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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersST72F325K6T3
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ST72F325K6T3 - STMicroelectronics

Manufacturer Part Number
ST72F325K6T3
Manufacturer
STMicroelectronics
Allelco Part Number
32D-ST72F325K6T3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,156 pcs available, New & Original
Parts Description
IC MCU 8BIT 32KB FLASH 32LQFP
Package
32-LQFP
Data sheet
ST72F325K6T3.pdf
RoHs Status
ROHS3 Compliant
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Specifications

ST72F325K6T3 Tech Specifications
STMicroelectronics - ST72F325K6T3 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - ST72F325K6T3

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 3.8V ~ 5.5V
Speed 8MHz
Series ST7
RAM Size 1K x 8
Program Memory Type FLASH
Program Memory Size 32KB (32K x 8)
Peripherals LVD, POR, PWM, WDT
Package / Case 32-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Number of I/O 24
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 6x10b
Core Size 8-Bit
Core Processor ST7
Connectivity I²C, SCI, SPI
Base Product Number ST72F

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

ST72F325K6T3 Image
ST72F325K6T3 (1)

Manufacturer Part Number

ST72F325K6T3

Manufacturer

STMicroelectronics

Introduction

The ST72F325K6T3 is an 8-bit microcontroller from STMicroelectronics' ST7 series designed for embedded control applications.

Product Features and Performance

8-bit ST7 core processor

8 MHz clock speed

Integrated I2C, SCI, SPI connectivity

Low voltage detect, power-on reset, pulse width modulation, watchdog timer peripherals

24 programmable I/O lines

32KB Flash program memory

1KB RAM

6-channel, 10-bit analog-to-digital converter

Internal oscillator

Surface mount, 32-LQFP package

Product Advantages

Complexity reduction for embedded system design

High integration to save board space and reduce external components

Robust peripheral set for diverse control tasks

Embedded flash memory for reliable program storage

Key Technical Parameters

Core Size: 8-Bit

Speed: 8MHz

Connectivity: I2C, SCI, SPI

Number of I/O: 24

Program Memory Size: 32KB FLASH

RAM Size: 1KB

Voltage Supply: 3.8V to 5.5V

Data Converters: A/D 6x10b

Operating Temperature: -40°C to 125°C

Quality and Safety Features

Extended temperature range for harsh environments

Watchdog timer to ensure system reliability

Low voltage detection to protect the system from undervoltage conditions

Compatibility

Support for industry-standard I2C, SCI, SPI protocols

Standard 32-LQFP package for compatibility with common PCB designs

Application Areas

Industrial control systems

Automotive electronics

Consumer electronics

Embedded control applications

Product Lifecycle

Obsolete status, suggesting that the product is no longer being manufactured

Likely availability of replacements or upgrades from STMicroelectronics

Several Key Reasons to Choose This Product

Efficient 8-bit processing capabilities for cost-sensitive applications

Integrated peripherals reducing the need for additional components

Flash memory for program flexibility and updateability

Operational in extreme temperature conditions

STMicroelectronics' reputation for quality and long-term reliability

Frequently Asked Questions(FAQ)

How does the ST72F325K6T3 compare to other ST7 series microcontrollers in terms of program memory size and I/O availability for industrial control applications?
The ST72F325K6T3 offers 32KB of FLASH program memory, which is among the higher-capacity variants within the ST7 family. This provides sufficient code storage for moderately complex embedded routines without requiring external program memory. With 24 programmable I/O pins available, it supports a balanced interface count suitable for sensor networks and actuator control in space-constrained industrial environments. Compared to smaller ST7 models like the ST72F321, this device delivers nearly double the program capacity while maintaining full compatibility with the ST7 instruction set and peripheral architecture.
What are the critical voltage and temperature constraints when integrating the ST72F325K6T3 into automotive-grade systems?
The ST72F325K6T3 operates across a supply voltage range of 3.8V to 5.5V, making it compatible with both regulated 5V and battery-powered 3.3–3.6V systems commonly used in automotive applications. Its extended operating temperature range spans from -40°C to +125°C (TA), meeting AEC-Q100 Grade 2 requirements for under-hood and cabin-mounted electronics. However, designers must ensure that all external components—including crystals, pull-up resistors, and level shifters—are rated for the full automotive temperature range. Power sequencing must also respect the device’s internal power-on reset (POR) and brown-out detection thresholds to prevent unintended resets during cold starts or voltage transients.
Can the ST72F325K6T3 be used effectively for motor control applications, and what peripherals support this function?
Yes, the ST72F325K6T3 includes dedicated PWM modules capable of generating precise duty-cycle signals for basic brushed DC or stepper motor control. It also features an integrated watchdog timer (WDT), low-voltage detection (LVD), and power-on reset (POR), which enhance system reliability in motor-driven environments prone to electrical noise and supply fluctuations. While it lacks advanced motor-control features such as Hall-effect sensor decoding or encoder feedback processing found in higher-end MCUs, its combination of PWM outputs, analog comparator inputs, and fast GPIO switching makes it suitable for simple speed-regulation tasks in appliances or small automation systems.
How does the internal oscillator performance of the ST72F325K6T3 impact timing-critical designs compared to using an external crystal?
The ST72F325K6T3 incorporates a calibrated internal RC oscillator running at 8MHz (±10% typical accuracy over temperature and voltage). In non-synchronization contexts—such as UART baud rate generation or basic timer operations—this suffices for most applications. However, for high-precision timing, cryptographic operations, or communication protocols requiring strict clock tolerances (e.g., ISO/IEC 14443 RFID), an external crystal would provide superior stability. Designers should account for the ±10% variation when calculating worst-case baud rates or delay loops. Calibration routines can improve internal oscillator accuracy but require additional flash space and execution overhead.
What considerations apply when interfacing the ST72F325K6T3 with 5V logic devices given its 3.8V minimum supply requirement?
Since the ST72F325K6T3 supports down to 3.8V operation, direct connection to 5V TTL/CMOS logic levels risks damaging the I/O pins if the MCU is powered below 4.5V. To safely interface with 5V systems, level-shifting circuits—such as open-drain configurations with pull-up resistors to 5V or dedicated bidirectional translators—should be employed. Alternatively, ensuring the MCU operates above 4.2V guarantees that 5V-tolerant inputs remain within safe limits. Careful attention to ESD protection diodes and transient suppression is essential during hot-plug scenarios common in industrial installations.
How much RAM and EEPROM does the ST72F325K6T3 offer, and what are realistic usage limitations for data logging applications?
The ST72F325K6T3 provides 1KB of internal SRAM and no dedicated EEPROM memory. For data logging, this constrains the amount of volatile data that can be buffered before transmission or non-volatile storage. Applications storing only metadata or short status messages may suffice, but long-term trend logging requires periodic writes to external SPI EEPROMs or FRAM. Because SRAM is volatile, any loss of power erases logged data unless backed up by an auxiliary capacitor or battery. Developers must optimize data structures and implement compression or aggregation algorithms to maximize utility within the tight 1KB constraint.
Is the ST72F325K6T3 suitable for battery-powered IoT endpoints requiring deep sleep modes?
While the ST72F325K6T3 supports low-power operation via software-controlled clock gating and stop modes, it lacks ultra-low-power hardware features present in modern 32-bit MCUs. Its typical active current draw at 5V and 8MHz is around 1.5mA, rising to ~5µA in halt mode. For multi-year battery life, this may not meet aggressive power budgets unless the application has very infrequent wake cycles (< once per hour). If used, careful management of peripherals, disabling unused modules, and minimizing CPU wake time are essential. External RTCs with independent power domains offer better alternatives for true energy harvesting use cases.
What connectivity options does the ST72F325K6T3 provide, and how do they compare in protocol complexity?
The ST72F325K6T3 integrates three standard serial interfaces: one SPI module, one SCI (asynchronous UART), and one I²C interface. These cover most low-speed communication needs in embedded systems, enabling connections to sensors, displays, and memory chips. Among these, SPI offers the highest throughput and lowest latency due to its synchronous nature and multiple slave-select lines, ideal for flash memory or DAC access. I²C simplifies wiring with only two lines and supports multi-master topologies, useful in modular designs. SCI remains the simplest to implement for point-to-point debug or telemetry links. None of these support advanced protocols like CAN or Ethernet, limiting suitability for automotive networking or IP-based systems.
How does the Moisture Sensitivity Level (MSL) rating of MSL 2 affect PCB assembly reliability for the ST72F325K6T3?
With an MSL rating of 2, the ST72F325K6T3 can be stored up to one year under dry-packaged conditions before requiring reflow soldering. Once unpacked, it must be assembled within 168 hours (7 days) if exposed to ambient humidity, otherwise risking popcorning during thermal cycling. Manufacturers must follow JEDEC J-STD-033 guidelines, including bake-out procedures if the window expires. This rating reflects typical plastic LQFP packaging behavior and assumes proper handling during procurement and storage. Compliance with this schedule ensures long-term solder joint integrity in consumer, industrial, and even some automotive applications.
What role does the built-in watchdog timer play in enhancing system robustness when using the ST72F325K6T3?
The integrated watchdog timer (WDT) monitors firmware execution and forces a reset if the software fails to periodically clear the watchdog counter. This protects against hangs caused by infinite loops, stack overflows, or unhandled exceptions—particularly valuable in field-deployed systems where human intervention is impractical. Configurable timeout periods (from milliseconds to seconds) allow tuning based on task deadlines. However, misconfigured WDT intervals can cause false resets under heavy interrupt loads. Best practice involves disabling the WDT during flash programming and enabling it only after the main application loop initializes correctly.
How does the choice between internal vs. external clock sources affect startup time and system initialization when deploying the ST72F325K6T3?
Using the internal 8MHz oscillator reduces component count and accelerates boot time since no crystal stabilization delay is needed. Startup typically completes within tens of microseconds, enabling rapid response in real-time control loops. In contrast, an external crystal may add hundreds of milliseconds to initialization due to oscillation settling time and PLL lock delays (if enabled). However, external oscillators offer better frequency accuracy and jitter characteristics, beneficial for synchronized multi-node networks. Designers should weigh responsiveness against precision requirements when selecting the clock source.
What are the key differences between the ST72F325K6T3 and more recent STM8S variants in terms of development ecosystem and toolchain support?
Although both belong to ST’s legacy 8-bit microcontroller families, the ST72F325K6T3 uses the older ST7 core architecture, which lacks modern debugging features like SWIM single-wire interface support found in STM8S devices. Development typically relies on proprietary IDEs or third-party tools like Cosmic or IAR, whereas STM8S benefits from broader compiler support and ST Visual Develop integration. Additionally, the ST72F325K6T3 has limited community resources and example code compared to newer platforms, potentially increasing time-to-market for complex projects. Migration to STM8S may be warranted for improved tooling and long-term maintainability.
How should interrupt priorities be managed on the ST72F325K6T3 to avoid race conditions in multitasking environments?
The ST72F325K6T3 implements a fixed-priority interrupt scheme where higher-numbered interrupts preempt lower ones. Developers must assign critical peripherals—like ADC conversions or communication timeouts—to high-priority vectors to minimize latency. Nested interrupts are allowed but should be kept shallow to preserve stack integrity. ISRs must be short; lengthy processing should defer to the main loop via flags. Mismanaged priorities can lead to missed events or deadlocks, especially when combining SPI transfers with I²C polling. Careful analysis of timing margins under worst-case interrupt loads is recommended.
What factors determine whether the ST72F325K6T3 can drive capacitive loads directly from its GPIO pins?
Driving capacitive loads (e.g., LEDs with series resistors or long PCB traces) is generally feasible, but excessive capacitance increases rise/fall times and raises electromagnetic interference (EMI). The device’s output drivers can source/sink up to 25mA per pin, but total package current must stay within 100mA absolute maximum. For loads exceeding ~50pF or requiring faster edge rates, external buffers or MOSFETs are advisable. Always verify signal integrity using an oscilloscope during prototype validation, especially near the 8MHz system clock frequency where harmonics become significant.
How does the absence of EEPROM memory in the ST72F325K6T3 influence firmware update strategies?
Without onboard non-volatile data memory, configuration parameters, calibration values, or user settings cannot persist across power cycles using internal storage alone. Workarounds include emulating EEPROM in FLASH sectors with wear-leveling algorithms, though this consumes precious program space and adds complexity. Alternatively, external serial EEPROMs (e.g., AT24Cxx) provide reliable storage and simplify firmware updates. This design choice reflects cost optimization for the ST72F325K6T3 target market, favoring simplicity over flexibility in persistent data handling.
What precautions are necessary when writing to the FLASH memory of the ST72F325K6T3 to prevent accidental corruption?
FLASH programming requires specific unlock sequences and voltage conditions. Unauthorized writes—especially during bootloader execution or interrupt service routines—can corrupt the application code. Implement write-protection bits (WRP) in the option bytes to safeguard critical regions. Avoid self-modifying code unless absolutely necessary, and always backup the original vector table before updating. Erasing FLASH takes longer than writing, so bulk operations should be batched. Use checksums or CRC validation post-programming to detect errors early.
How does the 32-LQFP package influence thermal dissipation and PCB layout decisions for the ST72F325K6T3?
The 32-pin LQFP package provides good electrical performance and moderate thermal conductivity but lacks a thermal pad for direct heat sinking. Under continuous high-frequency operation, junction temperatures may rise significantly if not properly managed. Adequate copper pours and vias under the package improve heat spreading. Keep high-current paths short and isolate noisy digital sections from sensitive analog circuits (like the ADC) to reduce coupling. Mechanical stress during thermal cycling should also be considered in ruggedized environments.
Why might the ST72F325K6T3 be preferred over ARM Cortex-M0+ parts in ultra-low-cost embedded projects despite its older architecture?
The ST72F325K6T3 offers extremely competitive pricing and minimal bill-of-materials cost, making it ideal for white-goods, toys, or disposable sensors where lifecycle costs dominate. Its deterministic 8-bit execution model simplifies real-time control logic, and the rich peripheral set eliminates the need for external components in many cases. While lacking the computational throughput of 32-bit cores, it efficiently handles event-driven tasks like sensor reading, PWM generation, and simple protocol handling. For applications prioritizing BOM reduction and proven reliability over future scalability, it remains a compelling choice.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics ST72F325K6T3

Product Attribute ST72F325K4T3TR ST72F325K6TC ST72F325K6T6TR ST72F325K6T6
Part Number ST72F325K4T3TR ST72F325K6TC ST72F325K6T6TR ST72F325K6T6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Peripherals - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
RAM Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Program Memory Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Number of I/O - - - -
Core Size - - - -
Connectivity - - - -
Speed - - - -
Data Converters - - - -
Oscillator Type - - - -
Program Memory Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Core Processor - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
EEPROM Size - - - -

ST72F325K6T3 Datasheet PDF

Download ST72F325K6T3 pdf datasheets and STMicroelectronics documentation for ST72F325K6T3 - STMicroelectronics.

PCN Obsolescence/ EOL
ST9/ST10/ARM7/ST7ASSM/ST7CAN/ST7LITE/ST7MID/ST7HIG.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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ST72F325K6T3 Image

ST72F325K6T3

STMicroelectronics
32D-ST72F325K6T3

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