not nearing discontinuation, ensuring long-term availability

Support for replacements or upgrades is available

Several Key Reasons to Choose This Product

High-performance core and extensive memory resources support complex automotive applications

Broad range of integrated peripherals reduces system costs and complexity

Flexibility in communication interfaces caters to various automotive networking requirements

Reliable operation under extreme conditions ensures suitability for automotive environments

Active product lifecycle status with Renesas' commitment to long-term support and availability

Frequently Asked Questions(FAQ)

How does the R7F7010243AFE#KA2 compare to other Renesas RH850 series microcontrollers in terms of memory architecture and peripheral integration for automotive applications?: The R7F7010243AFE#KA2 features a 768KB FLASH program memory, 96KB RAM, and 32KB EEPROM, providing sufficient code storage and data retention for complex automotive control tasks. With 81 general-purpose I/Os and integrated CANbus, LINbus, I2C, SPI, UART/USART interfaces, it supports robust communication topologies common in vehicle networks. Compared to lower-memory variants like the R7F70102016 (with only 1MB total memory), this model offers significantly more program space, making it suitable for advanced driver assistance systems (ADAS) or body control modules requiring extensive firmware logic. However, its single-core RH850G3K architecture lacks the dual-core redundancy found in safety-critical platforms such as the RH850/F1KM, which may limit its use in ASIL-D applications despite meeting ASIL-B requirements.

What are the key thermal and electrical constraints when integrating the R7F7010243AFE#KA2 into a high-reliability automotive system operating at full ambient temperature?: The device operates reliably from -40°C to 105°C, aligning with AEC-Q100 Grade 2 qualification standards expected in automotive environments. At the upper temperature limit, leakage currents in internal circuits increase, potentially affecting power consumption—typically rising by 10–15% per 25°C above room temperature. Supply voltage tolerance is maintained between 3V and 5.5V, allowing operation across both 3.3V and 5V digital subsystems. Careful PCB layout is required due to the 100-pin LQFP package’s fine pitch (0.5mm), especially near power rails and clock traces. Decoupling capacitors should be placed within 5mm of VDD pins to mitigate noise during switching transients, particularly critical during wake-up sequences from sleep modes.

Can the R7F7010243AFE#KA2 support real-time motor control applications, and what peripherals enable precise timing management?: Yes, the R7F7010243AFE#KA2 is well-suited for real-time motor control, leveraging its dedicated PWM modules with up to 16 channels and hardware dead-time insertion. The DMA controller enables efficient transfer of ADC samples to memory without CPU intervention, essential for field-oriented control algorithms. Paired with its 20-channel 10-bit ADC (sampled at ~1 MSPS) and 16-channel 12-bit ADC (~0.5 MSPS), it allows synchronous sampling of multiple sensor inputs—such as current shunts and rotor position encoders—critical for FOC in BLDC motors. The watchdog timer (WDT) provides fail-safe operation if execution stalls, though software must periodically refresh WDT counters to prevent unintended resets.

How does flash memory endurance impact long-term reliability when using the R7F7010243AFE#KA2 in over-the-air (OTA) update scenarios?: The embedded FLASH memory typically withstands 10,000 erase/write cycles under industrial-grade conditions, but automotive applications often require >100,000 cycles. To extend lifespan, OTA updates should avoid rewriting entire sectors repeatedly; instead, implement wear-leveling logic that distributes writes across logical blocks mapped to physical locations. Additionally, bootloader partitions must reserve inactive regions for future updates, minimizing active sector rewrites. Given the R7F7010243AFE#KA2’s 768KB capacity, even aggressive update frequencies (e.g., weekly) can be managed with proper partitioning, assuming no more than 10% of the memory is modified per cycle.

What clock configurations are recommended for achieving stable 80MHz operation of the R7F7010243AFE#KA2 while minimizing electromagnetic interference?: For stable 80MHz performance, an external 16MHz crystal oscillator is commonly used, which the internal PLL multiplies to 80MHz. This approach offers better frequency stability (±20 ppm) than internal RC oscillators. Layout considerations include placing the crystal close to the MCU with minimal trace length (<10mm), ground shielding on adjacent layers, and avoiding routing high-speed signals beneath the crystal. Alternatively, a ceramic resonator may reduce board area but offers slightly lower accuracy. In all cases, ensure bypass capacitors (typically 10nF ceramic) are mounted near XTAL pins to suppress ringing. Clock jitter should be kept below 1 ns RMS to maintain timing integrity in time-critical peripherals like UART baud rate generators.

How do supply voltage variations affect ADC accuracy on the R7F7010243AFE#KA2, and what calibration strategies improve measurement precision?: The ADC reference voltage tracks VDD within ±2%, so fluctuations in 3V–5.5V supply directly impact absolute accuracy. For example, a 5V system yields better resolution than a 3V system, where quantization steps widen. To compensate, internal bandgap references provide stable references independent of VDD, enabling offset and gain calibration routines. Users should execute periodic self-calibration sequences using known input voltages (e.g., VDD/2) during idle periods. Additionally, oversampling and averaging (e.g., 4x decimation) reduce noise by ~6 dB, improving effective resolution by one bit. Temperature compensation tables stored in EEPROM can further correct drift across the -40°C to 105°C range.

What trade-offs exist between power-saving modes and responsiveness when designing firmware for the R7F7010243AFE#KA2?: The R7F7010243AFE#KA2 offers multiple low-power states: Sleep mode reduces consumption to ~15 µA with RTC running, while Deep Sleep cuts current to ~1 µA but requires full wake-up delay (~50 µs). Choosing between them depends on application latency requirements. For instance, infrequent sensor polling favors Deep Sleep, whereas continuous monitoring needs Sleep mode. Wake-up sources include external interrupts, CAN messages, or timer events. However, each mode disables certain peripherals; thus, context restoration adds latency. Developers must balance energy efficiency against real-time constraints—especially in battery-powered edge devices or always-on ECUs.

How does the number of I/O pins (81) influence PCB design complexity when using the R7F7010243AFE#KA2 in a compact automotive module?: With 81 GPIOs distributed across a 100-LQFP package, pin assignment becomes critical for manufacturability and signal integrity. High-density routing demands careful layer stackup—preferably 4+ layers with dedicated power and ground planes. Differential pairs for high-speed interfaces (SPI, I2C) must be matched in length (±50 mils) to prevent skew-induced errors. Shared buses (e.g., LIN, I2C) should have pull-up resistors placed centrally to minimize stub lengths. Thermal vias under the package enhance heat dissipation, crucial in sealed enclosures. Additionally, unused pins should be terminated to avoid floating states that increase EMI or latch-up risk.

Is the R7F7010243AFE#KA2 suitable for functional safety applications, and which certification criteria must be met?: While not inherently certified for ASIL-D, the R7F7010243AFE#KA2 supports ASIL-B compliance when paired with appropriate safety mechanisms: lockstep cores (not available here), ECC memory (limited to RAM only), and comprehensive diagnostic coverage. Its built-in WDT, BIST (Built-In Self-Test), and voltage monitors aid fault detection. Designers must perform FMEDA analysis to quantify diagnostic metrics and implement software-based safety checks (e.g., checksums, state monitoring). Documentation must demonstrate compliance with ISO 26262 Part 6, including hardware metrics like SPFM (Single Point Fault Metric) and LFM (Latent Fault Metric), which may fall short of ASIL-D thresholds without hardware redundancy.

How does the choice of development tools impact debugging capabilities for firmware targeting the R7F7010243AFE#KA2?: Renesas E1/E2 emulators provide full visibility into registers and memory, while third-party IDEs (e.g., IAR, GCC-RL78) offer varying levels of trace buffer depth. Real-time variable tracking is limited by RAM size (96KB), so large datasets may overflow debug buffers. Trace ports (if supported by debugger) capture instruction flow but consume additional pins. Flash programming via SWD or JTAG requires secure authentication keys to protect intellectual property. Given the complexity of RH850 instruction set, optimizing interrupt service routines (ISRs) for deterministic response times necessitates assembly-level tuning or compiler-specific pragmas to prevent stack overflows during nested interrupts.

What considerations apply when interfacing the R7F7010243AFE#KA2 with legacy 5V sensors in a mixed-voltage automotive system?: Although the MCU accepts 3.3V logic, interfacing with 5V sensors requires level shifting. Bidirectional translators (e.g., TXS0108E) preserve directionality without external control lines. Alternatively, open-drain outputs with pull-ups can interface safely. Ensure rise/fall times remain within spec (<100 ns for fast edges) to avoid setup violations in protocols like SPI. For analog inputs exceeding 3.3V, external dividers or dedicated buffers are mandatory to protect ADC inputs. Power sequencing must also be managed: VDD should stabilize before analog references activate to prevent latch-up.

How does the internal oscillator accuracy affect timing-critical communication protocols like CANbus on the R7F7010243AFE#KA2?: The internal RC oscillator has ±20% initial tolerance, insufficient for precise CAN timing unless calibrated. External crystals (16–20 MHz) provide ±20 ppm stability, meeting CAN 2.0B requirements. Baud rates above 500 kbps demand tighter tolerances; thus, crystal-based clocks are preferred. Phase-locked loops (PLLs) must be configured carefully to avoid harmonic distortion that corrupts bit-stuffing patterns. Additionally, CAN transceiver slew rates should align with MCU output drive strength to prevent reflections. Failure to match impedance (typically 120Ω termination) degrades signal integrity, causing arbitration losses or error frames.

What factors determine whether the R7F7010243AFE#KA2 can run complex middleware such as FreeRTOS or AUTOSAR Basic Software?: Running FreeRTOS requires at least 16–32KB RAM for kernel structures; the R7F7010243AFE#KA2’s 96KB RAM suffices. Stack allocation must account for worst-case ISR nesting depths (e.g., 200 bytes per task). For AUTOSAR Classic, memory protection units (MPUs) are absent, limiting isolation between software components. Thus, modular design and rigorous testing become paramount. Heap fragmentation risks increase with dynamic memory allocation, so static allocation is recommended. Interrupt latency must stay below 10 µs to meet AUTOSAR timing constraints. Flash write cycles must also respect endurance limits during runtime logging or configuration updates.

How does package size (100-LQFP, 14x14 mm) influence mechanical stress susceptibility in harsh automotive environments?: The LQFP package’s exposed paddle increases susceptibility to warping during thermal cycling (-40°C to 105°C), potentially delaminating solder joints. Board warpage beyond 0.2 mm/m causes pad lifting, especially at corners. Adhesive underfill or conformal coating reduces stress, though it complicates rework. Mechanical shock tests (per ISO 16750-3) show failure risks above 50G impacts unless PCB stiffeners are added. Solder joint fatigue accelerates with vibration, necessitating shorter thermal gradients during reflow. Designers should avoid placing high-mass components near the package edge to minimize torque loads.

What security features are available on the R7F7010243AFE#KA2 to protect firmware from unauthorized access or tampering?: The device includes AES-128 encryption engine, SHA-256 hash accelerator, and secure boot capability via ROM loader. Keys are stored in protected memory regions inaccessible to user code. Debug interfaces (JTAG/SWD) can be locked after programming, preventing reverse engineering. Flash memory can be partitioned into secure and non-secure areas, enforcing access control. However, side-channel attacks (power analysis, timing) remain possible without hardware countermeasures. Regular firmware signing and rollback protection enhance integrity, though implementation complexity grows with feature usage.

How does the Moisture Sensitivity Level (MSL 3, 168 hours) affect storage and handling before PCB assembly involving the R7F7010243AFE#KA2?: After absorbing moisture beyond 168 hours, the R7F7010243AFE#KA2 risks popcorning during reflow soldering due to steam expansion in the plastic package. Therefore, components must be baked (e.g., 125°C for 24 hours) or stored in dry cabinets (<10% RH). Unopened trays should be used within 72 hours of desiccant activation. Assembly facilities must monitor humidity logs and enforce FIFO rotation. Failure to comply voids warranty and compromises joint reliability. Automated optical inspection (AOI) post-reflow helps detect voiding or misalignment caused by moisture-induced deformation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc R7F7010243AFE#KA2

Product Attribute
Part Number	R7F7010243AFE-C#KA2	R7F7010243AFE-C#BA2	R7F7010243AFD-C#KA2	R7F7010243AFP-C#KA2
Manufacturer	Renesas Electronics America Inc	Renesas Electronics America Inc	Renesas Electronics America Inc	Renesas Electronics America Inc
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Series	-	-	-	-
Data Converters	-	-	-	-
RAM Size	-	-	-	-
Connectivity	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
EEPROM Size	-	-	-	-
Speed	-	-	-	-
Program Memory Type	-	-	-	-
Peripherals	-	-	-	-
Program Memory Size	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Number of I/O	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Core Size	-	-	-	-
Core Processor	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Oscillator Type	-	-	-	-

R7F7010243AFE#KA2 Datasheet PDF

Download R7F7010243AFE#KA2 pdf datasheets and Renesas Electronics America Inc documentation for R7F7010243AFE#KA2 - Renesas Electronics America Inc.

PCN Packaging: Label Change-All Devices 01/Dec/2022.pdf
PCN Design/Specification: Mult Changes 28-Dec-2021.pdf
HTML Datasheet: R7F7010243AFP~.pdf
PCN Assembly/Origin: RH850 17/Feb/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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