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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM8S207RBT6C
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STM8S207RBT6C - STMicroelectronics

Manufacturer Part Number
STM8S207RBT6C
Manufacturer
STMicroelectronics
Allelco Part Number
32D-STM8S207RBT6C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,520 pcs available, New & Original
Parts Description
IC MCU 8BIT 128KB FLASH 64LQFP
Package
64-LQFP (14x14)
Data sheet
STM8S207RBT6C.pdf

PCN Assembly/Origin

SG8E Source Add 21/Dec/2018.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 11520
  • Unit Price: $1.956
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.956 $1.96
10+ $1.706 $17.06
30+ $1.557 $46.71
100+ $1.406 $140.60
500+ $1.337 $668.50
1000+ $1.305 $1,305.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM8S207RBT6C Tech Specifications
STMicroelectronics - STM8S207RBT6C technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM8S207RBT6C

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 2.95V ~ 5.5V
Supplier Device Package 64-LQFP (14x14)
Speed 24MHz
Series STM8S
RAM Size 6K x 8
Program Memory Type FLASH
Program Memory Size 128KB (128K x 8)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 64-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 52
Mounting Type Surface Mount
EEPROM Size 2K x 8
Data Converters A/D 16x10b
Core Size 8-Bit
Core Processor STM8
Connectivity I²C, IrDA, LINbus, SPI, UART/USART
Base Product Number STM8

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

STM8S207RBT6C Image
STM8S207RBT6C (1)

Manufacturer Part Number

STM8S207RBT6C

Manufacturer

stmicroelectronics

Introduction

The STM8S207RBT6C is a high-performance 8-bit microcontroller from stmicroelectronics, featuring robust connectivity options and extensive memory capacity, suitable for a range of embedded applications.

Product Features and Performance

Core Processor: STM8

Core Size: 8-Bit

Speed: 24MHz

Connectivity: I2C, IrDA, LINbus, SPI, UART/USART

Peripherals include Brown-out Detect/Reset, Power-on Reset, PWM, Watchdog Timer

Number of I/O: 52

Program Memory Size: 128KB

EEPROM Size: 2KB

RAM Size: 6KB

A/D Converters: 16 x 10-bit

Oscillator Type: Internal

Product Advantages

High-speed operation at 24MHz

Extensive data storage capabilities with flash and EEPROM

Integrated safety features like brown-out detect and watchdog timer

Versatile connectivity options for enhanced device interfacing

STM8S207RBT6C Image
STM8S207RBT6C (2)

Key Technical Parameters

Voltage Supply: 2.95V to 5.5V

Operating Temperature: -40°C to 85°C

Mounting Type: Surface Mount

Package: 64-LQFP (14x14)

Quality and Safety Features

Brown-out Detect/Reset ensures reliable operation under unstable voltage conditions

Power-on Reset provides a clean start-up sequence

Watchdog Timer helps in system recovery

Compatibility

Compatible with a variety of communication interfaces and protocols

Application Areas

Industrial control systems

Consumer electronics

Automotive products

Telecommunication devices

Product Lifecycle

Current product status: Active

Product is not nearing discontinuation and has available upgrades

Several Key Reasons to Choose This Product

High reliability and robust operational parameters ensure uninterrupted performance

Comprehensive connectivity opens up multiple application design options

Large memory capacity facilitates complex programming and data storage

Wide operating temperature range makes it suitable for harsh environments

Integrative peripherals reduce additional components needed, minimizing design complexity

Frequently Asked Questions(FAQ)

What are the key differences between the STM8S207RBT6C and other STM8S series microcontrollers in terms of program memory capacity and peripheral integration, and how do these affect system-level design choices?
The STM8S207RBT6C features 128KB of embedded FLASH program memory—the largest among standard STM8S variants—making it suitable for complex firmware applications that require substantial code storage. In comparison to smaller members like the STM8S103 with only 10KB, this microcontroller supports significantly more sophisticated control algorithms or protocol stacks. Its peripheral set includes I2C, SPI, UART/USART, LINbus, IrDA, and PWM modules, providing comprehensive connectivity without requiring external interface chips. This integrated approach reduces board space and component count but may limit flexibility compared to using discrete communication controllers. Designers must balance memory headroom against pin availability, especially when leveraging all 52 I/O lines while maintaining required communication interfaces.
How does the operating voltage range of 2.95V to 5.5V influence power supply design and compatibility with common industrial sensor and actuator systems, particularly when interfacing with 3.3V logic levels?
The STM8S207RBT6C’s wide supply tolerance from 2.95V to 5.5V allows flexible deployment across both low-power battery-operated devices and higher-voltage industrial environments. This range ensures reliable operation even under voltage sags or transients common in automotive or factory automation settings. When used with 3.3V logic peripherals such as sensors or displays, no level shifting is typically needed since the MCU can operate directly at 3.3V while still accepting up to 5.5V. However, careful attention must be paid to absolute maximum ratings—exceeding 5.5V risks damaging internal regulators or I/O structures. For designs requiring precise analog measurements via its 16-channel 10-bit ADC, stable Vdd within ±5% improves conversion accuracy and reduces noise susceptibility.
Can the STM8S207RBT6C reliably drive high-current loads such as relays or LEDs through its GPIO pins, and what external components are necessary to ensure long-term reliability?
The STM8S207RBT6C’s GPIO pins are rated for standard TTL/CMOS drive levels but lack native current sinking or sourcing capability beyond ~20mA per pin. Driving inductive loads like relays requires flyback diodes across the coil and possibly a transistor buffer to handle inrush currents. For LED arrays exceeding 10–15mA per segment, an external MOSFET or dedicated LED driver should be employed to avoid excessive power dissipation in the MCU itself. Thermal derating becomes relevant if multiple high-side switches operate simultaneously near ambient temperatures above 70°C. Using external passives not only protects the microcontroller but also enables higher load currents limited only by PCB trace and connector ratings.
What considerations apply when selecting an external crystal versus relying on the internal oscillator for timing-critical applications using the STM8S207RBT6C?
While the STM8S207RBT6C includes a calibrated internal RC oscillator capable of 24MHz operation, its accuracy over temperature and voltage varies by ±2% or worse. For precision timing in motor control, data logging, or communication protocols like LIN or CAN (if implemented in software), an external crystal provides better frequency stability—typically ±10ppm over -40°C to +85°C. However, crystals add cost, board real estate, and startup time due to loading capacitance requirements. Most applications tolerate internal oscillator drift unless synchronization with external clocks is mandatory. If phase-locked loop techniques are avoided, the built-in oscillator suffices for UART baud rates within acceptable error margins.
How does the presence of hardware watchdog and brownout detection impact fault recovery strategies in battery-powered embedded systems based on the STM8S207RBT6C?
The STM8S207RBT6C integrates independent watchdog timer (IWDG) and programmable brownout reset (BOR) circuits that enhance system resilience during power anomalies. The IWDG forces a restart if software hangs, while BOR triggers a reset when Vdd drops below configured thresholds—critical during sudden load changes or weak battery conditions. Unlike software-only watchdogs, the IWDG runs from a separate low-frequency clock source, ensuring functionality even during CPU stalls. Combined with power-on reset (POR), these features reduce dependency on robust software error handling alone. Nevertheless, they do not protect against flash corruption or logic errors; application code must still include stack overflow checks and interrupt safety measures.
What are the implications of the 64-LQFP package size (14x14mm) for thermal management and signal integrity in high-density printed circuit boards?
The 64-pin LQFP package occupies moderate surface area but presents thermal challenges under continuous full-load operation due to limited exposed copper area. At 24MHz with active peripherals drawing several hundred milliamps, junction temperatures may rise significantly if not adequately heatsunk. Signal routing demands careful layout: high-speed traces like SPI or I2C should be kept short with impedance-matched terminations to minimize reflections. Power and ground planes must be decoupled effectively using 100nF capacitors near each VDD/VSS pair to maintain stability. Mechanical stress from soldering or vibration could compromise solder joints over time; conformal coating may mitigate environmental degradation.
How does the STM8S207RBT6C compare to ARM Cortex-M0-based MCUs in terms of power efficiency, development complexity, and cost for simple control tasks?
Compared to entry-level ARM Cortex-M0 devices such as the NXP LPC1114, the STM8S207RBT6C offers lower clock speeds (24MHz vs. up to 50MHz), simpler instruction set architecture (8-bit vs. 32-bit), and reduced RAM (6KB vs. 8KB). However, it delivers lower dynamic power consumption due to deeper sleep modes and absence of floating-point units. Development tools are less mature than ARM ecosystems, though ST’s CubeIDE and legacy TrueSTUDIO support adequate firmware creation. Per-unit cost remains competitive in high-volume scenarios, especially when leveraging existing 8-bit toolchains. For applications requiring only basic sensor polling, motor stepping, or serial communication, the STM8S207RBT6C provides sufficient performance with lower learning curve overhead.
Are there known limitations in using the STM8S207RBT6C for USB-to-serial bridging or HID device emulation due to peripheral constraints?
The STM8S207RBT6C lacks native USB hardware, making direct USB host or device functionality impossible without external PHY chips. Attempting to emulate USB via bit-banging would exceed available CPU bandwidth at 24MHz, given overhead from precise timing requirements. Instead, designers often use the USART peripheral in conjunction with a dedicated USB bridge IC such as FTDI FT232RL for serial communication. Alternatively, IrDA or LINbus implementations are feasible using built-in peripherals with minimal software intervention. Thus, while the MCU excels in non-USB serial applications, USB integration necessitates additional components and increases bill-of-materials cost.
How does the Moisture Sensitivity Level (MSL) rating of 3 affect storage and handling procedures during assembly of boards featuring the STM8S207RBT6C?
With an MSL3 classification indicating sensitivity after 168 hours of exposure to ambient humidity, the STM8S207RBT6C must be stored in dry cabinets or desiccated packaging until reflow soldering. Once removed from sealed packaging, assembly must occur within one week under controlled conditions (<60% RH). Failure to adhere risks popcorning during thermal cycling, potentially causing internal delamination or bond wire lift-off. Manufacturers usually provide bake-out recommendations before rework; however, repeated exposure accelerates moisture ingress. Proper handling protocols include grounded ESD straps, anti-static trays, and minimizing open-air dwell times post-opening.
What role does the 2K x 8 EEPROM play in field-upgradable firmware systems using the STM8S207RBT6C, and how does its write endurance compare to FLASH memory?
The STM8S207RBT6C embeds 2KB of EEPROM for storing configuration parameters, calibration data, or small lookup tables that require frequent updates. Unlike FLASH memory, EEPROM supports byte-level writes without sector erasure, enabling efficient logging or parameter adjustment in deployed systems. However, write endurance is limited to approximately 1 million cycles per address location—sufficient for thousands of updates but inadequate for continuous high-frequency logging. FLASH, meanwhile, permits only block erase/write operations (~10k cycles) and cannot be modified at runtime. Thus, EEPROM serves as a dedicated scratchpad for mutable data, while FLASH hosts immutable firmware.
How should developers validate timing accuracy when implementing custom communication protocols such as MODBUS RTU or CAN over the UART/USART interface on the STM8S207RBT6C?
Timing validation requires measuring actual baud rate deviation using an oscilloscope or logic analyzer relative to expected values derived from clock source accuracy. Since UART baud rates depend on both oscillator frequency and prescaler settings, any drift in the internal RC or external crystal directly impacts frame integrity. Developers should verify start-bit edge alignment, stop-bit duration, and inter-character timing against protocol specifications. Additionally, interrupt latency from higher-priority tasks must be profiled to ensure no overruns occur. Automated test suites with known-good slaves help detect marginal cases where noise or jitter causes framing errors. Emulated protocols like CAN benefit from bit-stuffing analysis tools to confirm compliance.
What are the trade-offs between using DMA versus polling for transferring ADC samples from the STM8S207RBT6C’s 16-channel, 10-bit converter in real-time signal acquisition applications?
Polling ADC conversions simplifies code structure but consumes significant CPU cycles, limiting responsiveness in multitasking environments. The STM8S207RBT6C lacks dedicated DMA hardware, so efficient sample transfer typically relies on interrupt-driven buffering or manual memory copying. Interrupts reduce latency but increase context-switch overhead. Without DMA, achieving high-throughput sampling across all 16 channels may strain the 24MHz core, especially if processing follows each read. Alternatives include oversampling single channels or prioritizing critical inputs. For moderate-rate acquisitions (<1ksps per channel), interrupt-based approaches suffice, but aggressive sampling demands optimized assembly routines or external FIFO buffers.
How does the absence of hardware encryption or secure boot features in the STM8S207RBT6C impact firmware protection in commercial versus industrial applications?
The STM8S207RBT6C offers no cryptographic engine, secure key storage, or tamper detection mechanisms, leaving firmware vulnerable to reverse engineering or unauthorized modification. In consumer electronics, this may be acceptable due to low resale value, but industrial or medical devices often require intellectual property safeguards. Without hardware-assisted security, obfuscation, checksums, or license keys must be implemented in software—increasing attack surface and maintenance burden. Furthermore, debugging interfaces like SWIM remain unprotected, enabling easy dumping of FLASH contents. For sensitive deployments, pairing with external security chips (e.g., ATECC608A) adds layers of protection despite added complexity.
What factors determine whether the STM8S207RBT6C meets functional safety requirements in automotive or medical contexts, given its lack of ISO certification?
Although the STM8S207RBT6C is not pre-certified to standards like ISO 26262 or IEC 62304, it can still be used in safety-critical roles if rigorous development practices are followed. This includes fault injection testing, failure mode analysis (FMEA), redundant checks, and adherence to coding standards (e.g., MISRA C). Software redundancy, watchdog supervision, and memory protection schemes must compensate for potential single-event upsets (SEUs) in harsh environments. However, achieving formal certification requires third-party audits and documentation beyond typical datasheet claims. Most OEMs accept uncertified parts only for non-safety functions or when mitigated by system-level redundancies.
How does the choice of programming algorithm affect flash programming success when using the STM8S207RBT6C in production environments?
Successful programming depends on correct initialization of the SWIM interface, proper power sequencing, and avoiding voltage drops during erase/write cycles. The STM8S207RBT6C requires stable Vdd above 2.7V throughout the process, with decoupling capacitors placed close to the package. Incorrect clock selection (e.g., using external crystal during programming instead of internal oscillator) may prevent synchronization with the programmer. Additionally, locked flash pages or corrupted option bytes can halt progress. Automated test fixtures should include continuity checks, supply monitoring, and fallback recovery routines. Parallel programming strategies or batch programming reduce cycle time but increase hardware complexity.
What are the implications of the RoHS3 compliance status for global market distribution, particularly in regions with evolving hazardous substance regulations?
RoHS3 compliance confirms the absence of restricted substances (lead, mercury, cadmium, etc.) and aligns with European Union directives, facilitating entry into regulated markets. However, RoHS3 introduces additional requirements like REACH SVHC reporting and electronic product environmental footprints (EPEF). While the STM8S207RBT6C itself is unaffected by REACH restrictions, downstream products incorporating it must maintain full supply chain transparency. Manufacturers must retain technical files documenting material composition and ensure subcomponents (e.g., connectors, cables) also meet regional standards. Non-compliance risks import bans or fines, especially in California’s Proposition 65 or China’s Management Methods for Controlling Pollution by Electronic Information Products.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM8S207RBT6C

Product Attribute STM8S207RBT6CTR STM8S207RBT6TR STM8S207R8T6C STM8S207RBT6
Part Number STM8S207RBT6CTR STM8S207RBT6TR STM8S207R8T6C STM8S207RBT6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
RAM Size - - - -
Program Memory Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Speed - - - -
Data Converters - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Oscillator Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Connectivity - - - -
Core Processor - - - -
Core Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Peripherals - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Program Memory Size - - - -
Number of I/O - - - -
EEPROM Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

STM8S207RBT6C Datasheet PDF

Download STM8S207RBT6C pdf datasheets and STMicroelectronics documentation for STM8S207RBT6C - STMicroelectronics.

PCN Packaging
Box Label Chg 28/Jul/2016.pdf Material Barrier Bag 17/Dec/2020.pdf
HTML Datasheet
STM8S207xx, 208xx Datasheet.pdf
PCN Assembly/Origin
SG8E Source Add 21/Dec/2018.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Brazil 7
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DHL & FedEx Shipment Charges Reference
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0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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STM8S207RBT6C Image

STM8S207RBT6C

STMicroelectronics
32D-STM8S207RBT6C

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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