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EP2S60F672C4 FPGA: Features, Applications, Programming & Datasheet Guide

In this guide, you’ll get a clear overview of the EP2S60F672C4, a powerful FPGA from Intel’s Stratix II family. You’ll learn about its main features, architecture, block structure, and technical specs to understand how it fits into advanced digital designs. It also walks you through its programming steps, applications, advantages, and disadvantages so you can see exactly where and how this device can be used.

Catalog

What is the EP2S60F672C4?

The EP2S60F672C4 is a high-density FPGA from Intel (formerly Altera), belonging to the Stratix II family. Built on a 90 nm, 1.2 V copper SRAM process, it delivers substantial logic capacity within a 672-ball FBGA package, making it ideal for complex digital systems. As part of the EP2S series, the “60” device sits in the mid-to-upper range of the Stratix II lineup, offering a strong balance of logic density, embedded memory, and I/O resources. Known for its robust architecture and reliability, this FPGA remains a trusted choice in many advanced designs.

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EP2S60F672C4 CAD Models

EP2S60F672C4 Symbol

EP2S60F672C4 Footprint

EP2S60F672C4 3D Model

EP2S60F672C4 Features

• Advanced 90 nm, 1.2 V CMOS Process

EP2S60F672C4 is fabricated on a 90 nm all-layer copper CMOS process that runs at a 1.2 V core voltage. This technology enables high speed, reduced power consumption, and greater logic density compared to older FPGA generations.

• Adaptive Logic Module (ALM) Architecture

The device uses ALMs as its logic building block instead of traditional logic elements. This architecture improves resource utilization, allowing more complex logic functions to be implemented efficiently within the same silicon area.

• High Logic Density

With approximately 60,440 logic elements (24,176 ALMs), the FPGA supports large and sophisticated digital designs. This high capacity makes it suitable for applications such as signal processing, communications, and embedded control systems.

• TriMatrix™ On-Chip Memory

EP2S60F672C4 integrates three types of RAM blocks, (M512, M4K, and M-RAM) to provide a total of around 2.4 Mbits of embedded memory. This mix allows to implement small FIFOs, medium buffers, and large dual-port memories efficiently.

• Dedicated DSP Blocks

The device includes 36 dedicated DSP blocks designed for arithmetic operations like multiplications, accumulations, and FIR filtering. These blocks boost performance in computation-intensive tasks while saving general logic resources.

• High-Speed I/O and Signal Integrity

It supports various single-ended and differential I/O standards along with dynamic phase alignment (DPA) circuitry. These features enable stable, high-speed data transfer up to 1 Gbps, ensuring reliable communication with external components.

• Rich External Memory Interface Support

The FPGA is compatible with DDR, DDR2, QDR II, RLDRAM II, and other memory standards. Built-in interface support simplifies board design and achieves high data throughput for memory-intensive applications.

• Flexible Clock Management

Up to 12 on-chip PLLs allow clock multiplication, division, phase shifting, and glitch-free switchover. You can fine-tune clock domains and reduce jitter, supporting internal clock frequencies of up to 500–550 MHz.

• Bitstream Encryption and Reconfiguration

EP2S60F672C4 supports AES-based bitstream encryption to secure intellectual property. It also offers remote reconfiguration capability, enabling in-field updates without replacing the device.

Stratix II Block Diagram

The Stratix II block diagram, as shown for EP2S60F672C4, illustrates the internal arrangement of logic, memory, and DSP resources that form the FPGA’s core. Logic Array Blocks (LABs) are arranged in a regular grid, surrounded by embedded RAM and DSP columns, which provide fast arithmetic and on-chip storage capabilities. Peripheral I/O elements and clock networks frame this structure, enabling efficient data transfer and timing control between the FPGA and external devices.

Stratix II I/O Banks Diagram

This Stratix II I/O Banks Diagram illustrates how the input/output pins of the EP2S60F672C4 are grouped and what electrical standards each group supports. Each I/O bank is designed to handle specific voltage levels, signaling types, and functions such as LVTTL, SSTL, LVDS, or clock input standards. The layout shows how different banks (e.g., 1, 2, 5, 6 vs. 3, 4, 7, 8, etc.) are optimized for either general-purpose I/O or high-speed differential signaling, including support for LVDS/LVPECL clock inputs at the edges.

EP2S60F672C4 Specifications

Type	Parameter
Manufacturer	Altera/Intel
Series	Stratix® II
Packaging	Tray
Part Status	Obsolete
Number of LABs/CLBs	3022
Number of Logic Elements/Cells	60,440
Total RAM Bits	2,544,192
Number of I/O	492
Voltage – Supply	1.15 V ~ 1.25 V
Mounting Type	Surface Mount
Operating Temperature	0 °C ~ 85 °C (TJ)
Package / Case	672-BBGA
Supplier Device Package	672-FBGA (27 × 27)
Base Product Number	EP2S60

EP2S60F672C4 Applications

1. Digital Signal Processing (DSP) and Filtering

EP2S60F672C4 is well suited for implementing high-performance DSP functions such as FIR and IIR filters, FFT processing, and complex arithmetic operations. Its dedicated DSP blocks handle multiplications and accumulations efficiently, freeing general logic resources for other tasks. The on-chip TriMatrix™ memory enables smooth data buffering and pipelining, which is great for real-time processing at high sample rates. This makes the device ideal for advanced audio, video, and radar signal applications.

2. High-Speed Communication and Networking

The FPGA’s high-speed I/O interfaces and dynamic phase alignment (DPA) circuitry support reliable, gigabit-level data transmission. It can implement communication protocols and physical layer functions for systems like routers, switches, and backplane interconnects. With its large logic capacity and flexible PLLs, it can manage complex timing and protocol conversions between multiple high-speed interfaces. These capabilities make it a strong fit for telecom infrastructure and high-bandwidth networking equipment.

3. Memory Controllers and Data Processing Systems

EP2S60F672C4 supports various external memory interfaces including DDR, DDR2, RLDRAM II, and QDR II, making it ideal for designing high-bandwidth memory controllers. It can handle data buffering, address generation, and arbitration at high speeds with minimal latency. The combination of fast clock networks and embedded RAM blocks allows efficient management of large data streams. This makes the FPGA suitable for image processing, video streaming, and scientific computation platforms that rely on heavy data throughput.

4. Custom Logic and Embedded Acceleration

With over 60,000 logic elements and rich clock management, the FPGA can host customized hardware accelerators for specific algorithms. Designers often use it to offload computationally intensive tasks from CPUs, such as encryption, protocol parsing, or real-time control loops. It can also integrate multiple functional blocks, making it suitable for complex SoC-like designs. This flexibility makes it valuable in applications like industrial automation, security systems, and aerospace control units.

5. Prototyping and Educational Development Platforms

The EP2S60 device is commonly found on FPGA development kits used for prototyping, testing, and academic research. Its balance of logic capacity, I/O count, and DSP capabilities allows engineers and students to implement and verify full systems on a single chip. It supports rapid iteration of digital designs, enabling hardware verification before committing to ASIC development. Many universities and R&D labs use it to teach advanced digital design and signal processing concepts.

EP2S60F672C4 Similar Parts

Specification	EP2S60F672C4	EP2S60F672C3N	EP2S60F672C5	EP2S60F672C5N	EP2S60F672I4	EP2S60F672I3N
Family / Series	Stratix II	Stratix II	Stratix II	Stratix II	Stratix II	Stratix II
Logic Elements (LE)	60,440	60,440	60,440	60,440	60,440	60,440
ALMs	24,176	24,176	24,176	24,176	24,176	24,176
Package	FBGA-672	FBGA-672	FBGA-672	FBGA-672	FBGA-672	FBGA-672
Speed Grade	C4 (Std)	C3 (Faster)	C5 (Faster)	C5 (Faster)	I4 (Std)	I3 (Faster)
Temperature Grade	Commercial (0 ~ 70 °C)	Commercial	Commercial	Commercial	Industrial (−40 ~ 100 °C)	Industrial (−40 ~ 100 °C)
I/O Pins	492	492	492	492	492	492
On-Chip Memory	2.4 Mbit	2.4 Mbit	2.4 Mbit	2.4 Mbit	2.4 Mbit	2.4 Mbit
Core Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Key Difference	Baseline commercial speed	C3 speed bin, lead-free “N”	Higher speed bin	Higher speed bin, “N” variant	Industrial temperature, same density	Industrial, faster speed, lead-free

EP2S60F672C4 Programming Steps

Before you can use the EP2S60F672C4 FPGA in your design, you need to properly configure it with your compiled bitstream. This process involves preparing the programming file, setting up the hardware interface, and ensuring that the configuration loads correctly on power-up.

Step 1: Create and Compile Your Design

You begin by developing your logic design using Intel Quartus II software. After completing the design, you compile it to generate the programming file (.sof or .pof) specifically for the EP2S60F672C4 device. The compilation process checks for timing, pin assignments, and resource usage to ensure that your design fits within the FPGA’s architecture. Once compiled, your bitstream is ready for device configuration.

Step 2: Set Up the Programming Hardware

Next, you prepare the physical programming interface between your PC and the FPGA board. Typically, this involves connecting a USB-Blaster or compatible JTAG cable to the device’s JTAG port. You should verify that Quartus II recognizes the programmer and that the target device is correctly detected. This step ensures stable communication before initiating the configuration process.

Step 3: Load the Programming File into the Device

Using the Quartus II Programmer tool, you add the compiled .sof or .pof file and select the EP2S60F672C4 from the detected device list. You then initiate the programming sequence, during which the bitstream is transferred and loaded into the FPGA’s SRAM configuration cells. You should monitor the progress bar and status messages to confirm a successful configuration. Once complete, the FPGA begins executing the programmed logic immediately.

Step 4: Verify the Configuration and Operation

After programming, you verify that the device is functioning as intended. Quartus II provides a verification option to check the configuration CRC and status signals, ensuring that the design loaded correctly. You can also test your I/O functions or run a functional simulation to confirm system behavior. This final step ensures your design is fully operational and stable on the hardware.

EP2S60F672C4 Advantages and Disadvantages

Advantages

• High logic density for complex designs

• Good performance-to-cost ratio

• Easy migration within the same family

• Stable and mature development tools

• Proven reliability in industrial use

Disadvantages

• Obsolete and harder to source

• Higher power consumption than newer FPGAs

• No modern high-speed transceivers

• More difficult timing closure at high utilization

• Limited scalability for future protocols

EP2S60F672C4 Packaging Dimensions

Type	Parameter
Package Type	672-FBGA (FineLine BGA)
Body Size (L × W)	27.00 mm × 27.00 mm
Total Package Height (A)	Max 3.50 mm
Standoff Height (A1)	Min 0.30 mm
Substrate Thickness (A2)	Max 3.00 mm
Ball Diameter (b)	0.50 mm – 0.70 mm
Ball Pitch (e)	1.00 mm
Number of Balls	672
Mounting Style	Surface Mount
Package Description	FBGA, 27 × 27 mm grid

EP2S60F672C4 Manufacturer

The EP2S60F672C4 FPGA is manufactured by Altera Corporation, a leading pioneer in programmable logic devices. In 2015, Altera was acquired by Intel, and the product now falls under Intel’s Programmable Solutions Group (PSG), which continues to support and supply Altera’s established FPGA families. Intel maintains the Stratix II line as part of its legacy product portfolio, ensuring documentation, tool support, and long-term availability for industrial and communication applications.

Conclusion

The EP2S60F672C4 combines high logic density, flexible memory architecture, and robust I/O features to support complex digital systems. Its ALM-based design, TriMatrix™ memory, DSP blocks, and clock management features enable efficient implementation of demanding applications. While it offers proven reliability and mature development support, it faces limitations such as obsolescence and lack of modern transceivers compared to newer FPGA generations. Overall, its balanced performance and versatility make it a solid choice for signal processing, communication, data handling, and prototyping applications.

Datasheet PDF

EP2S60F672C4 Datasheets:

Stratix II Device Handbook.pdf

Virtual JTAG Megafuntion Guide.pdf