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HomeProductsIntegrated Circuits (ICs)MemoryW25Q128FVSIQ
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W25Q128FVSIQ - Winbond Electronics

Manufacturer Part Number
W25Q128FVSIQ
Manufacturer
Winbond Electronics Corporation
Allelco Part Number
32D-W25Q128FVSIQ
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,070 pcs available, New & Original
Parts Description
IC FLASH 128MBIT SPI/QUAD 8SOIC
Package
8-SOIC
Data sheet
W25Q128FVSIQ.pdf

Datasheets

W25Q128FV.pdf

PCN Design/Specification

Mult Dev Shelf Life 1/Jul/2021.pdf

PCN Part Status Change

W25Q128JV 09/Feb/2017.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 17070
  • Unit Price: $2.299
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.299 $2.30
200+ $0.918 $183.60
500+ $0.887 $443.50
1000+ $0.872 $872.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

W25Q128FVSIQ Tech Specifications
Winbond Electronics - W25Q128FVSIQ technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics - W25Q128FVSIQ

Product Attribute Attribute Value
Manufacturer Winbond Electronics Corporation
Write Cycle Time - Word, Page 50µs, 3ms
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 8-SOIC
Series SpiFlash®
Package / Case 8-SOIC (0.209", 5.30mm Width)
Package Bag
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 128Mbit
Memory Organization 16M x 8
Memory Interface SPI - Quad I/O, QPI
Memory Format FLASH
Clock Frequency 104 MHz
Base Product Number W25Q128

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Parts Introduction

W25Q128FVSIQ Image
W25Q128FVSIQ (1)

Manufacturer Part Number

W25Q128FVSIQ

Manufacturer

winbond-electronics

Introduction

The W25Q128FVSIQ is a 128Mbit FLASH memory chip from Winbond's SpiFlash® series, utilizing NOR technology for reliable, non-volatile storage.

Product Features and Performance

Non-Volatile FLASH Memory

Memory Size: 128Mbit

Memory Organization: 16M x 8

SPI - Quad I/O, QPI Interface

Clock Frequency: 104 MHz

Write Cycle Time - Word, Page: 50µs, 3ms

Operating Temperature Range: -40°C to 85°C

Product Advantages

High data transfer speed with a 104 MHz clock frequency

Quad SPI interface allows for faster data communication

Adaptable to harsh operating conditions with a wide temperature range

Key Technical Parameters

Memory Type: FLASH - NOR

Clock Frequency: 104 MHz

Voltage Supply: 2.7V to 3.6V

Operating Temperature: -40°C to 85°C

Quality and Safety Features

Reliability under a broad range of environmental conditions

Provides stable and secure data storage

Compatibility

Compatible with systems requiring a 2.7V to 3.6V power supply and surface mount packaging

Application Areas

Ideal for code shadowing to RAM, solid-state drives, and storing configuration parameters

Product Lifecycle

The product has been discontinued at Digi-Key, alternatives might need to be considered

Check for availability of replacements or upgrades

Several Key Reasons to Choose This Product

Stable, high-speed data performance with 104 MHz clock

Robust, suitable for various adverse conditions

Provides reliable, secure data storage with its NOR flash architecture

Flexible interface options with SPI - Quad I/O, QPI support

Supports a broad voltage range from 2.7V to 3.6V, providing compatibility with diverse system configurations

Frequently Asked Questions(FAQ)

How does the W25Q128FVSIQ compare to other 128Mbit SPI Flash devices in terms of interface speed and power efficiency for battery-powered embedded systems?
The W25Q128FVSIQ supports a standard SPI clock frequency up to 104 MHz, which is among the highest in its class for 128Mbit NOR Flash. This enables faster code execution and reduced active-time power consumption during firmware updates or runtime memory access. When compared to similar-density devices such as the Winbond W25Q128JVSIM, the FV variant maintains equivalent performance but with enhanced noise immunity and tighter timing margins due to improved manufacturing tolerances. In low-power applications, this higher clock rate allows shorter active periods, contributing to better energy efficiency despite no reduction in typical supply current (1.5 µA standby). The quad I/O and QPI modes further reduce data transfer time by up to 75% compared to single-SPI mode, making it advantageous for systems where flash access frequency significantly impacts total system power budget.
What are the key differences between the W25Q128FVSIQ and alternative packages like SOIC-8 versus WSON-8 in high-volume production environments?
While functionally identical, the W25Q128FVSIQ in an 8-SOIC package differs from smaller-footprint alternatives like the WSON-8 in mechanical footprint, thermal resistance, and assembly considerations. The SOIC-8 (5.30mm width) provides better heat dissipation (θJA ≈ 120°C/W) compared to WSON variants (~80°C/W), though actual operating temperatures remain well within -40°C to +85°C range under normal conditions. For high-volume SMT lines, the larger SOIC package may require more precise pick-and-place alignment but offers easier reworkability. However, the W25Q128FVSIQ’s standard 8-SOIC form factor ensures broad compatibility with legacy PCB layouts and debug sockets, reducing redesign costs in migration scenarios.
Can the W25Q128FVSIQ be used in automotive-grade temperature applications requiring AEC-Q100 certification?
No, the W25Q128FVSIQ is not qualified to AEC-Q100 standards and operates only over -40°C to +85°C. Its industrial-grade reliability profile includes standard ESD protection (HBM >2 kV) and Moisture Sensitivity Level 3, suitable for most commercial and consumer electronics. For automotive or mission-critical applications requiring extended temperature ranges (-40°C to +125°C) or functional safety compliance, Winbond offers dedicated AEC-Q100 compliant parts such as the W25Q128JW series. The absence of automotive qualification limits its use to non-safety-related systems where environmental stress remains below 85°C ambient.
How does the write cycle endurance of the W25Q128FVSIQ impact firmware update strategies in field-deployed IoT devices?
The W25Q128FVSIQ offers a minimum of 100,000 program/erase cycles per sector (typically 4 KB or larger), which is sufficient for typical OTA firmware update workflows in IoT deployments. Assuming one full-page (256-byte) write per update, this translates to approximately 400 updates per sector before reaching nominal wear-out. With careful wear leveling across multiple logical blocks, the effective lifespan far exceeds operational requirements for most consumer IoT products. However, aggressive logging or frequent partial-sector writes without proper management could accelerate wear. Designers should implement block-based wear leveling algorithms and reserve dedicated erase blocks for updates to maximize longevity and maintain data integrity.
What precautions should be taken when interfacing the W25Q128FVSIQ with microcontrollers that have limited SPI buffer sizes?
When using the W25Q128FVSIQ with MCUs lacking deep transmit/receive buffers—such as entry-level ARM Cortex-M0+ devices—care must be taken to avoid exceeding maximum SPI transaction sizes. Although the chip supports continuous read/write operations up to its full 16 MB address space, practical limitations arise from command overhead and protocol framing. For example, a fast read operation using 4-byte addressing still requires 4 bytes of header per transaction. Thus, transferring large payloads (>1 KB) benefits from DMA support or double-buffering to prevent CPU bottlenecks. Additionally, enabling QPI mode can reduce instruction overhead by 75%, improving throughput and minimizing latency in time-sensitive applications.
Is the W25Q128FVSIQ compatible with common open-source bootloaders like U-Boot or Zephyr RTOS out of the box?
Yes, the W25Q128FVSIQ is widely supported in mainstream open-source ecosystems. Both U-Boot and Zephyr RTOS include native drivers for Winbond’s SpiFlash family, including the W25Q128FVSIQ, provided the correct JEDEC ID (EFh) and size configuration are set. In Zephyr, this corresponds to CONFIG_FLASH_PAGE_LAYOUT and CONFIG_FLASH_JESD209C definitions matching the 16M x 8 organization. U-Boot relies on the `sf probe` command with appropriate bus and chip select settings. Proper initialization requires configuring the correct clock polarity and phase (CPOL=0, CPHA=0), along with verifying voltage compatibility (2.7–3.6 V). Most reference schematics assume pull-up resistors on I/O lines if not driven actively by the host controller.
How does the deep power-down mode of the W25Q128FVSIQ affect system wake-up latency in sleep-stressed applications?
The W25Q128FVSIQ enters deep power-down mode drawing less than 1 µA when powered off via the HOLD# or RESET# pin. Upon wake-up via software command or hardware signal, it resumes full functionality within typical tRES1 = 1 µs (max 3 ms). This short resume time minimizes interrupt latency in battery-powered systems. Compared to standby modes with active clocks, deep power-down offers superior leakage control without significant recovery penalty. Designers should ensure that the host microcontroller’s GPIO driving the HOLD# line remains stable during sleep to prevent accidental wake-ups. Wake-up time is independent of previous operation state, ensuring consistent behavior across cold boots and warm resets.
What security features does the W25Q128FVSIQ offer for protecting sensitive firmware or configuration data?
The W25Q128FVSIQ includes basic hardware protection through a write-protect (WP#) pin and status register bits that enforce memory regions as read-only. It also supports a proprietary “secure” feature set including unique device IDs and optional password protection via the “Password Mode,” which encrypts all subsequent commands unless preceded by a valid 64-bit password. However, it lacks advanced cryptographic acceleration or tamper detection. For end-to-end security, external AES engines or secure elements are recommended. The device does not provide anti-rollback or side-channel resistance, so physical access attacks remain possible. Therefore, while useful for obfuscation, it should not be relied upon as the sole layer of intellectual property protection.
How does the W25Q128FVSIQ handle concurrent access conflicts when used as both external flash for firmware storage and internal RAM expansion?
As a standalone peripheral, the W25Q128FVSIQ operates exclusively on the SPI bus and cannot share transactions with other slaves unless multiplexed via chip selects. If used simultaneously with another SPI device (e.g., a sensor), proper CS# gating is essential to prevent data corruption. It does not support dual-port or parallel interfaces, so direct concurrent access from CPU and DMA is serialized by the bus arbiter. In systems where the MCU accesses both internal SRAM and external flash, arbitration logic must ensure timely servicing of flash requests to avoid missed deadlines. Some MCUs support memory-mapped flash via XIP (Execute-in-Place), which eliminates repeated SPI transactions but increases power consumption slightly during active execution.
What are the implications of the W25Q128FVSIQ’s 8-SOIC package on signal integrity at 104 MHz SPI frequencies?
At 104 MHz, the W25Q128FVSIQ demands careful PCB layout due to trace length matching and impedance control. The 8-SOIC’s wide body (5.30 mm) increases parasitic capacitance and inductance, potentially degrading rise times on high-speed lines like SCLK, SI, and SO. To maintain signal integrity, keep traces <10 cm, avoid vias in critical paths, and use series termination resistors (22–100 Ω) near the MCU if reflections occur. Differential signaling is not available, so noise coupling must be mitigated via ground shielding or differential pairs for clock lines. Decoupling capacitors (100 nF ceramic) should be placed within 5 mm of VCC pins. Failure to meet these guidelines may result in intermittent failures or reduced maximum reliable clock speed below 80 MHz.
How does the W25Q128FVSIQ perform in high-vibration environments typical of industrial or transportation systems?
The W25Q128FVSIQ uses standard lead-free SAC305 solder joints and meets IPC/JEDEC J-STD-020 for MSL 3 handling. Its SOIC package provides adequate mechanical robustness for moderate vibration, but long-term reliability depends on PCB pad design and reflow profile. Unlike BGA packages, SOIC avoids solder joint fatigue under thermal cycling alone. However, extreme mechanical shock may cause cracked leads or delamination. For harsh environments, conformal coating or encapsulation can improve resilience. Thermal cycling between -40°C and +85°C is supported per JEDEC standards, but continuous exposure beyond 85°C accelerates degradation. Mechanical stress testing is not specified, so customer validation is advised for mission-critical deployments.
Can the W25Q128FVSIQ be used in systems requiring radiation-hardened operation or space-grade reliability?
No, the W25Q128FVSIQ is not designed for radiation-hardened or space applications. It lacks Single Event Effect (SEE) mitigation and operates under standard terrestrial conditions. Radiation-induced bit flips or latchup risks are unquantified. For aerospace or satellite systems, radiation-tolerant NOR flashes such as those from Microchip or STMicroelectronics are required. The W25Q128FVSIQ’s commercial-grade process node and packaging do not meet MIL-PRF-38535 or ESA/QV standards. Use in space-rated systems would violate export controls and compromise mission integrity. Always verify part suitability against application environment specifications before deployment.
What are the trade-offs between using QPI mode versus standard SPI with the W25Q128FVSIQ for high-throughput data logging?
Enabling Quad Peripheral Interface (QPI) mode with the W25Q128FVSIQ allows four data lines (DQ0–DQ3) to operate simultaneously, effectively quadrupling bandwidth compared to single-SPI mode. This reduces command overhead and increases sustained read/write speeds up to 104 Mbps (vs. ~26 Mbps in standard SPI). However, QPI requires initialization sequences and disables some legacy commands, limiting backward compatibility. It also consumes slightly more power due to additional I/O toggling. For burst-intensive logging scenarios—such as sensor arrays sampling at 1 MSPS—QPI significantly lowers CPU load and improves real-time responsiveness. Conversely, simple applications with infrequent writes may see little benefit and incur setup latency penalties. Configuration flexibility remains via status register bits.
How does the W25Q128FVSIQ’s page erase granularity influence system memory mapping decisions?
The W25Q128FVSIQ supports page erase down to 256-byte units, allowing fine-grained updates without full-sector erasure. This contrasts with older architectures requiring 4 KB or larger erase blocks. Smaller erase units reduce erase time (3 ms/page vs. 30 ms/sector) and minimize wear in frequently updated metadata areas. However, page erase still invalidates adjacent data unless carefully managed via wear leveling. In memory-mapped systems using XIP, small erase sizes allow partial code patching without rebooting. Yet, the underlying flash physics limit write amplification; thus, logical block management remains essential regardless of physical erase size. Designers should align logical sectors with page boundaries to optimize performance.
What role does the HOLD# pin play in protecting the W25Q128FVSIQ during noisy industrial environments?
The HOLD# pin allows temporary pausing of SPI communication without deselecting the device, preserving internal state during transient interference. When asserted low, all SPI activity halts until deasserted, preventing corrupted commands during electrical noise events (e.g., motor commutations). This is particularly valuable in CAN bus or RS-485 networks where EMI spikes may trigger spurious transactions. After release, the W25Q128FVSIQ resumes operation seamlessly from its last position. However, hold time must exceed tHOLD = 10 ns after SCLK edges. While not a substitute for robust grounding or shielding, it adds a layer of resilience in electrically hostile settings. Note that during HOLD, the chip continues consuming standby current (~1.5 µA).
How does the W25Q128FVSIQ’s voltage tolerance compare to newer 1.8V-only flash solutions for mixed-voltage system designs?
The W25Q128FVSIQ operates at 2.7–3.6 V, making it incompatible with modern low-voltage MCUs running at 1.8 V without level shifters. Newer 1.8 V flash devices like the W25Q128JV-DTR eliminate this issue but often sacrifice speed or density. In mixed-voltage systems (e.g., 3.3 V MCU with 1.8 V sensors), interfacing the W25Q128FVSIQ requires bidirectional level translators on all digital lines except VCC/GND. This adds cost and complexity versus native 1.8 V compatibility. However, the W25Q128FVSIQ’s wider voltage window simplifies coexistence with legacy 3.3 V logic families, avoiding redesigns in existing platforms. Always confirm input high thresholds (VIH min = 0.7 × VCC) match host expectations.
What considerations apply when replacing the W25Q128FVSIQ with substitute parts like the W25Q128JVSIM in existing designs?
Substitutes such as the W25Q128JVSIM share the same base product number and JEDEC ID, enabling drop-in replacement in many cases. Key differences include package type (WSON-8 vs. SOIC-8), pinout (different thermal pad placement), and sometimes minor timing variations (tRES1 = 3 µs max vs. 1 µs). Electrical characteristics remain nearly identical, but layout changes require PCB modifications. The JVSIM lacks the WP# and RESET# pins present in the FV variant, altering protection capabilities. Voltage and temperature specs align, but always consult updated datasheets for absolute maximum ratings. Substitution should include functional testing under worst-case conditions to validate reliability.

Parts with Similar Specifications

The three parts on the right have similar specifications to Winbond Electronics W25Q128FVSIQ

Product Attribute W25Q128FVSIQ TR W25Q128FVSJQ TR W25Q128FVSIF TR W25Q128FVSBQ
Part Number W25Q128FVSIQ TR W25Q128FVSJQ TR W25Q128FVSIF TR W25Q128FVSBQ
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Organization - - - -
Memory Interface - - - -
Voltage - Supply - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Memory Format - - - -
Clock Frequency - - - -
Memory Type - - - -
Memory Size - - - -
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Technology - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Write Cycle Time - Word, Page - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

W25Q128FVSIQ Datasheet PDF

Download W25Q128FVSIQ pdf datasheets and Winbond Electronics documentation for W25Q128FVSIQ - Winbond Electronics.

Datasheets
W25Q128FV.pdf
PCN Packaging
Dessicant Supplier Chg 3/May/2016.pdf
PCN Design/Specification
Mult Dev Shelf Life 1/Jul/2021.pdf
PCN Part Status Change
W25Q128JV 09/Feb/2017.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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W25Q128FVSIQ Image

W25Q128FVSIQ

Winbond Electronics
32D-W25Q128FVSIQ

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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