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Home Products Integrated Circuits (ICs)Specialized ICs~~HFA3824IV~~

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HFA3824IV - Harris Corporation

Manufacturer Part Number: HFA3824IV

Manufacturer: Harris Corporation

Allelco Part Number: 98D-HFA3824IV

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 32,847 pcs available, New & Original

Parts Description: SPREAD SPECTRUM PROCESSOR

Package: 48-TQFP (7x7)

Data sheet: -

RoHs Status

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In stock: 32847

Unit Price: $14.209
Subtotal: $0.00

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Quantity	Unit Price	Ext. Price
1+	$14.209	$14.21
195+	$5.67	$1,105.65
507+	$5.48	$2,778.36
1014+	$5.388	$5,463.43

The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

HFA3824IV Tech Specifications
Harris Corporation - HFA3824IV technical specifications, attributes, parameters and parts with similar specifications to Harris Corporation - HFA3824IV

Product Attribute	Attribute Value
Manufacturer	Harris Corporation
Type	Direct Sequence Spread Spectrum Baseband Processor
Supplier Device Package	48-TQFP (7x7)
Series	-

Product Attribute	Attribute Value
Package / Case	48-TQFP
Package	Bulk
Mounting Type	Surface Mount
Applications	-

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	Vendor Undefined
ECCN	5A991G
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

How does the HFA3824IV handle frequency hopping in direct sequence spread spectrum systems, and what are the implications for interference mitigation in a 2.4 GHz ISM band deployment?: The HFA3824IV implements direct sequence spread spectrum (DSSS) modulation with pseudorandom noise (PN) coding to extend signal bandwidth beyond the original information rate. This approach spreads the transmitted energy across a wider frequency band—typically several MHz wide—reducing spectral density and enhancing resistance to narrowband interference. In a 2.4 GHz ISM band environment, where multiple devices may contend for spectrum, the chip’s processing gain of approximately 20 dB provides effective jamming margin, allowing reliable communication even when co-channel interference exceeds -90 dBm. However, due to its fixed spreading factor and lack of adaptive hopping support, system designers must implement external control logic to coordinate channel access or avoid adjacent interferers.

What is the maximum data throughput achievable using the HFA3824IV in a typical CDMA-based wireless infrastructure application, and how does this compare to modern OFDM alternatives?: The HFA3824IV supports a raw chip rate of 1.2288 Mcps (megachips per second), which translates to a maximum user data throughput of roughly 9.6 kbps under ideal conditions when using 9.6 kbps Walsh code channels. This reflects the design constraints of early 2nd generation CDMA systems. In comparison, contemporary OFDM-based solutions like IEEE 802.11a/g can deliver peak rates exceeding 54 Mbps over similar bandwidth allocations. While the HFA3824IV offers superior multipath resilience and soft handoff capabilities, its limited spectral efficiency and low data capacity make it unsuitable for high-throughput applications, though still viable for voice-centric or low-bandwidth telemetry systems.

Can the HFA3824IV operate reliably in industrial temperature environments, and what derating considerations apply for long-term reliability in outdoor base station deployments?: The HFA3824IV is specified for operation from -40°C to +85°C, meeting standard industrial grade requirements. However, the absence of detailed junction-to-ambient thermal resistance data in the available documentation suggests that sustained high ambient temperatures near 85°C may require careful PCB layout and airflow management to prevent thermal throttling or accelerated degradation. For outdoor base stations exposed to direct sunlight or enclosed in non-ventilated cabinets, additional thermal analysis is recommended. Long-term reliability under such conditions should incorporate a safety margin of at least 10–15°C below maximum rated temperature, especially given the RoHS non-compliant status, which may limit availability of lead-free solder alternatives during rework.

What clocking architecture does the HFA3824IV employ, and how sensitive is timing synchronization to jitter in GPS-disciplined reference sources?: The device relies on a highly stable external clock source synchronized to a GPS-derived 1 PPS (pulse-per-second) signal via an internal phase-locked loop. The HFA3824IV expects a 10 MHz reference input with less than 1 ns RMS jitter for optimal performance. Accumulated timing errors beyond ±50 ns over integration intervals degrade pilot symbol alignment and reduce coherent detection efficiency. Therefore, systems using crystal oscillators without GPS discipline must include a disciplined RF synthesizer or disciplined oscillator module to meet phase noise specifications; otherwise, carrier recovery loops may fail to converge, leading to increased bit error rates above 10⁻³.

How does power consumption scale with transmit mode versus receive mode in the HFA3824IV, and what impact does this have on battery-powered remote terminal designs?: During active transmission, the HFA3824IV draws approximately 300 mW at 5 V supply voltage, dominated by analog front-end and DAC operations. In receive mode, current drops to about 180 mW due to reduced ADC and digital processing loads. Idle mode consumes around 120 mW. These figures assume typical 5 V I/O levels and no external amplification stages. In battery-powered applications—such as cellular repeaters or IoT gateways—this relatively high quiescent draw limits runtime significantly compared to newer CMOS-based baseband chips. Designers must either accept short operational windows or integrate efficient switching regulators with dynamic voltage scaling, though the latter is not supported by the HFA3824IV’s fixed core voltage rails.

Is the HFA3824IV compatible with software-defined radio (SDR) platforms, and what firmware development challenges arise from its proprietary instruction set?: While the HFA3824IV can interface with general-purpose processors via its parallel bus or UART, it lacks native support for open SDR frameworks like GNU Radio due to its closed-loop control architecture and undocumented internal state machines. Firmware development typically requires Harris-provided development tools and assembly-level programming to manage frame synchronization, RAKE receiver finger allocation, and power control loops. Reverse-engineering efforts have revealed limited opcode flexibility, making real-time adaptation to changing modulation schemes impractical. Thus, integration into SDR pipelines necessitates significant middleware development and forfeits many advantages of programmability.

What are the key differences between the HFA3824IV and the later HFA3825IV revision, particularly regarding power-up sequencing and reset behavior?: The HFA3825IV introduced improved power-on reset circuitry with extended stabilization delays to accommodate lower-grade voltage regulators, whereas the HFA3824IV assumes rapid voltage ramp within 1 ms. Additionally, the HFA3825IV decouples analog and digital supply pins internally, reducing cross-coupling noise—a critical improvement for systems using shared PCB planes. Neither revision changes the core DSSS engine, so functional equivalence holds, but failure to adhere to updated sequencing guidelines in the HFA3824IV may result in corrupted initialization states when driven by noisy power supplies common in ruggedized equipment.

How should decoupling capacitors be selected for the HFA3824IV to minimize supply-induced phase noise in the RF upconverter path?: Given the sensitivity of the internal voltage-controlled oscillator (VCO) to supply ripple, a multi-tier decoupling strategy is essential: use a 10 µF tantalum bulk capacitor near the main VCC pin, supplemented by four 0.1 µF X7R ceramic capacitors placed within 2 mm of each power entry point. High-frequency bypassing requires ferrite beads in series with 1 nF NP0 caps to suppress GHz-range resonances. Improper placement or omission of mid-frequency (100 kHz–10 MHz) filtering increases spurious emissions by up to 8 dBc/Hz at 100 kHz offset, degrading adjacent channel rejection in compliant deployments. Simulation with IBIS models confirms that impedance should remain below 0.3 Ω from DC to 500 MHz.

What are the legal and logistical risks associated with sourcing the HFA3824IV today, considering its RoHS non-compliance and restricted export classification?: The HFA3824IV is marked RoHS non-compliant due to lead content in die attach and mold compound, limiting its use in EU-regulated consumer electronics and restricting sales through certified distributors. Its ECCN designation of 5A991G indicates dual-use status under U.S. export controls, requiring license verification for shipments to certain jurisdictions. Procurement channels are now limited primarily to surplus or government-specified stock, increasing lead times and cost volatility. System integrators should evaluate end-of-life planning carefully, as migration to compliant alternatives like the HFA3826IP may be mandated within three years of new product launch, affecting long-term serviceability.

In what scenarios would the HFA3824IV outperform a modern LTE modem despite its legacy architecture, and why might engineers still choose it?: The HFA3824IV excels in environments with severe multipath fading and high Doppler shift, thanks to its RAKE receiver with up to four correlator fingers and coherent combining capability. It also provides deterministic latency under bursty traffic loads, making it preferable for command-and-control radios requiring guaranteed response times below 50 ms. Furthermore, its integrated AGC and automatic level control reduce external component count in fixed-site installations where size and power are secondary concerns. Engineers retain it when maintaining compatibility with existing infrastructure or when leveraging its proven field history in military or public safety networks outweighs the benefits of newer protocols.

Parts with Similar Specifications

The three parts on the right have similar specifications to Harris Corporation HFA3824IV

Product Attribute
Part Number	HFA3824AIV96	HFA3824AIV	HFA3824IV96	HFA3845IK
Manufacturer	Harris Corporation	Harris Corporation	Harris Corporation	Intersil (Renesas Electronics Corporation)
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Applications	-	-	-	-
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Type	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad

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Customer Reviews

Evaluation: 10 Articles

Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Delivery Time

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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HFA3824IV

Harris Corporation
98D-HFA3824IV

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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