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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC2VP7-5FF896C
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XC2VP7-5FF896C - AMD

Manufacturer Part Number
XC2VP7-5FF896C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC2VP7-5FF896C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,140 pcs available, New & Original
Parts Description
IC FPGA 396 I/O 896FCBGA
Package
896-FCBGA (31x31)
Data sheet
XC2VP7-5FF896C.pdf

PCN Obsolescence/ EOL

Mult Dev EOL 6/Jan/2020.pdf

Environmental Information

Xilinx REACH211 Cert.pdf
RoHs Status
 
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Our certification
In stock: 7140

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Specifications

XC2VP7-5FF896C Tech Specifications
AMD - XC2VP7-5FF896C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC2VP7-5FF896C

Product Attribute Attribute Value
Manufacturer AMD Xilinx
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 811008
Supplier Device Package 896-FCBGA (31x31)
Series Virtex®-II Pro
Package / Case 896-BBGA, FCBGA
Product Attribute Attribute Value
Package Bulk
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 11088
Number of LABs/CLBs 1232
Number of I/O 396
Mounting Type Surface Mount

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

XC2VP7-5FF896C

Manufacturer

Xilinx

Introduction

The XC2VP7-5FF896C is a Virtex-II Pro FPGA from Xilinx, designed for embedded applications. It offers a high-performance, feature-rich platform with configurable logic blocks, embedded PowerPC processors, and advanced I/O capabilities.

Product Features and Performance

1232 Configurable Logic Blocks (CLBs) with 11,088 logic cells

811,008 total RAM bits

396 user I/O pins

Operating voltage of 1.425V to 1.575V

Operating temperature range of 0°C to 85°C

896-pin Ball Grid Array (BGA) package

Product Advantages

Powerful and flexible FPGA architecture for a wide range of embedded applications

Embedded PowerPC processors for high-performance computing

Extensive on-chip memory and advanced I/O capabilities

Configurable and reconfigurable design

Key Reasons to Choose This Product

Robust and reliable FPGA solution from a leading manufacturer

Suitable for a variety of embedded applications requiring high-performance and flexibility

Versatile architecture that can be customized to meet specific design requirements

Proven track record and support from Xilinx

Quality and Safety Features

Rigorous testing and quality control processes

Compliance with industry standards and regulations

Thermal management features for reliable operation

Compatibility

Compatible with Xilinx's comprehensive design tools and software ecosystem

Supports integration with a wide range of peripherals and interface standards

Application Areas

Embedded systems

Industrial automation and control

Telecommunications

Medical devices

Military and aerospace applications

Product Lifecycle

This product is currently in the Obsolete status, meaning it is no longer in active production. However, there are several alternative and equivalent Virtex-II Pro FPGA models available from Xilinx, such as the XC2VP20, XC2VP30, and XC2VP50, which offer similar or enhanced capabilities. Customers are advised to contact our website's sales team for more information on available options and support for the XC2VP7-5FF896C or its alternatives.

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the XC2VP7-5FF896C FPGA for high-speed digital signal processing applications?
The XC2VP7-5FF896C offers 11,088 logic elements and 811,008 RAM bits, enabling complex DSP implementations with moderate resource utilization. However, its operating voltage range of 1.425V to 1.575V necessitates careful power management in low-power designs, potentially increasing system complexity compared to lower-voltage alternatives. While sufficient for many DSP workloads, designers must evaluate whether the available DSP slices and block RAM are adequate for target throughput requirements, as this part lacks dedicated DSP48 units present in newer architectures.
How does the XC2VP7-5FF896C compare to similar Virtex-II Pro FPGAs in terms of I/O flexibility and routing efficiency?
Compared to other Virtex-II Pro devices like the XC2VP30 or XC2VP20, the XC2VP7-5FF896C provides a balanced configuration with 396 general-purpose I/O pins and 1,232 LABs/CLBs. This combination supports medium-complexity systems requiring substantial I/O bandwidth without the extreme pin count of larger FPGAs. Routing efficiency is typical of the Virtex-II Pro family, meaning that designs approaching 50% utilization may experience significant timing closure challenges due to congestion in the 31x31 FCBGA package.
What environmental and regulatory considerations should be made when integrating the XC2VP7-5FF896C into industrial control systems?
The XC2VP7-5FF896C operates within an industrial temperature range of 0°C to 85°C (TJ), making it suitable for standard industrial environments. However, its RoHS non-compliant status requires special handling for lead-based soldering and limits use in certain regions or end-products subject to strict environmental regulations. Designers must account for this by verifying supply chain compliance and considering alternative packaging if required for certification purposes.
Is the XC2VP7-5FF896C suitable for real-time embedded systems requiring deterministic latency?
The XC2VP7-5FF896C can support deterministic behavior when properly constrained, but achieving tight timing margins demands careful floorplanning and constraint definition. With 11,088 logic elements spread across 1,232 LABs, the architecture allows for localized logic clustering that aids predictability. However, global clock distribution and long combinatorial paths through the fabric may introduce variable delays, making it less ideal for ultra-low-latency applications compared to hardened-core SoCs or newer FPGAs with improved timing predictability.
What are the implications of using the XC2VP7-5FF896C in aerospace or defense applications regarding radiation tolerance?
The XC2VP7-5FF896C is not specified for radiation-hardened operation and exhibits susceptibility to single-event upsets (SEUs) under ionizing radiation. Therefore, it is generally unsuitable for space or high-altitude applications without additional mitigation techniques such as scrubbing circuits or triple modular redundancy. For terrestrial defense systems where radiation exposure is minimal, it may be acceptable, but formal qualification against relevant standards (e.g., MIL-STD-883) is essential before deployment.
How does power consumption scale with design density on the XC2VP7-5FF896C, and what strategies mitigate thermal concerns?
Power dissipation increases nonlinearly with switching activity and logic utilization due to dynamic current draw from the core voltage rails (1.425V–1.575V). At full utilization, estimated static and dynamic power could exceed 5W depending on configuration and external loads. Thermal management requires PCB-level heatsinking and possibly airflow, especially given the fine-pitch 896-FCBGA package which has limited direct heat dissipation paths. Designers should monitor junction temperatures via internal sensors and avoid sustained high-load conditions near 85°C TJ limit.
Can the XC2VP7-5FF896C be used in automotive infotainment systems compliant with AEC-Q100?
While the XC2VP7-5FF896C meets industrial temperature requirements, it is not certified under AEC-Q100 automotive reliability standards. Its absence from qualified component lists and lack of failure mode tracking make it inappropriate for safety-critical automotive subsystems. For non-safety infotainment modules, engineers might consider it if cost and performance justify bypassing formal automotive qualification—but this carries liability and warranty risks.
What development tools and IP availability support efficient implementation of the XC2VP7-5FF896C in prototyping environments?
The XC2VP7-5FF896C is supported by Xilinx ISE Design Suite (legacy toolchain), though newer platforms like Vivado no longer provide full compatibility. Limited third-party IP cores exist for legacy interfaces such as PCI Express or Gigabit Ethernet due to obsolescence. Designers often rely on open-source cores or custom RTL to fill gaps, which increases verification effort but preserves functional flexibility during early-stage prototyping.
How do Moisture Sensitivity Level (MSL) and packaging affect assembly yield when sourcing the XC2VP7-5FF896C?
Classified as MSL 4 (72-hour bake window), the XC2VP7-5FF896C demands strict moisture control during reflow soldering. Improper handling can cause popcorning damage, reducing yield in high-volume manufacturing. The 896-ball FCBGA package also poses challenges for rework and inspection due to small ball pitch and dense layout. Suppliers with advanced packaging facilities and controlled fabrication environments are better equipped to deliver reliable parts at scale.
What migration path options exist if future designs require higher logic capacity than the XC2VP7-5FF896C can offer?
Upgrading beyond 11,088 logic elements typically leads to next-generation Xilinx FPGAs like the Spartan-6 or early Artix-7 families, which offer improved power efficiency and modern features. Alternatively, migrating to mid-range Kintex or Virtex-6 devices provides significantly more resources and better tool support, albeit at higher cost. Engineers should evaluate whether architectural improvements outweigh the benefits of staying within the legacy Virtex-II Pro ecosystem before committing to a migration strategy.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC2VP7-5FF896C

Product Attribute XC2VP7-5FFG896I XC2VP7-5FF896I XC2VP7-5FF672C XC2VP7-5FFG672C
Part Number XC2VP7-5FFG896I XC2VP7-5FF896I XC2VP7-5FF672C XC2VP7-5FFG672C
Manufacturer Xilinx Xilinx AMD AMD
Total RAM Bits - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Number of Logic Elements/Cells - - - -
Number of I/O - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of LABs/CLBs - - - -

XC2VP7-5FF896C Datasheet PDF

Download XC2VP7-5FF896C pdf datasheets and AMD documentation for XC2VP7-5FF896C - AMD.

Datasheets
Virtex-II Pro, Pro X.pdf
PCN Obsolescence/ EOL
Mult Dev EOL 6/Jan/2020.pdf
Environmental Information
Xilinx REACH211 Cert.pdf

Customers Also Interested in

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

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Third-party certified, strict quality control. Our certification
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AMD

XC2VP7-5FF896C

AMD
32D-XC2VP7-5FF896C

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