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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMC908MR16VFUE
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MC908MR16VFUE - NXP USA Inc.

Manufacturer Part Number
MC908MR16VFUE
Manufacturer
NXP Semiconductors
Allelco Part Number
98D-MC908MR16VFUE
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,563 pcs available, New & Original
Parts Description
IC MCU 8BIT 16KB FLASH 64QFP
Package
64-QFP (14x14)
Data sheet
MC908MR16VFUE.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 31563
  • Unit Price: $14.947
  • Subtotal: $0.00

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Specifications

MC908MR16VFUE Tech Specifications
NXP USA Inc. - MC908MR16VFUE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MC908MR16VFUE

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V
Supplier Device Package 64-QFP (14x14)
Speed 8MHz
Series HC08
RAM Size 768 x 8
Program Memory Type FLASH
Program Memory Size 16KB (16K x 8)
Peripherals LVD, POR, PWM
Package / Case 64-QFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Number of I/O 44
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 10x10b
Core Size 8-Bit
Core Processor HC08
Connectivity SCI, SPI
Base Product Number MC908

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the MC908MR16VFUE compare to other HC08 series microcontrollers in terms of power consumption and operating voltage range when used in battery-powered industrial sensor nodes?
The MC908MR16VFUE operates within a 4.5V to 5.5V supply range, which is typical for many HC08 variants, but its internal oscillator and low-power peripherals allow efficient operation in constrained environments. While not specifically ultra-low-power like some newer MCUs, its 8MHz speed and integrated LVD (Low-Voltage Detection) make it suitable for applications where voltage stability matters more than deep sleep modes. Compared to lower-end HC08s with external crystal requirements, this model reduces system cost and power overhead by using an internal oscillator, though at the expense of frequency precision.
What are the key differences between the MC908MR16VFUE and the MC908GP32ACFUE regarding memory architecture and peripheral integration for motor control applications?
The MC908MR16VFUE features 16KB of flash memory and 768 bytes of RAM, while the MC908GP32ACFUE offers 32KB flash and 1KB RAM, providing double the program storage and significantly more runtime data space. For motor control, the GP32 variant includes enhanced PWM modules and better analog front-ends, making it more suitable for complex timing and feedback loops. In contrast, the MR16VFUE relies on simpler PWM capabilities and lacks certain analog comparators, limiting its use to basic speed or direction control without closed-loop feedback.
Can the MC908MR16VFUE be used in automotive temperature environments, and what design precautions should be taken given its -40°C to 105°C operating range?
Yes, the MC908MR16VFUE supports operation from -40°C to 105°C, meeting many automotive-grade temperature classifications under AEC-Q100 Level 3 conditions. However, compliance requires additional qualification beyond the datasheet specification. Designers must ensure stable power delivery, avoid rapid thermal transients that stress the package, and verify internal oscillator drift across the full range—especially if timing-critical protocols like SPI are used over long cables in cold starts.
What considerations apply when selecting the MC908MR16VFUE for a serial communication interface requiring both SCI and SPI support in a multi-device industrial network?
The MC908MR16VFUE provides one SCI module (asynchronous UART) and one SPI module (synchronous master/slave), allowing bidirectional communication with up to four slaves via daisy-chaining. When implementing multiple devices, attention must be paid to SPI bus capacitance, pull-up resistors, and signal integrity due to the limited drive strength of the GPIO pins. Additionally, software overhead increases with polling-based implementations, so interrupt-driven designs improve responsiveness. Unlike higher-end HC08s, there's no hardware I²C or dual SCI support, limiting protocol flexibility.
How much flash memory remains available for firmware updates after accounting for bootloader space and interrupt vectors on the MC908MR16VFUE?
With 16KB total flash, approximately 14.5KB is typically available for user code after reserving space for interrupt vectors (about 256 bytes) and assuming a standard 1KB bootloader. This leaves roughly 14KB for application logic—sufficient for moderate control algorithms but marginal for large state machines or extensive logging buffers. Developers must optimize ISR execution time and consider compressed firmware delivery methods to accommodate future feature additions.
Is the internal oscillator of the MC908MR16VFUE accurate enough for reliable SPI communication over long distances or at high baud rates?
At 8MHz nominal frequency, the internal RC oscillator has typical accuracy of ±2% over temperature and voltage, leading to potential baud rate errors up to ±4%. For short traces (<10cm), this may suffice, but for longer cables or precise timing requirements, an external crystal provides ±10 ppm stability. In SPI mode, clock skew becomes critical; thus, many designs opt for an external 4–8 MHz crystal even with the internal oscillator enabled as backup during brownout conditions.
What trade-offs exist between using the ADC built into the MC908MR16VFUE versus discrete components in a battery monitoring circuit?
The MC908MR16VFUE includes a 10-bit successive approximation ADC with 10 channels, offering sufficient resolution for most battery voltage measurements (e.g., 0–5V range gives ~5mV per step). However, it lacks input buffering and has limited sampling rate (~100 ksps theoretical, but often lower due to overhead). Using discrete op-amps or dedicated fuel gauges improves accuracy and reduces MCU load, but adds BOM cost and PCB area. For simple systems, the integrated ADC suffices if calibration accounts for offset and gain drift.
How does the pin count and layout of the MC908MR16VFUE impact routing complexity in dense PCBs with mixed-signal components?
The 64-pin QFP (14x14 mm) package provides 44 general-purpose I/Os, which is adequate for mid-complexity designs but requires careful layer stack planning. Power and ground planes are essential to manage noise coupling into analog inputs like the ADC. Decoupling capacitors must be placed close to VDD/VSS pins, and high-speed signals such as SPI should be routed as controlled impedance traces if lengths exceed 1 inch. Thermal vias under the exposed pad help dissipate heat during sustained operation, especially when driving loads directly from GPIOs.
What role does the POR (Power-On Reset) feature play in ensuring reliable startup sequences with the MC908MR16VFUE in field-deployed equipment?
The POR circuit monitors VDD and holds the microcontroller in reset until it stabilizes above the threshold (typically 4.3V for the upper limit and 4.0V for release). This prevents erratic behavior during power cycling caused by voltage droop or ripple—common in unregulated supplies. Without POR, partial initialization could corrupt flash memory or leave peripherals in undefined states. Combined with the LVD, it enables robust recovery from brownouts, enhancing reliability in remote installations.
Why might a designer choose the MC908MR16VFUE over a newer ARM Cortex-M0+ despite its older architecture?
The MC908MR16VFUE offers proven reliability, extensive legacy toolchain support, and deterministic execution—critical for safety-critical or legacy-compatible systems. Its simple instruction set reduces debugging complexity, and the availability of in-circuit emulators simplifies development. For applications where real-time performance is linear rather than logarithmic (e.g., sensor polling), the 8-bit core suffices. Cost-sensitive designs also benefit from mature manufacturing and lower licensing fees compared to ARM cores.
How should the MC908MR16VFUE be programmed initially if no external debugger is immediately available?
Initial programming typically requires an in-system programmer (ISP) compatible with the bootstrap ROM mechanism. The device enters programming mode automatically after reset if specific pin conditions are met (usually holding BKGD/MOD pin high during power-up). Tools like CodeWarrior or PeMicro provide GUI interfaces for flashing the 16KB flash block. Once programmed, subsequent updates can use UART-based bootloaders leveraging the SCI port, enabling field upgrades without hardware access.
What limitations exist in the interrupt handling capability of the MC908MR16VFUE that affect real-time response in event-driven systems?
The MC908MR16VFUE supports only one level of vectored interrupts, meaning all peripherals share a single interrupt vector table with priority determined by hardware order. Unlike nested interrupt controllers, simultaneous events (e.g., ADC completion and SPI transmit ready) require careful masking and polling within the ISR. This limits responsiveness in high-throughput scenarios and increases latency for time-sensitive tasks. Workarounds include prioritizing critical interrupts and minimizing ISR duration through deferred processing.
Does the absence of EEPROM in the MC908MR16VFUE impose constraints on non-volatile data storage for configuration settings?
Correct—the MC908MR16VFUE does not include internal EEPROM, so persistent data such as calibration offsets or user preferences must be stored in flash. Flash endurance is typically rated at 10k cycles, so frequent writes degrade reliability over time. To mitigate this, wear-leveling algorithms or periodic averaging reduce write frequency. Alternatively, external serial EEPROMs (e.g., 24LCxx) add BOM cost but offer higher endurance and simpler management.
How does the moisture sensitivity level (MSL 3) of the MC908MR16VFUE influence reflow soldering processes in mass production?
As an MSL 3 component, the MC908MR16VFUE must be soldered within 168 hours (7 days) after opening its humidity barrier bag. If exposure exceeds this window, bake-out at 125°C for 24 hours is required before reflow to prevent popcorning during thermal cycling. Production schedules must account for desiccant replenishment and floor life tracking to avoid yield loss due to delamination or cracking in the QFP package.
What impact does the 8MHz maximum speed have on code density and execution time when developing control loops with the MC908MR16VFUE?
Running at 8MHz, each instruction cycle takes about 0.5 µs (assuming 2 cycles per instruction average). This allows tight loops to execute every few microseconds, sufficient for basic PID control or LED blinking. However, complex math (e.g., floating-point operations) consumes multiple cycles and increases jitter. Fixed-point arithmetic or lookup tables improve efficiency. Code density is moderate; larger programs may approach the 16KB limit, necessitating modularization or optimization techniques like loop unrolling.
Are there known errata or silicon revisions affecting the MC908MR16VFUE that engineers should reference before finalizing designs?
NXP maintains an errata document for each MCU family, including the MC908 series. Common issues include minor ADC offset variations across lots, occasional SPI framing errors at extreme baud rates, and rare cases of incorrect POR behavior under rapid voltage transitions. Reviewing the latest revision-specific errata before production is strongly advised, as these can impact timing margins or functional correctness in edge cases.
What advantages does the QFP packaging provide for the MC908MR16VFUE in automated assembly lines?
The 64-pin QFP (14x14 mm) is well-suited for pick-and-place machines due to its gull-wing leads, which resist bending during handling. It occupies moderate board real estate while supporting fine-pitch routing (0.5mm pitch), enabling compact layouts. The exposed thermal pad enhances heat dissipation during soldering, reducing warpage risk. Compatibility with standard reflow profiles and solder paste stencils simplifies high-volume manufacturing.
How does the RoHS3 compliance status of the MC908MR16VFUE affect supply chain logistics and regulatory documentation in global markets?
RoHS3 compliance means the MC908MR16VFUE meets EU Directive 2015/869 restrictions on four phthalates (DEHP, DBP, BBP, DIBP), expanding beyond lead, mercury, and cadmium. This ensures compatibility with European and international environmental regulations, avoiding customs delays or market bans. Documentation typically includes a Declaration of Conformity and material composition report, which suppliers provide upon request. REACH unaffected status further simplifies export procedures.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MC908MR16VFUE

Product Attribute MC908MR16CFUE MC908MR16CFUE MC908MR32VFUE MC908MR32VFUE
Part Number MC908MR16CFUE MC908MR16CFUE MC908MR32VFUE MC908MR32VFUE
Manufacturer NXP USA Inc. Freescale Semiconductor Freescale Semiconductor NXP USA Inc.
Core Processor - - - -
Oscillator Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
RAM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
EEPROM Size - - - -
Speed - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Connectivity - - - -
Program Memory Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Data Converters - - - -
Program Memory Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Core Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of I/O - - - -
Peripherals - - - -
Series - - - -

MC908MR16VFUE Datasheet PDF

Download MC908MR16VFUE pdf datasheets and NXP USA Inc. documentation for MC908MR16VFUE - NXP USA Inc..

Datasheets
MC68HC908MR16,32.pdf
PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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MC908MR16VFUE Image

MC908MR16VFUE

NXP USA Inc.
98D-MC908MR16VFUE

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