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HomeProductsIntegrated Circuits (ICs)Interface - ControllersHFA3842IN
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HFA3842IN - Intersil

Manufacturer Part Number
HFA3842IN
Manufacturer
Intersil (Renesas Electronics Corporation)
Allelco Part Number
32D-HFA3842IN
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,446 pcs available, New & Original
Parts Description
LAN CONTROLLER
Package
128-LQFP (14x20)
Data sheet
-
RoHs Status
 
Our certification
In stock: 7446
  • Unit Price: $34.211
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $34.211 $34.21
10+ $34.211 $342.11
30+ $34.211 $1,026.33
200+ $13.24 $2,648.00
500+ $12.774 $6,387.00
1000+ $12.545 $12,545.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

HFA3842IN Tech Specifications
Intersil - HFA3842IN technical specifications, attributes, parameters and parts with similar specifications to Intersil - HFA3842IN

Product Attribute Attribute Value
Manufacturer Intersil (Renesas Electronics Corporation)
Voltage - Supply 2.7V ~ 3.6V
Supplier Device Package 128-LQFP (14x20)
Standards -
Series -
Protocol -
Product Attribute Attribute Value
Package / Case 128-LQFP
Package Bulk
Operating Temperature -40°C ~ 85°C
Interface MII
Function MAC Controller
Current - Supply 45mA

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Affected
ECCN 5A002A1
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

What is the typical power consumption of the HFA3842IN MAC controller when operating at full load, and how does this impact thermal design in compact PCB layouts?
At a supply voltage of 3.6V and typical operating conditions, the HFA3842IN draws approximately 45mA, resulting in a power dissipation of around 162mW (P = V × I). While this may seem modest, sustained operation near the upper end of the voltage range can elevate junction temperatures, especially in densely populated boards with limited airflow. Engineers must account for package thermal resistance and ensure adequate copper area or heat spreading to maintain junction temperatures below 85°C, particularly in environments approaching the maximum operating temperature.
How does the MII interface on the HFA3842IN support real-time network communication, and what are the implications for clocking and synchronization in a multi-device Ethernet subsystem?
The HFA3842IN implements the Media Independent Interface (MII) standard, which operates at a 25MHz reference clock for 10/100 Mbps data rates. This synchronous interface requires precise timing alignment between transmit and receive paths, demanding careful PCB layout with controlled trace lengths to minimize skew. In systems with multiple controllers, clock distribution becomes critical; any jitter or phase mismatch can lead to packet errors or dropped frames. Designers should avoid sharing clock lines without buffering and consider using dedicated oscillator sources to maintain signal integrity across the 128-LQFP package.
Can the HFA3842IN operate reliably in industrial environments with wide temperature fluctuations, and what design precautions are necessary to ensure long-term stability?
The HFA3842IN is rated for an industrial temperature range of -40°C to 85°C, making it suitable for harsh environments. However, thermal cycling between these extremes introduces mechanical stress on the 128-LQFP (14x20) package, potentially affecting solder joint reliability over time. To mitigate risk, engineers should use robust PCB materials with low CTE mismatch, apply underfill if rework is expected, and avoid rapid temperature transitions during testing. Additionally, decoupling capacitors placed close to the power pins help stabilize voltage rails under transient loads, preserving functionality across the full operational envelope.
What are the key differences between the HFA3842IN and other MAC controllers like the HFA3842BPI in terms of packaging and electrical characteristics?
The HFA3842IN uses a 128-pin LQFP (14x20) package, whereas the HFA3842BPI typically comes in a plastic dual in-line package (PDIP). This physical difference significantly impacts board integration—LQFP enables higher pin density and smaller form factors, but demands tighter manufacturing tolerances for soldering. Electrically, both parts share identical core specifications: 2.7–3.6V operation, 45mA supply current, and MII interface. However, the IN variant’s surface-mount configuration reduces parasitic inductance compared to through-hole alternatives, improving high-frequency performance despite similar datasheet parameters.
Why might a designer choose the HFA3842IN despite its RoHS non-compliance status, and what regulatory trade-offs must be considered in commercial applications?
The HFA3842IN contains lead in its termination or internal structure, making it non-compliant with current RoHS directives. This may preclude its use in consumer electronics sold in the EU or California. However, in industrial, military, or legacy embedded systems where regulatory flexibility exists—such as aerospace or telecom infrastructure—the part remains viable due to its proven MAC controller architecture and MII compliance. Projects targeting markets exempt from RoHS, such as those governed by MIL-STD or FCC Part 15, may justify inclusion. Documentation must clearly flag non-compliance to avoid supply chain disruptions during audits.
How does the moisture sensitivity level (MSL) rating of MSL 3 for the HFA3842IN affect handling procedures before and after reflow soldering?
With an MSL 3 classification and a floor life of 168 hours, the HFA3842IN must be stored under dry conditions (typically <10% RH) and used within seven days after baking or exposure. Once removed from sealed packaging, humidity ingress accelerates during reflow, risking delamination or popcorning. To prevent failure, manufacturers often bake parts at 125°C for 24 hours before assembly. Automated pick-and-place equipment should track open-bag time, and operators must follow JEDEC J-STD-033 guidelines. Skipping this step increases yield loss during wave or reflow processes, especially in high-volume production lines.
What role does the MAC controller function play in the overall LAN stack when integrating the HFA3842IN into a custom embedded system?
As a Media Access Control (MAC) layer device, the HFA3842IN handles framing, CRC generation/checking, and medium access arbitration for Ethernet packets. It offloads these tasks from the host microcontroller, freeing CPU cycles for application logic. When interfaced via MII, it communicates with PHY chips that manage physical signaling. Proper integration requires configuring registers for duplex mode, auto-negotiation, and interrupt thresholds. Misconfiguration—such as mismatched frame size limits—can cause buffer overflows or link instability. Thus, understanding both hardware handshake signals and software initialization sequences is essential for stable operation.
In a system requiring multiple Ethernet ports, how can the HFA3842IN be cascaded or shared, and what limitations arise from its single MII interface?
Due to its single MII interface, the HFA3842IN cannot directly support multiple concurrent Ethernet links without external switching or multiplexing. One approach is to pair it with a crossbar switch IC that arbitrates access between two PHYs based on traffic demand. Alternatively, designers may use separate MAC controllers per port, though this increases BOM cost and footprint. Another option involves implementing a time-division multiplexed scheme, but this introduces latency and complicates real-time guarantees. For most applications, adding a second HFA3842IN or selecting a multi-port MAC solution offers better scalability and deterministic behavior.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intersil HFA3842IN

Product Attribute HFA3842IN HFA3841CN HFA3841CN HFA3824IV
Part Number HFA3842IN HFA3841CN HFA3841CN HFA3824IV
Manufacturer Intersil Intersil Harris Corporation Harris Corporation
Current - Supply 45mA - 45mA -
Supplier Device Package 128-LQFP (14x20) - 128-LQFP (14x20) 48-TQFP (7x7)
Series - * - -
Package Bulk Bulk Bulk Bulk
Function MAC Controller - Controller -
Interface MII - MII -
Standards - - - -
Package / Case 128-LQFP - 128-LQFP 48-TQFP
Protocol - - PCI -
Operating Temperature -40°C ~ 85°C - 0°C ~ 70°C (TA) -
Voltage - Supply 2.7V ~ 3.6V - 2.7V ~ 3.6V -

Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Payment Support

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
HFA3842IN Image

HFA3842IN

Intersil
32D-HFA3842IN

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