
The MPC860PZQ80D4 is a 32 bit embedded microprocessor designed to combine general processing with integrated communication control in a single device. It is based on the PowerQUICC architecture and supports software execution alongside hardware assisted handling of data transfer tasks. The device operates at clock speeds up to 80 MHz and integrates instruction and data cache to support stable program flow. Its internal resources allow connection to external memory, timers, and multiple serial style interfaces, reducing the need for added components. This part is commonly used in embedded control, networking equipment, and communication focused systems that require compact integration and predictable operation.
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Arranged in a top view ball grid array layout, the MPC860PZQ80D4 pinout maps functional signals across the package to support memory, communication, control, and power distribution. Data and address pins are grouped to align with external memory interfaces, while dedicated communication pins support serial and parallel protocols managed by the on chip communications processor. Multiple power and ground balls are distributed throughout the array to maintain stable operation and signal integrity. Clock, reset, and test pins are positioned along the perimeter for system control and debugging access, and several balls are marked as no connect to preserve routing clearance and package compatibility.
The MPC860PZQ80D4 uses a 32 bit MPC8xx processing core designed to handle control oriented software and communication related tasks within a single device. The core supports structured instruction execution and stable timing behavior, making it suitable for systems that require consistent operation under continuous workloads.
This device supports core clock speeds of up to 80 MHz, allowing it to process data and manage system tasks at a steady pace. The frequency range supports balanced performance while maintaining predictable power behavior in embedded environments.
An internal communications processor module handles data movement and protocol level operations separately from the main core. This arrangement reduces processing load on the central logic and supports smoother handling of multiple communication activities.
The integrated DRAM memory controller enables direct connection to external memory devices without added control circuitry. This feature simplifies system layout and supports reliable data access for program storage and runtime operations.
The internal structure supports embedded and real time use cases where controlled response timing is expected. Built in control logic and timing resources help maintain consistent system behavior during ongoing operation.
The MPC860PZQ80D4 does not include hardware for graphics processing. Its resources are focused on computation and communication functions, aligning the device with control and data handling applications rather than display driven systems.
| Product Attribute | Attribute Value |
| Manufacturer | Rochester Electronics |
| Series | * |
| Package | Bulk |
| RoHS Status | RoHS non-compliant |
| REACH Status | Vendor Undefined |

Voltage behavior at the interface is defined by upper and lower threshold regions referenced to the VDDH and VDDL supply levels. Allowable overshoot extends above the nominal supply by specified percentages for limited durations within a single bus clock interface period. Undershoot limits are constrained relative to ground, with negative excursions restricted to defined voltage levels and time windows not exceeding a fraction of the interface period. VIH and VIL regions mark valid input logic thresholds, while dashed timing indicators associate transient voltage events with the corresponding clock cycle.

Correlation between board temperature rise and junction temperature rise normalized by package power is presented using a linear trend. The horizontal axis represents board temperature increase above ambient divided by package power, while the vertical axis represents junction temperature increase above ambient divided by package power. Data points align closely with the fitted line, indicating a proportional thermal relationship. This relationship supports estimating junction temperature from board temperature rise under defined power dissipation conditions.
The MPC860PZQ80D4 is used in industrial automation platforms that combine process control with data communication. It can manage control logic, timing tasks, and interface coordination within a single processing unit. This makes it suitable for programmable controllers, monitoring stations, and distributed control modules that operate continuously in structured environments.
In telecommunications systems, the MPC860PZQ80D4 supports control and signaling functions that manage data flow between network elements. It is applied in access equipment, switching control boards, and communication interface modules where stable coordination between processing and data handling is required.
The device is applied in embedded networking hardware that performs routing, management, or interface control functions. It can coordinate data movement across multiple communication paths while running system software, which suits compact routers, gateways, and network management units.
The MPC860PZQ80D4 is commonly used in embedded control systems that rely on predictable software execution and steady communication. These systems include machinery controllers, measurement platforms, and integrated control units where processing and data exchange occur in parallel.
In transportation and infrastructure related systems, the MPC860PZQ80D4 supports control and monitoring tasks that require long term stability. Typical uses include traffic management equipment, vehicle subsystem controllers, and fixed control units that coordinate signals, sensors, and communication links.

Defined using top view, side view, and bottom view drawings, the package outlines the physical size and mounting profile of the PBGA form factor used by MPC860PZQ80D4. Dimensions are specified in millimeters with labeled parameters covering overall body width and length, ball array span, and package height. The bottom view details a 357 ball layout arranged in a uniform grid with consistent pitch, supporting accurate board alignment and solder placement. Side view measurements describe standoff height and body thickness, while tolerance notes reference standard mechanical dimensioning practices to ensure compatibility with printed circuit board assembly requirements.
• Mature MPC8xx processor design with stable operating behavior
• Integrated communications processor reduces the need for added components
• Supports a range of communication functions within a single device
• Low power operation suited for long running embedded systems
• High integration level simplifies board layout and system planning
• Processing capability is limited compared to newer microprocessor designs
• Not compliant with RoHS environmental requirements
• Lacks built in support for graphics or multimedia processing
• Limited internal memory resources by current standards
• REACH compliance status is not clearly defined
| Part Number | Manufacturer | Key Features | Use Case/Notes |
| MPC860PZQ50D4 | Rochester Electronics, LLC | PowerQUICC microprocessor integrating a CPU core, memory controller, and communication peripherals for embedded processing. | Used in legacy networking equipment, industrial controllers, and embedded systems requiring integrated communication support. |
| MPC860SRCVR66D4 | Rochester Electronics, LLC | MPC860-family processor variant with integrated communication controllers and on-chip peripherals for embedded applications. | Suitable for telecommunications hardware, routers, and control systems based on the MPC860 architecture. |
| MPC860PZQ80D4 | Freescale Semiconductor | Original PowerQUICC processor combining CPU, memory management, and communication modules in a single device. | Applied in networking infrastructure, industrial automation, and legacy embedded designs using Freescale MPC86xx processors. |
NXP Semiconductors is a global semiconductor company focused on embedded processing, connectivity, and secure system solutions. The company develops a broad range of microcontrollers, processors, and system level devices used in industrial, automotive, networking, and infrastructure applications. Its product portfolio emphasizes long term platform stability, wide system integration, and support for complex embedded functions. NXP builds on decades of experience in embedded and communications technologies, with product families designed to support control, data handling, and secure operation across a wide variety of electronic systems.
You can see that the MPC860PZQ80D4 is built to balance processing and communication tasks in one device. Its integrated features help reduce extra components and keep system layouts simple. The processor works well in environments where steady timing and long-term operation matter. While it may not match newer chips in raw performance, it still fits many control and networking needs. Its packaging, pinout, and thermal behavior make planning easier. Overall, it remains a dependable option for communication-focused embedded systems.
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It is a 32-bit embedded microprocessor based on the PowerQUICC architecture, designed for control and communication tasks.
The processor supports clock speeds of up to 80 MHz.
Yes, it has an integrated communications processor module that handles data transfer tasks separately from the main core.
It is often used in industrial control, telecommunications equipment, embedded networking devices, and infrastructure systems.
No, it does not include graphics acceleration and is focused on computation and communication functions.
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