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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32L4R9ZIY6PTR
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STM32L4R9ZIY6PTR - STMicroelectronics

Manufacturer Part Number
STM32L4R9ZIY6PTR
Manufacturer
STMicroelectronics
Allelco Part Number
32D-STM32L4R9ZIY6PTR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
2,776 pcs available, New & Original
Parts Description
IC MCU 32BIT 2MB FLASH 144WLCSP
Package
144-WLCSP (5.24x5.24)
Data sheet
STM32L4R9ZIY6PT.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 2776

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Specifications

STM32L4R9ZIY6PTR Tech Specifications
STMicroelectronics - STM32L4R9ZIY6PTR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32L4R9ZIY6PTR

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Supplier Device Package 144-WLCSP (5.24x5.24)
Speed 120MHz
Series STM32L4R
RAM Size 640K x 8
Program Memory Type FLASH
Program Memory Size 2MB (2M x 8)
Peripherals Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Package / Case 144-UFBGA, WLCSP
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 112
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 16x12b; D/A 2x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M4
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD, SAI, SPI, UART/USART, USB OTG
Base Product Number STM32L4R9

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

STM32L4R9ZIY6PTR Image
STM32L4R9ZIY6PTR (1)

Manufacturer Part Number

STM32L4R9ZIY6PTR

Manufacturer

STMicroelectronics

Introduction

High-performance advanced line microcontroller with ARM Cortex-M4 core

Product Features and Performance

32-Bit Single-Core ARM Cortex-M4 processor

120MHz maximum frequency

2MB program Flash memory

640KB RAM

16x12-bit analog-to-digital converters

2x12-bit digital-to-analog converters

A comprehensive set of peripherals including LCD controller, PWM, WDT

Advanced connectivity with CANbus, USB OTG, and multiple serial interfaces

Product Advantages

Low power consumption with flexible power saving modes

Large set of embedded communication interfaces

Advanced security features

STM32 dynamic efficiency with batch acquisition mode (BAM)

Digital filter for sigma-delta modulators (DFSDM) for audio processing

Key Technical Parameters

Core Processor: ARM Cortex-M4

Speed: 120MHz

Program Memory Size: 2MB

RAM Size: 640KB

I/O Number: 112

Supply Voltage: 1.71V to 3.6V

Operating Temperature: -40°C to 85°C

Quality and Safety Features

Brown-out detect/reset

Programmable voltage detector (PVD)

Compatibility

Compatible with a broad range of development tools and software

Supported by a comprehensive set of software libraries (STM32Cube)

Application Areas

Industrial controls

Consumer electronics

Internet of Things applications

Medical devices

Home automation systems

Product Lifecycle

Active

Regularly updated with new firmwares and software support

Several Key Reasons to Choose This Product

Rich peripheral set simplifies system design

High integration to save board space and reduce BOM cost

Energy-efficient operations suitable for battery-driven devices

Extensive support and community surrounding STM32 products

Robust temperature range for harsh environment operation

Powerful core and high-speed operation for demanding applications

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the STM32L4R9ZIY6PTR for low-power embedded applications compared to higher-performance alternatives?
The STM32L4R9ZIY6PTR achieves 120MHz operation with a 32-bit ARM Cortex-M4 core, delivering sufficient processing headroom for real-time control tasks while maintaining STMicroelectronics’ ultra-low-power architecture. Its 640KB RAM and 2MB flash enable complex firmware without external memory, but designers must consider that peak throughput is lower than high-end MCUs like the STM32H7 series. For battery-powered systems requiring deep sleep modes below 1µA, this device offers an optimal balance by combining moderate compute density with advanced power gating and dynamic voltage scaling. However, applications needing floating-point acceleration or DSP-intensive signal processing may require additional hardware or algorithm optimization to compensate.
How does the 144-WLCSP package of the STM32L4R9ZIY6PTR affect thermal management and PCB layout complexity in compact designs?
The 5.24x5.24 mm WLCSP configuration enables highly space-constrained implementations but introduces significant challenges due to its dense ball grid array (BGA) footprint and lack of exposed thermal pad. Without direct solder joints on the die backside, heat dissipation relies entirely on conduction through the PCB copper layers and convection from the package surface—limiting maximum continuous operating current under ambient temperatures above 60°C. Designers must implement solid ground planes and thermal vias beneath the component to avoid local hotspots during sustained load conditions such as USB data streaming or cryptographic operations. This packaging choice favors low-power workloads where transient thermal loads remain manageable.
Can the STM32L4R9ZIY6PTR reliably drive an LCD display interface without external buffering given its GPIO pin count and peripheral capabilities?
Yes, the STM32L4R9ZIY6PTR includes integrated LCD controller support capable of driving up to 8×40 segments directly from internal memory, eliminating the need for external drivers in most segment-based displays. With 112 available I/O pins and DMA support for frame buffer transfers, it can sustain refresh rates up to 30 Hz even at full resolution without CPU intervention. However, capacitive touch overlay integration or multiplexed matrix displays exceeding 160 pixels may strain timing constraints unless optimized using hardware-assisted scanning via dedicated SAI or FSMC peripherals. Careful assignment of LCD-specific pins to avoid EMI coupling with high-speed buses like USB OTG is essential for stable operation.
What are the implications of using the Cut Tape (CT) packaging variant of the STM32L4R9ZIY6PTR in automated pick-and-place assembly versus reel-based formats?
The Cut Tape format provides individual units suitable for prototyping or small-batch production, allowing precise inspection and testing before placement. However, it lacks the tape-and-reel continuity required for standard SMT lines, increasing handling risks such as misalignment or electrostatic discharge during manual transfer. For high-volume manufacturing, Digi-Reel® reels offer better feeder compatibility and reduced downtime, but CT components may be preferred when sourcing limited quantities or performing functional validation prior to final board build. Both variants share identical electrical characteristics and MSL 1 classification, ensuring consistent reliability across supply chain formats.
How should designers evaluate the impact of internal oscillator accuracy on communication protocols like USB OTG when using the STM32L4R9ZIY6PTR?
The STM32L4R9ZIY6PTR uses an internal 16 MHz HSI clock source, which typically exhibits ±1% frequency tolerance—insufficient for strict USB 2.0 compliance without external crystal correction. To meet USB Full Speed requirements, an external 48 MHz crystal oscillator is strongly recommended. Even with calibration, drift over temperature (-40°C to +85°C) can cause timing violations in packet transmission intervals. Designers must factor in additional jitter margins when implementing USB mass storage or CDC class devices, possibly incorporating software resynchronization routines or leveraging the built-in RTC for coarse timekeeping while relying on external timing references for high-speed serial links.
In what scenarios would the absence of EEPROM in the STM32L4R9ZIY6PTR necessitate alternative non-volatile storage strategies?
Since the STM32L4R9ZIY6PTR does not include internal EEPROM, persistent configuration data such as calibration coefficients, user preferences, or device-specific keys must be stored in flash memory sectors reserved for this purpose. While flash endurance exceeds 10k cycles, repeated writes degrade adjacent sectors faster, requiring wear-leveling algorithms or sparing mechanisms to extend longevity. For frequent updates, designers might implement an external SPI EEPROM or use the MCU’s internal SRAM backed by a supercapacitor or battery-backed RTC circuit. Alternatively, cloud-based provisioning via secure USB or Ethernet interfaces can offload state persistence, though this increases system complexity and security considerations.
How do the data converters (16x12-bit ADC and 2x12-bit DAC) of the STM32L4R9ZIY6PTR compare to those found in similarly priced microcontrollers targeting industrial sensor conditioning?
The integrated 12-bit SAR ADC supports up to 16 channels with 1 µs conversion time and programmable oversampling, making it suitable for medium-resolution analog front ends like strain gauges or thermocouples after appropriate signal conditioning. Compared to budget MCUs offering 10-bit ADCs, this provides finer quantization for precision measurements; however, it lacks simultaneous sampling and has no built-in PGA, limiting input range flexibility. The two 12-bit DACs enable basic waveform generation but cannot replace true bipolar outputs without external op-amp buffers. When interfacing with high-impedance sensors or requiring isolation, external precision ADCs/DACs with I2C/SPI interfaces may yield better noise immunity and dynamic range.
What precautions are necessary when routing high-speed signals like USB OTG or SAI near the STM32L4R9ZIY6PTR’s WLCSP pads to maintain signal integrity?
Due to the fine-pitch BGA layout and lack of dedicated reference planes under the package, high-speed traces must be routed with controlled impedance (typically 50 Ω single-ended) and kept at least three times their width away from any WLCSP pad to minimize crosstalk and capacitance loading. USB differential pairs especially demand matched length and tight coupling to prevent common-mode noise. Ground stitching vias should surround critical nets, and decoupling capacitors must be placed within 1mm of the VDD/VSS connections. Simulation tools like HyperLynx or Ansys SIwave are recommended to validate return path continuity before fabrication, as parasitic effects from poor layout can render otherwise compliant hardware non-functional.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32L4R9ZIY6PTR

Product Attribute STM32L4R9ZIY6TR STM32L4R9ZGY6TR STM32L4R9ZIJ6 STM32L4R9ZIT6
Part Number STM32L4R9ZIY6TR STM32L4R9ZGY6TR STM32L4R9ZIJ6 STM32L4R9ZIT6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Peripherals - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply (Vcc/Vdd) - - - -
Data Converters - - - -
Core Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
EEPROM Size - - - -
Program Memory Type - - - -
Core Processor - - - -
Speed - - - -
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
RAM Size - - - -
Oscillator Type - - - -
Connectivity - - - -
Program Memory Size - - - -

STM32L4R9ZIY6PTR Datasheet PDF

Download STM32L4R9ZIY6PTR pdf datasheets and STMicroelectronics documentation for STM32L4R9ZIY6PTR - STMicroelectronics.

PCN Assembly/Origin
Additional DPS line 25/Oct/2021.pdf
PCN Design/Specification
STM32L Prod Improv 29/Jan/2021.pdf STM32L4R/S 15/Nov/2019.pdf

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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STM32L4R9ZIY6PTR Image

STM32L4R9ZIY6PTR

STMicroelectronics
32D-STM32L4R9ZIY6PTR

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