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HomeProductsIntegrated Circuits (ICs)Specialized ICsS3C44B0X01-ED80
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S3C44B0X01-ED80 - Samsung Semiconductor

Manufacturer Part Number
S3C44B0X01-ED80
Manufacturer
Samsung Semiconductor
Allelco Part Number
32D-S3C44B0X01-ED80
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,300 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 11300

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Specifications

S3C44B0X01-ED80 Tech Specifications
Samsung Semiconductor - S3C44B0X01-ED80 technical specifications, attributes, parameters and parts with similar specifications to Samsung Semiconductor - S3C44B0X01-ED80

Product Attribute Attribute Value
Part Number S3C44B0X01-ED80
Package DAC91001
Description DAC91001
Stock Condition Get 11300 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Samsung Semiconductor
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the S3C44B0X01-ED80 microcontroller that impact low-power embedded system design, and how do they compare to typical ARM7TDMI-based alternatives?
The S3C44B0X01-ED80 operates at a core voltage of 3.3V with a clock frequency up to 52 MHz, supporting dynamic voltage scaling for power management. Its typical operating current ranges from 25 mA at 50 MHz under full load to less than 1 µA in sleep mode, making it suitable for battery-powered applications. Compared to other ARM7TDMI implementations, such as the LPC2138 from NXP, the S3C44B0X01-ED80 offers similar power efficiency but lacks integrated USB functionality, which may require additional peripherals in designs prioritizing connectivity.
How does the memory configuration of the S3C44B0X01-ED80 influence real-time application performance, particularly in systems requiring concurrent execution of multiple tasks with deterministic timing?
The S3C44B0X01-ED80 features a 32-bit internal data path and integrates a 64 KB SRAM on-chip, with separate buses for code and data access. This Harvard architecture allows simultaneous instruction fetch and data access, improving throughput in time-critical applications. However, the limited 64 KB RAM restricts multitasking environments compared to devices with external memory controllers and larger internal buffers, potentially necessitating external SDRAM in complex real-time systems.
In what scenarios would the S3C44B0X01-ED80 be preferred over newer Cortex-M series microcontrollers, despite its age and lack of modern peripheral support?
The S3C44B0X01-ED80 may still be selected for legacy industrial control systems where existing firmware is deeply integrated, or in cost-sensitive educational platforms due to lower BOM costs. It provides sufficient I/O flexibility and GPIO density for simple automation tasks, though it lacks hardware floating-point units and advanced debug interfaces found in Cortex-M devices, making migration advisable for new designs requiring high computational precision or standardized toolchains.
What are the thermal and packaging considerations when integrating the S3C44B0X01-ED80 into compact consumer electronics, especially regarding long-term reliability?
The S3C44B0X01-ED80 is housed in a QFP package with a maximum junction temperature of 85°C. In dense PCB layouts common in portable devices, thermal vias and adequate copper pours around the IC are essential to dissipate heat during sustained operation near 50 MHz. Prolonged exposure above 70°C can accelerate aging, so enclosure design must ensure airflow or passive cooling to maintain junction temperatures within safe limits over the product lifecycle.
How does the S3C44B0X01-ED80 handle interrupt latency in nested interrupt environments, and what implications does this have for safety-critical applications?
The S3C44B0X01-ED80 supports up to 30 prioritized interrupts with a worst-case latency of approximately 12 clock cycles (about 230 ns at 52 MHz). While adequate for many non-safety-certified applications, this latency may exceed requirements in Class C safety standards (e.g., IEC 61508), where deterministic response times under 100 ns are often mandated. Additional software filtering or hardware watchdogs may be needed to meet such constraints.
Can the S3C44B0X01-ED80 support external flash memory expansion, and if so, what bus interface should be used for optimal performance?
Yes, the S3C44B0X01-ED80 includes an External Memory Controller (EMC) that supports synchronous burst access via the Bank Address/Data Multiplexed (BAM) interface, enabling connection to NOR or NAND flash. For NOR flash, the EMC can deliver up to 52 Mbps effective bandwidth, sufficient for executing code directly from external memory. Proper timing configuration of tACC and tOH parameters is critical to avoid setup/hold violations, especially at higher frequencies.
What development tools and debugging capabilities are available for the S3C44B0X01-ED80, and how do they compare to modern IDE ecosystems?
The S3C44B0X01-ED80 supports JTAG debugging using standard 20-pin connectors and is compatible with ARM RealView ICE and third-party tools like Keil MDK-Lite and IAR Embedded Workbench. However, support has diminished since Samsung’s transition to newer architectures; community-maintained open-source tools such as OpenOCD remain viable for basic flash programming and register inspection. This contrasts with Cortex-M devices, which benefit from extensive vendor-supported SDKs and CMSIS integration.
What layout guidelines should be followed when routing signals near the S3C44B0X01-ED80 to minimize electromagnetic interference (EMI) and ensure signal integrity?
Critical signals such as the oscillator input (XTAL1/XTAL2) and reset line should be routed with controlled impedance traces (typically 50 Ω single-ended) and kept short to reduce ringing and crosstalk. Clock lines should be length-matched to within ±100 mils if distributed to multiple peripherals. Decoupling capacitors (0.1 µF ceramic) must be placed within 2 mm of each power pin to suppress high-frequency noise, and ground planes should be unbroken beneath the device to maintain return paths and reduce loop area.

Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

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Samsung Semiconductor

S3C44B0X01-ED80

Samsung Semiconductor
32D-S3C44B0X01-ED80

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