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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersMKE02Z16VLC4
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MKE02Z16VLC4 - NXP USA Inc.

Manufacturer Part Number
MKE02Z16VLC4
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-MKE02Z16VLC4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
28,231 pcs available, New & Original
Parts Description
IC MCU 32BIT 16KB FLASH 32LQFP
Package
32-LQFP (7x7)
Data sheet
MKE02Z16VLC4.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 28231
  • Unit Price: $2.144
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.144 $2.14
10+ $1.748 $17.48
30+ $1.459 $43.77
250+ $1.222 $305.50
500+ $1.113 $556.50
1000+ $1.063 $1,063.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

MKE02Z16VLC4 Tech Specifications
NXP USA Inc. - MKE02Z16VLC4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MKE02Z16VLC4

Product Attribute Attribute Value
Manufacturer NXP Semiconductors
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Supplier Device Package 32-LQFP (7x7)
Speed 40MHz
Series Kinetis KE02
RAM Size 2K x 8
Program Memory Type FLASH
Program Memory Size 16KB (16K x 8)
Peripherals LVD, PWM, WDT
Package / Case 32-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Number of I/O 28
Mounting Type Surface Mount
EEPROM Size 256 x 8
Data Converters A/D 16x12b; D/A 2x6b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M0+
Connectivity I²C, SPI, UART/USART
Base Product Number MKE02Z16

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

MKE02Z16VLC4 Image
MKE02Z16VLC4 (1)

Manufacturer Part Number

MKE02Z16VLC4

Manufacturer

NXP Semiconductors

Introduction

Embedded microcontroller

Part of the Kinetis KE02 series

Product Features and Performance

ARM Cortex-M0+ 32-bit single-core processor

16KB program memory (FLASH)

2KB RAM

16x12-bit ADC, 2x6-bit DAC

28 I/O pins

Supports SPI, UART/USART connectivity

Operating temperature range: -40°C to 105°C

Supply voltage range: 2.7V to 5.5V

Internal oscillator

256x8-bit EEPROM

Peripherals: LVD, PWM, Watchdog Timer (WDT)

Product Advantages

Low-power, energy-efficient design

Flexible connectivity options

Broad operating temperature range

Comprehensive peripheral set

MKE02Z16VLC4 Image
MKE02Z16VLC4 (2)

Key Technical Parameters

Processor: ARM Cortex-M0+, 32-bit, 40MHz

Program Memory: 16KB FLASH

RAM: 2KB

ADC: 16x12-bit

DAC: 2x6-bit

I/O Pins: 28

Connectivity: SPI, UART/USART

Supply Voltage: 2.7V to 5.5V

Operating Temperature: -40°C to 105°C

Quality and Safety Features

RoHS3 compliant

32-LQFP (7x7) package

Surface mount

Compatibility

Compatible with various embedded systems and IoT applications

Application Areas

Industrial automation

Household appliances

Smart home devices

Wearable electronics

Medical devices

Product Lifecycle

Currently available

Replacements and upgrades may be available in the future

Key Reasons to Choose This Product

Energy-efficient and low-power design

Flexible connectivity options for various applications

Wide operating temperature range for diverse environments

Comprehensive peripheral set for enhanced functionality

Compact 32-LQFP package for space-constrained designs

RoHS3 compliance for environmental sustainability

Frequently Asked Questions(FAQ)

How does the MKE02Z16VLC4 compare to other ARM Cortex-M0+ microcontrollers in terms of power efficiency and I/O flexibility when used in battery-powered sensor nodes?
The MKE02Z16VLC4 operates across a supply voltage range of 2.7V to 5.5V, making it suitable for low-power applications such as remote sensing or edge monitoring devices where energy consumption is critical. With 28 programmable I/O pins in a compact 32-LQFP package, it offers sufficient interfacing capability for common sensors like temperature, pressure, or motion detectors. Its 40MHz core speed enables efficient data processing without requiring high clock frequencies, which helps reduce dynamic power. Compared to similar Cortex-M0+ parts with fewer peripherals or tighter voltage constraints, the KE02 series balances performance and power effectively for cost-sensitive embedded designs.
What are the key considerations when selecting an external crystal oscillator versus relying on the internal oscillator of the MKE02Z16VLC4 for timing-critical communication protocols?
The MKE02Z16VLC4 includes a built-in internal oscillator that provides basic timing functions but may lack long-term stability and accuracy needed for precise UART, SPI, or I2C communication over extended periods. For applications requiring tight baud rate tolerances—such as industrial serial links or real-time sensor networks—an external crystal may be preferable despite added PCB complexity and component count. However, using the internal oscillator reduces board space and cost, which can be advantageous in consumer or space-constrained devices where timing requirements are relaxed.
Can the MKE02Z16VLC4 drive multiple capacitive loads simultaneously through its GPIO pins without additional buffering?
The MKE02Z16VLC4’s GPIOs are designed to source or sink up to 8mA per pin under typical operating conditions (VDD = 3.3V), which is generally sufficient for standard logic-level loads. However, driving multiple capacitive loads—such as long traces, unshielded cables, or multiple LEDs in parallel—can exceed the total output current budget of the port and degrade signal integrity due to increased rise/fall times. In such cases, external buffer drivers or MOSFET switches should be considered to maintain reliable operation and prevent excessive loading on the MCU.
How does the memory architecture of the MKE02Z16VLC4 support real-time firmware execution, and what limitations exist for interrupt latency during flash access?
The MKE02Z16VLC4 features a 16KB flash memory organized as 16K x 8 bits, accessed via the ARM Cortex-M0+ bus matrix. While the CPU can execute from flash at full 40MHz speed, flash read operations introduce a one-cycle wait state under certain conditions due to pipeline stalls. This results in approximately 25ns of additional delay per instruction fetch compared to RAM execution. For time-sensitive ISRs, developers should minimize flash fetches by placing critical code in RAM or using compiler optimizations to reduce branching overhead.
What impact does temperature variation have on the ADC performance of the MKE02Z16VLC4, particularly in automotive or outdoor environments?
Operating over the full industrial range of -40°C to 105°C, the MKE02Z16VLC4 maintains specified ADC linearity and conversion accuracy within ±1 LSB for its 12-bit resolution channels. However, drift in reference voltage and comparator thresholds can increase effective noise and reduce ENOB (Effective Number of Bits) by 0.5–1 bit in extreme temperatures. Calibration routines or use of external precision references are recommended in applications demanding high measurement fidelity across wide ambient conditions.
Is it feasible to implement over-the-air (OTA) firmware updates on the MKE02Z16VLC4, and what hardware constraints must be addressed?
Due to its limited 16KB flash size and lack of dedicated security peripherals, implementing robust OTA functionality on the MKE02Z16VLC4 requires careful partitioning of the application code and bootloader space. A typical arrangement reserves ~2KB for a small bootloader capable of receiving encrypted firmware blocks and verifying checksums before copying new code to flash. Given the modest RAM size (2KB), dynamic allocation must be avoided during update sequences. This approach is viable only for non-complex devices with infrequent update cycles.
How do the PWM capabilities of the MKE02Z16VLC4 compare to those found in higher-end Kinetis families when controlling motor speed or LED dimming?
The MKE02Z16VLC4 includes basic PWM modules with 16-bit resolution and variable frequency support, adequate for simple LED fading or basic servo control. Unlike larger Kinetis variants (e.g., KE06 or KE18), it lacks advanced features such as complementary outputs, dead-time insertion, or fault protection—critical for H-bridge motor drives. For analog-like control of LEDs or resistive loads, the device performs well, but more sophisticated motor control tasks would require external circuitry or migration to a higher-performance MCU.
What precautions should be taken during programming and debugging of the MKE02Z16VLC4 to avoid accidental flash corruption or incorrect configuration?
To prevent unintended flash writes, ensure the SWD or PGC/PTA interface remains inactive during power-up unless actively programmed. The chip has a non-volatile option byte region that configures reset vectors and clock sources; modifying these incorrectly can trap the device in a reset loop. Always verify checksums post-programming and use debuggers with erase-protection features enabled. Additionally, avoid frequent mass erases during development, as this accelerates flash wear, though the 10k write endurance rating still supports many years of normal use.
Why might someone choose the MKE02Z16VLC4 over a lower-pin-count variant like the MKE02Z8VFG, and what trade-offs exist in terms of package size and peripheral availability?
The MKE02Z16VLC4 offers 32 pins compared to the MKE02Z8’s 16-pin TSSOP, enabling access to more I/Os and integrated peripherals such as dual DACs and sixteen ADCs. This makes it preferable for multi-sensor applications requiring analog input and output without external components. However, the larger 32-LQFP (7x7mm) package increases footprint and cost slightly. If only digital signals are needed and space is severely constrained, the smaller variant may suffice, but at the expense of reduced functionality.
How reliable is the watchdog timer (WDT) in the MKE02Z16VLC4 for system recovery, and what initialization steps are required?
The MKE02Z16VLC4 incorporates a windowed watchdog timer (WWDG) that enhances reliability by requiring regular servicing within a defined time window. Proper initialization involves configuring the pre-scaler and window values early in startup code before enabling WWDG. Failure to service the watchdog within the allowed interval triggers a system reset, helping recover from software hangs. Misconfiguration—such as setting the window too narrow—can cause false resets, so testing under realistic workloads is essential for robust implementation.
What factors influence the choice between using internal vs. external voltage regulators when powering the MKE02Z16VLC4 in production systems?
The MKE02Z16VLC4 accepts input voltages from 2.7V to 5.5V directly, allowing designers to bypass internal regulators if using stable 3.3V logic rails. This reduces power loss and simplifies thermal design. However, in systems with unregulated batteries or inductive loads, an external LDO or switching regulator ensures clean supply rails and protects against transients. Decoupling capacitors near VDD/VSS pins are mandatory regardless of regulator type to suppress high-frequency noise affecting ADC and clock performance.
How does the ESD protection level of the MKE02Z16VLC4 compare to industry standards, and what layout practices enhance robustness in field-deployed equipment?
The MKE02Z16VLC4 meets standard human-body model (HBM) ESD specifications exceeding ±2kV at pin level, which aligns with JEDEC guidelines for commercial electronics. To further protect against electrostatic discharge in harsh environments, implement proper grounding, guard rings around sensitive nets, and place TVS diodes at I/O ports exposed to external connectors. PCB stackup should include solid ground planes adjacent to signal layers to minimize parasitic inductance during transient events.
What role does the internal LVD (Low-Voltage Detection) feature play in safeguarding battery-operated devices using the MKE02Z16VLC4?
The LVD module monitors VDD and asserts an interrupt when voltage drops below a user-configurable threshold (typically adjustable in 0.1V increments around 2.7V). This allows firmware to gracefully shut down peripherals, save state to flash, and enter sleep mode before brownout occurs, preventing data corruption or erratic behavior. Threshold accuracy is within ±2%, making it suitable for detecting end-of-life battery conditions without needing external monitoring circuits.
Are there any known limitations in the I2C implementation of the MKE02Z16VLC4 that could affect interoperability with legacy sensors?
The MKE02Z16VLC4 supports standard-mode I2C (up to 100kHz) and fast-mode (up to 400kHz), but lacks true open-drain output buffers—requiring external pull-ups for proper bus signaling. Additionally, clock stretching support may be limited depending on firmware handling, potentially causing timeout issues with slow slave devices. Ensuring adequate pull-up resistor values (e.g., 4.7kΩ) and avoiding excessive bus capacitance are critical for reliable communication with older I2C peripherals.
How does the Moisture Sensitivity Level (MSL) of 3 for the MKE02Z16VLC4 affect storage and reflow soldering procedures in manufacturing?
Classified as MSL 3, the MKE02Z16VLC4 must be assembled within 168 hours after opening humidity-barrier packaging to avoid moisture-induced defects during reflow. Manufacturers should follow JEDEC J-STD-033 guidelines, baking parts if storage exceeded shelf life. Proper floor life tracking and controlled dry packing are necessary to prevent popcorning, especially given the lead-free solder profile typically used in modern assembly processes.
What are the implications of selecting the MKE02Z16VLC4 for a medical device application requiring long-term reliability and traceability?
While the MKE02Z16VLC4 complies with RoHS3 and is REACH unaffected, its industrial-grade qualification (-40°C to 105°C) may fall short of medical-grade requirements such as ISO 13485 certification. End-of-life projections and supply chain continuity should also be evaluated, as entry-level MCUs often have shorter product lifecycles. For safety-critical medical systems, consider migrating to automotive- or military-qualified alternatives even if performance margins appear sufficient initially.
How can developers optimize flash memory usage on the MKE02Z16VLC4 to accommodate larger datasets or complex algorithms?
With only 16KB of flash, memory optimization techniques such as code compression, lookup table minimization, and selective inclusion of libraries are essential. Using linker scripts to place frequently accessed variables in RAM and leveraging compiler flags for dead-code elimination significantly reduce footprint. For data-heavy applications, offload storage to external EEPROM or FRAM via SPI, reserving flash solely for executable code and configuration parameters.
What distinguishes the oscillator calibration mechanism in the MKE02Z16VLC4 from simpler 8-bit MCUs, and why is it important for timing accuracy?
Unlike basic oscillators that rely on factory-trimmed RC networks, the MKE02Z16VLC4 uses a digitally calibrated internal reference that can be adjusted via software based on external clock inputs or periodic timing checks. This improves frequency stability across temperature and aging, reducing timing drift in communication protocols. Automatic trimming during startup ensures consistent performance without user intervention, enhancing reliability in unattended deployments.

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MKE02Z16VLC4

Product Attribute MKE02Z16VLD4557 MKE02Z16VLD4 MKE02Z32VLC4 MKE02Z16VFM4
Part Number MKE02Z16VLD4557 MKE02Z16VLD4 MKE02Z32VLC4 MKE02Z16VFM4
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
EEPROM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Core Processor - - - -
Oscillator Type - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Connectivity - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Size - - - -
Series - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Peripherals - - - -
Speed - - - -
Program Memory Type - - - -
Number of I/O - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
RAM Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Program Memory Size - - - -
Data Converters - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

MKE02Z16VLC4 Datasheet PDF

Download MKE02Z16VLC4 pdf datasheets and NXP USA Inc. documentation for MKE02Z16VLC4 - NXP USA Inc..

PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
PCN Design/Specification
Leadframe 24/Aug/2016.pdf MKE02/MKE04/MKE06 22/May/2020.pdf
PCN Assembly/Origin
Mult Dev Site Chgs 18/Dec/2020.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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(Different time frame / countries / package size has different price.)

Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
MKE02Z16VLC4 Image

MKE02Z16VLC4

NXP USA Inc.
32D-MKE02Z16VLC4

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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