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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersR7S910017CBG#AC0
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R7S910017CBG#AC0 - Renesas Electronics America Inc

Manufacturer Part Number
R7S910017CBG#AC0
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
32D-R7S910017CBG#AC0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,242 pcs available, New & Original
Parts Description
IC MCU 32BIT ROMLESS 320FBGA
Package
320-FBGA (17x17)
Data sheet
R7S910017CBG#AC.pdf

PCN Packaging

2.73KHz.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Specifications

R7S910017CBG#AC0 Tech Specifications
Renesas Electronics America Inc - R7S910017CBG#AC0 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - R7S910017CBG#AC0

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.6V
Supplier Device Package 320-FBGA (17x17)
Speed 450MHz
Series RZ/T1
RAM Size 1.5M x 8
Program Memory Type ROMless
Program Memory Size -
Peripherals DMA, POR, PWM, WDT
Package / Case 320-FBGA
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Number of I/O 209
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 24x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-R4F
Connectivity CANbus, CSI, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Base Product Number R7S910017

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

R7S910017CBG#AC0 Image
R7S910017CBG#AC0 (1)

Manufacturer Part Number

R7S910017CBG#AC0

Manufacturer

renesas-electronics-america

Introduction

The R7S910017CBG#AC0 is a high-performance, 32-bit single-core ARM® Cortex®-R4F microcontroller from Renesas Electronics. Designed for a wide range of embedded applications, this device offers a comprehensive set of peripherals and interfaces, including CAN, Ethernet, USB, and more. With a clock speed of 450MHz, it delivers exceptional processing power and responsiveness, making it suitable for demanding real-time control and industrial automation tasks.

Product Features and Performance

32-bit ARM Cortex-R4F core operating at 450MHz

Extensive peripheral set including CAN, Ethernet, USB, I2C, SPI, and more

5MB x 8 RAM for high-performance data processing

24-channel, 12-bit ADC for precision analog signal acquisition

Integrated DMA, PWM, and watchdog timer for efficient system control

Wide operating voltage range of 1.14V to 3.6V, supporting a variety of power configurations

Extended temperature range of -40°C to 125°C, enabling use in harsh environments

Product Advantages

Powerful 32-bit ARM Cortex-R4F core for demanding real-time applications

Diverse peripheral set for seamless integration with a wide range of systems

Ample on-chip memory for complex data processing and storage

Flexible power supply options and extended temperature range for versatile deployment

Renesas' reputation for quality and reliability in the embedded market

Key Reasons to Choose This Product

Exceptional processing performance and responsiveness for time-critical applications

Comprehensive peripheral set for enhanced system integration and functionality

Scalable memory and I/O options to meet diverse application requirements

Trusted Renesas brand and engineering support for reliable long-term use

Cost-effective solution for high-volume embedded and industrial automation projects

Quality and Safety Features

Robust design and manufacturing process to ensure long-term reliability

Comprehensive safety features, including watchdog timer and power-on reset, for secure operation

Compliance with industry standards and certifications for use in demanding environments

Compatibility

The R7S910017CBG#AC0 is compatible with a wide range of development tools, software, and hardware platforms from Renesas and third-party vendors, enabling seamless integration into various embedded systems.

Application Areas

Industrial automation and control

Robotics and motion control

Automotive electronics and infotainment

Medical devices and equipment

Aerospace and defense systems

Smart home and building automation

Product Lifecycle

The R7S910017CBG#AC0 is an active product in our website's sales team's portfolio. While there may be newer or more advanced models available, this device continues to be a popular choice for many embedded applications. Customers are advised to check with our website's sales team for the latest information on product availability and potential alternative or equivalent options.

Frequently Asked Questions(FAQ)

How does the R7S910017CBG#AC0 handle power sequencing when transitioning between low-power and active modes in an embedded system?
The R7S910017CBG#AC0 operates across a supply voltage range of 1.14V to 3.6V, which enables flexible power management strategies typical of high-performance microcontrollers. When transitioning from low-power to active states, careful attention must be paid to voltage ramp rates to avoid internal latch-up or reset glitches. The device includes power-on reset (POR) circuitry that activates during initial power-up or brown-out conditions, ensuring a defined startup state. Designers should ensure that VDD ramps within the specified window while maintaining stable decoupling capacitance near the FBGA pads to minimize transient noise during mode transitions.
What are the key differences in interrupt handling between the ARM® Cortex®-R4F core in the R7S910017CBG#AC0 and other common microcontroller architectures?
The ARM® Cortex®-R4F core integrated into the R7S910017CBG#AC0 supports deterministic interrupt responses with latency as low as 6 cycles under optimal conditions, thanks to its tightly coupled interrupt controller and fast context switching. Unlike simpler 8/16-bit MCUs or even some Cortex-M variants, this RZ/T1 implementation includes support for nested vectored interrupts (NVIC) with configurable priority levels and tail-chaining capabilities. This architecture is particularly beneficial for real-time applications requiring predictable timing, such as motor control or industrial automation, where interrupt jitter must be minimized.
In what scenarios would the absence of internal program memory in the R7S910017CBG#AC0 necessitate external flash, and how does this affect boot time and reliability?
The R7S910017CBG#AC0 is ROMless by design, meaning it lacks onboard non-volatile program storage. Therefore, all application code must reside in an external parallel NOR or NAND flash connected via the EBI/EMI interface. This configuration increases system complexity but allows flexibility in memory capacity and density. Boot time becomes dependent on the speed of the external memory and initialization routines; slower interfaces can extend boot sequences beyond 50 ms, which may impact user-facing systems. However, using reliable, industrial-grade flash modules ensures data integrity over the full -40°C to 125°C operating range.
How does the R7S910017CBG#AC0 manage thermal performance under sustained 450MHz operation with all peripherals active?
Operating at 450MHz continuously generates significant dynamic power, estimated around 1.8W based on typical leakage and switching characteristics for a 1.2V core at this frequency. Given the small 17x17mm FBGA package, thermal dissipation relies heavily on PCB copper area and airflow. Without a heatsink, junction temperatures can exceed 100°C in compact enclosures, potentially triggering thermal shutdown if not managed. Designers should implement proper thermal vias beneath the package and consider dynamic clock gating or adaptive frequency scaling during non-critical tasks to maintain safe operating margins.
Can the R7S910017CBG#AC0 support dual Ethernet ports simultaneously, and what hardware resources limit this capability?
While the R7S910017CBG#AC0 features a Gigabit Ethernet MAC as part of its peripheral suite, only one Ethernet port can be fully utilized due to shared PHY interface signals and limited pin availability in the 320-ball FBGA configuration. Attempting to drive two external PHYs simultaneously would require duplicating critical lines like MII/RMII clocks and reference signals, which are not independently routed. Thus, multi-port networking must rely on external switches or additional processing units, increasing board complexity and cost.
What trade-offs exist between using the internal oscillator versus an external crystal for clocking the R7S910017CBG#AC0?
The R7S910017CBG#AC0 includes an internal oscillator capable of generating up to 450MHz, eliminating the need for external crystals and saving board space. However, its frequency accuracy is typically ±1% over temperature and aging, making it unsuitable for precision timing applications like USB 2.0 high-speed communication or synchronous serial protocols requiring tight bit timing. For such use cases, an external crystal provides better stability (±20ppm) but adds component count and layout constraints. The choice depends on whether timing tolerance or integration density takes precedence in the design.
How does the R7S910017CBG#AC0 compare to similar ARM-based MCUs in terms of real-time performance for motor control applications?
Compared to mainstream Cortex-M7 devices running at 300–350MHz with similar RAM sizes, the R7S910017CBG#AC0 offers superior real-time determinism due to its Cortex-R4F core, which supports memory protection and lockstep execution—features absent in most consumer-grade MCUs. Additionally, its 1.5MB of RAM enables larger control algorithms without external SRAM, reducing latency from off-chip accesses. However, lacking floating-point units means software must implement FPU-less math libraries, slightly increasing CPU load for complex transforms like Park and Clarke.
What precautions are necessary when routing signal traces adjacent to the 320-FBGA package of the R7S910017CBG#AC0?
Due to the fine-pitch nature of the 17x17mm FBGA, signal integrity becomes critical. High-speed differential pairs—especially those carrying Ethernet, CSI, or DDR-type EMI bus signals—require controlled impedance routing with consistent spacing and minimal vias. Unused balls should be tied to ground through low-inductance paths to prevent capacitive coupling and EMI radiation. Additionally, decoupling capacitors must be placed within 2mm of each power pin, with multiple layers providing solid return planes to reduce ground bounce and ensure stable operation at 450MHz.
Is it feasible to use the R7S910017CBG#AC0 in automotive-grade designs, and what modifications might be required?
Although the R7S910017CBG#AC0 operates across -40°C to 125°C, it is not officially qualified to AEC-Q100 standards, limiting its direct adoption in safety-critical automotive systems. However, in less stringent automotive sub-systems—such as body electronics or infotainment peripherals—it may still find use if supplemented with robust EMC filtering, conformal coating, and redundant communication paths. Any deployment in certified automotive environments would require formal qualification testing, including extended temperature cycling and functional safety assessments per ISO 26262.
How does the DMA subsystem in the R7S910017CBG#AC0 improve data throughput compared to manual peripheral polling?
The R7S910017CBG#AC0 integrates a multi-channel DMA controller capable of transferring data between memory and peripherals without CPU intervention. For example, streaming 24 analog inputs sampled at 1MSPS via the SAR ADC would normally consume substantial CPU cycles; with DMA, these transfers occur transparently, freeing the Cortex-R4F core for algorithm execution. This reduces average CPU utilization by up to 40% in data-intensive applications like sensor fusion or video preprocessing, enabling more efficient use of the available 1.5MB RAM buffer.
What considerations apply when selecting an appropriate bootloader strategy for the ROMless R7S910017CBG#AC0?
Since there is no internal boot ROM, the R7S910017CBG#AC0 requires external boot firmware stored in flash to initialize hardware, configure clocks, and transfer user code into RAM or flash. Common strategies include using UART or USB for serial bootloading, though this demands pull-up resistors and valid power rails early in startup. Alternatively, designers may embed a minimal bootloader in external flash that configures the EBI interface before loading the main application. Reliability hinges on checksum validation and fallback mechanisms to recover from corrupted updates.
How does the Moisture Sensitivity Level (MSL) rating of 3 for the R7S910017CBG#AC0 influence manufacturing handling procedures?
With an MSL of 3 indicating exposure limits up to 168 hours after opening the moisture barrier, the R7S910017CBG#AC0 must be assembled within this window unless stored under dry conditions (e.g., desiccant + humidity indicator). Prolonged exposure can lead to popcorning during reflow soldering, especially in lead-free processes exceeding 245°C peak temperature. Manufacturers should follow JEDEC J-STD-033 guidelines for bake-out prior to assembly if shelf life has been exceeded, adding cost and schedule overhead to production planning.
What role does the Watchdog Timer (WDT) play in enhancing system reliability when deploying the R7S910017CBG#AC0 in remote monitoring equipment?
The integrated WDT in the R7S910017CBG#AC0 resets the processor if software fails to periodically reload its counter within a programmed timeout period—typically ranging from milliseconds to seconds depending on configuration registers. In unattended remote systems subject to electromagnetic interference or software hangs, this mechanism prevents catastrophic failures by restoring normal operation after fault detection. Proper implementation includes placing reload calls at strategic points in interrupt service routines and avoiding masking WDT feeds during critical sections.
Are there limitations in debugging capabilities when developing firmware for the R7S910017CBG#AC0?
Yes, while the RZ/T1 series supports standard JTAG/SWD interfaces, full visibility into internal pipeline states and coprocessor activity may require specialized debug probes compatible with ARM CoreSight architecture. Moreover, since the device is ROMless, traditional flash programming tools cannot erase or write memory directly during debugging sessions—external flash must be accessed instead, complicating live variable inspection. Development workflows often depend on Renesas’ proprietary tools like e² studio or IAR Embedded Workbench with updated drivers for effective debugging.
How does the combination of high-speed USB and CANbus peripherals affect PCB layer count and routing complexity in designs using the R7S910017CBG#AC0?
Simultaneous use of USB 2.0 Full-Speed (12Mbps) and CANbus (up to 1Mbps) introduces impedance-controlled differential pairs needing dedicated reference planes. Combined with the EBI/EMI bus for external memory, these signals demand at least four-layer PCBs with separate power and ground planes to maintain signal integrity. Crosstalk between adjacent layers can corrupt data, necessitating careful stackup planning and guard traces. This increases fabrication costs but remains manageable in medium-complexity industrial controllers.
What impact does the absence of EEPROM have on data retention strategies in battery-backed systems using the R7S910017CBG#AC0?
Without internal EEPROM, persistent data—such as calibration coefficients or user settings—must be stored in external serial EEPROMs or flash sectors reserved for non-volatile storage. This approach consumes valuable RAM during runtime due to buffering requirements and introduces write endurance concerns (typically 100k cycles for EEPROM vs. 10k for flash). To mitigate wear, designers often implement wear-leveling algorithms or cache frequently written values in RAM until periodic batch writes occur, balancing longevity against responsiveness.
How does the R7S910017CBG#AC0 compare to FPGA-based solutions for implementing real-time motor control logic?
While FPGAs offer unparalleled parallelism and reconfigurability, the R7S910017CBG#AC0 delivers lower latency and deterministic execution for sequential control loops thanks to its single-threaded, out-of-order Cortex-R4F core optimized for real-time tasks. For instance, field-oriented control (FOC) algorithms run efficiently on the MCU without FPGA synthesis delays, provided sufficient RAM and clock speed are maintained. The trade-off favors integration density and power efficiency with the RZ/T1 over FPGA’s higher cost, power draw, and development complexity.
What steps should be taken to verify compliance with RoHS3 and REACH regulations for the R7S910017CBG#AC0 in European market deployments?
Although the R7S910017CBG#AC0 is marked as RoHS3 compliant and REACH unaffected, final verification requires reviewing the latest EC declarations of conformity issued by Renesas Electronics Corporation. Suppliers should provide certificates confirming absence of restricted substances above threshold levels and SVHC inclusion status as of the shipment date. Distributors may also offer batch-specific documentation upon request, ensuring traceability throughout the supply chain and avoiding customs delays or penalties in regulated markets.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc R7S910017CBG#AC0

Product Attribute R7S910021CBG#AC0 R7S910015CBG#AC0 R7S910013CBG#AC0 R7S910011CBG#AC0
Part Number R7S910021CBG#AC0 R7S910015CBG#AC0 R7S910013CBG#AC0 R7S910011CBG#AC0
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Number of I/O - - - -
Program Memory Type - - - -
EEPROM Size - - - -
Peripherals - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Core Processor - - - -
Connectivity - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Speed - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Program Memory Size - - - -
Core Size - - - -
RAM Size - - - -
Oscillator Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Data Converters - - - -

R7S910017CBG#AC0 Datasheet PDF

Download R7S910017CBG#AC0 pdf datasheets and Renesas Electronics America Inc documentation for R7S910017CBG#AC0 - Renesas Electronics America Inc.

PCN Packaging
2.73KHz.pdf
PCN Assembly/Origin
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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R7S910017CBG#AC0 Image

R7S910017CBG#AC0

Renesas Electronics America Inc
32D-R7S910017CBG#AC0

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