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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMC908LJ24CPKE
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MC908LJ24CPKE - NXP USA Inc.

Manufacturer Part Number
MC908LJ24CPKE
Manufacturer
NXP Semiconductors
Allelco Part Number
98D-MC908LJ24CPKE
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,015 pcs available, New & Original
Parts Description
IC MCU 8BIT 24KB FLASH 80FQFP
Package
80-FQFP (12x12)
Data sheet
MC908LJ24CPKE.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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In stock: 10015

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Specifications

MC908LJ24CPKE Tech Specifications
NXP USA Inc. - MC908LJ24CPKE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MC908LJ24CPKE

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Supplier Device Package 80-FQFP (12x12)
Speed 8MHz
Series HC08
RAM Size 768 x 8
Program Memory Type FLASH
Program Memory Size 24KB (24K x 8)
Peripherals LCD, LVD, POR, PWM
Package / Case 80-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 6x10b
Core Size 8-Bit
Core Processor HC08
Connectivity I²C, IRSCI, SPI
Base Product Number MC908

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the MC908LJ24CPKE compare to other HC08 series microcontrollers in terms of memory architecture and peripheral integration for embedded control applications?
The MC908LJ24CPKE features a 24KB FLASH program memory organized as 24K x 8 bits, providing sufficient code space for moderate complexity embedded tasks. Unlike some HC08 variants with split memory architectures or larger EEPROM, this device uses pure FLASH for both program and data storage, simplifying memory management. It integrates essential peripherals including I2C, SPI, IRSCI, PWM, LCD drivers, low-voltage detection (LVD), and a 6-channel 10-bit ADC—features that reduce external component count in industrial sensor monitoring or consumer automation systems. When compared to smaller HC08 models like the MC908JL8 with only 8KB FLASH, the LJ24 offers nearly triple the program capacity while maintaining the same core instruction set and clock speed of 8MHz.
What are the thermal and operational limitations of the MC908LJ24CPKE when deployed in industrial environments, and how do these constraints affect system reliability?
Operating within a temperature range of -40°C to +85°C, the MC908LJ24CPKE is suitable for most industrial control environments but not extreme conditions such as automotive under-hood applications. Its internal oscillator provides stable clocking across this range, though frequency accuracy may drift slightly at temperature extremes. The package’s 80-LQFP (12x12) configuration offers good thermal dissipation due to leadframe design, but sustained high ambient temperatures near 85°C may require derating of continuous current on I/O pins. For systems requiring tighter timing or higher precision analog functions, external crystal options should be evaluated despite the lack of dedicated XOSC circuitry.
In what scenarios would the MC908LJ24CPKE be preferred over ARM Cortex-M0-based MCUs despite its lower performance and older architecture?
The MC908LJ24CPKE may be chosen in legacy system upgrades, cost-sensitive designs where bill-of-materials savings outweigh raw performance needs, or applications with strict electromagnetic compatibility requirements due to its mature noise profile. Its deterministic interrupt response and simplified pipeline make it predictable in real-time control loops, such as motor regulation or simple sensor fusion. Additionally, existing toolchains and firmware libraries for the HC08 ecosystem can accelerate development timelines compared to adopting newer architectures. However, it lacks hardware floating-point units and advanced debug features found in modern MCUs, limiting use in signal-processing-intensive roles.
How does the power supply range of 3V to 5.5V influence the selection of voltage regulation components when integrating the MC908LJ24CPKE into a battery-powered device?
The wide supply tolerance enables direct operation from standard 3.3V or 5V logic rails without level shifting, reducing component count. In battery-powered systems—such as those using Li-ion or NiMH cells—the MCU can operate directly from the cell voltage as it decays from 4.2V down to 3.0V, extending usable runtime before shutdown. This eliminates the need for a separate linear regulator unless precise analog performance is required. However, designers must ensure the chosen voltage source remains within 3–5.5V during worst-case loads, especially considering brown-out reset thresholds near 3.0V may trigger premature resets if not properly managed through software debouncing.
Can the MC908LJ24CPKE support real-time operating systems (RTOS) effectively, and what RAM size considerations apply for task scheduling overhead?
With 768 bytes of SRAM, the MC908LJ24CPKE has limited memory for RTOS use. While lightweight schedulers like FreeRTOS can run, task stacks and shared buffers consume significant portions of this resource. A typical idle task might require 64–128 bytes, leaving little room for multiple concurrent threads. Developers should minimize global variables, use static allocation, and avoid dynamic memory allocation. Given the 8-bit core’s slower context-switch times compared to 32-bit MCUs, an RTOS adds more overhead relative to available bandwidth. Thus, it’s better suited for single-threaded state machines or two-priority-level systems rather than complex multitasking environments.
What trade-offs exist between using the internal oscillator versus an external crystal for the MC908LJ24CPKE in time-critical communication protocols like UART baud rate generation?
The internal oscillator runs at 8MHz with typical tolerance of ±2% to ±5%, which may cause UART baud rate inaccuracies beyond acceptable limits for high-speed serial links (e.g., >115200 baud). For reliable RS-232 or CAN communication, an external crystal ensures precise timing. However, adding a crystal increases PCB area, cost, and susceptibility to shock/vibration. The MC908LJ24CPKE lacks built-in compensation circuitry, so temperature-induced drift becomes more pronounced. In many cases, the internal RC suffices for lower-speed links (≤9600 baud), but designers should validate bit error rates empirically under actual operating conditions.
How does the absence of EEPROM impact data logging applications using the MC908LJ24CPKE, and what alternative strategies exist for non-volatile parameter storage?
Without onboard EEPROM, the MC908LJ24CPKE cannot retain configuration data across power cycles without additional hardware. Designers must implement wear-leveling algorithms in FLASH memory sectors, accepting limited write cycles (~10k–100k depending on process node). To mitigate, critical parameters can be stored in mirrored locations with checksum validation, and writes deferred until necessary. Alternatively, external serial EEPROMs (e.g., 24LCxx) can be added via I2C, trading board space for reliability. This approach allows unlimited write endurance but introduces latency and dependency on another IC.
What are the implications of the Moisture Sensitivity Level (MSL) rating of 3 for the MC908LJ24CPKE in mass production assembly processes?
An MSL of 3 indicates the MC908LJ24CPKE requires handling precautions after moisture exposure. After opening the bulk packaging, it must be soldered within 168 hours at <30°C/60% RH, or baked prior to reflow. Failure to comply risks popcorning during reflow, causing internal delamination and latent failures. Production facilities must follow IPC/JEDEC J-STD-033 guidelines, including humidity indicator cards and dry storage cabinets. This adds logistical complexity compared to MSL-1 parts but is manageable in standard surface-mount workflows with proper inventory controls.
How does the pin count and layout of the 80-FQFP package affect PCB routing density when using the MC908LJ24CPKE in compact designs?
The 80-pin FQFP (12x12 mm body) offers 48 general-purpose I/Os distributed across four sides, enabling flexible signal routing. However, dense BGA-like pin spacing (~0.5mm pitch) demands careful layer stackup and via placement to avoid crosstalk, especially for high-speed signals like SPI or I2C. Power and ground planes should be adjacent to minimize inductance. In ultra-compact designs, decoupling capacitors must be placed within 2mm of VDD pins, and long traces should be avoided on clock lines. Thermal vias under the package enhance heat dissipation but increase fabrication cost.
Why might the MC908LJ24CPKE be selected over more recent 8-bit MCUs with similar flash size but higher clock speeds?
Despite running at 8MHz, the MC908LJ24CPKE benefits from mature compiler optimizations, extensive third-party library support, and proven reliability in field deployments spanning decades. In applications where throughput is not bandwidth-limited—such as relay control, basic sensor polling, or LED sequencing—the lower clock speed is irrelevant. Its deterministic execution model simplifies timing analysis, and the lack of cache or branch prediction reduces unpredictability. Furthermore, migration costs from legacy HC08 codebases justify continued use even if newer alternatives offer higher peak performance.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MC908LJ24CPKE

Product Attribute MC908LJ24CPKE MC908LJ24CPBER MC908LK24CPKE MC908LK24CPKER
Part Number MC908LJ24CPKE MC908LJ24CPBER MC908LK24CPKE MC908LK24CPKER
Manufacturer Freescale Semiconductor NXP USA Inc. NXP USA Inc. NXP USA Inc.
Peripherals - - - -
Core Size - - - -
Oscillator Type - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Program Memory Size - - - -
RAM Size - - - -
Connectivity - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Data Converters - - - -
Number of I/O - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Speed - - - -
Program Memory Type - - - -
Core Processor - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
EEPROM Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

MC908LJ24CPKE Datasheet PDF

Download MC908LJ24CPKE pdf datasheets and NXP USA Inc. documentation for MC908LJ24CPKE - NXP USA Inc..

Datasheets
Cylindrical Battery Holders.pdf
PCN Packaging
2.73KHz.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
MC908LJ24CPKE Image

MC908LJ24CPKE

NXP USA Inc.
98D-MC908LJ24CPKE

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