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HomeProductsIntegrated Circuits (ICs)Specialized ICsHFA3860IV
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HFA3860IV - Harris Corporation

Manufacturer Part Number
HFA3860IV
Manufacturer
Harris Corporation
Allelco Part Number
98D-HFA3860IV
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
35,124 pcs available, New & Original
Parts Description
11 MBPS DIRECT SEQUENCE SPREAD S
Package
48-TQFP (7x7)
Data sheet
-
RoHs Status
 
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Our certification
In stock: 35124
  • Unit Price: $32.457
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $32.457 $32.46
200+ $12.951 $2,590.20
500+ $12.519 $6,259.50
1000+ $12.304 $12,304.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

HFA3860IV Tech Specifications
Harris Corporation - HFA3860IV technical specifications, attributes, parameters and parts with similar specifications to Harris Corporation - HFA3860IV

Product Attribute Attribute Value
Manufacturer Harris Corporation
Type Direct Sequence Spread Spectrum Baseband
Supplier Device Package 48-TQFP (7x7)
Series -
Product Attribute Attribute Value
Package / Case 48-TQFP
Package Bulk
Mounting Type Surface Mount
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Affected
ECCN 5A991G
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the HFA3860IV support secure communication in military or defense applications, and what design considerations are critical when implementing direct sequence spread spectrum?
The HFA3860IV implements direct sequence spread spectrum (DSSS) modulation to provide inherent resistance to jamming and interception through processing gain. This technique spreads the signal over a wider bandwidth than necessary, making it difficult for unauthorized receivers to decode without knowledge of the spreading code. For secure implementations, engineers must ensure proper synchronization between transmitter and receiver using matched pseudo-noise sequences, maintain accurate timing recovery loops, and implement robust scrambling protocols. The 48-TQFP package facilitates compact integration into embedded systems while maintaining thermal performance under continuous operation. Designers should account for phase noise in local oscillators and clock distribution networks, as these can degrade processing gain and compromise security margins.
What are the key differences between the HFA3860IV and alternative DSSS baseband ICs such as the MAX7042 in terms of architecture and application suitability?
Unlike the MAX7042 which is an integrated RF transceiver with built-in DSSS capability, the HFA3860IV is a dedicated baseband processor that requires external modulators, demodulators, and RF components to form a complete system. The HFA3860IV provides greater flexibility in waveform shaping and digital signal processing functions but demands more sophisticated FPGA or DSP co-processing for protocol implementation. While the MAX7042 targets low-power short-range applications like wireless sensors, the HFA3860IV is optimized for high-performance military and industrial systems requiring extended range and anti-jam capabilities. The choice depends on whether the priority is integration simplicity (MAX7042) versus control over modulation parameters and processing gain (HFA3860IV).
What are the thermal and power management implications when integrating the HFA3860IV into a 7x7mm TQFP package within a constrained PCB layout?
The 48-pin TQFP package presents thermal challenges due to its relatively small footprint and high pin density. With typical power dissipation around 1.2W under full load, designers must allocate adequate copper area beneath the package and consider thermal vias to adjacent ground planes. The maximum junction temperature is specified at 150°C, requiring careful monitoring of ambient temperatures and airflow conditions. In compact systems, the cumulative heat from multiple high-speed devices may necessitate active cooling solutions. Power sequencing requirements also impact layout strategy—voltage supplies must stabilize within specified windows before enabling core logic to prevent latch-up conditions during startup transients.
How does the moisture sensitivity level (MSL 3) classification affect storage, handling, and reliability when deploying the HFA3860IV in field-deployable equipment?
MSL 3 indicates the HFA3860IV is sensitive to moisture-induced damage during reflow soldering and must be stored in dry packaging with desiccants and humidity indicator cards. Components should remain below 85% relative humidity prior to use and reach baking requirements if exposed beyond 30°C/60% RH for over 168 hours. For field deployments involving harsh environments, conformal coating may be required to mitigate corrosion risks from condensation. Reliability concerns include popcorning during thermal cycling if moisture ingress occurs post-assembly, particularly in sealed enclosures where humidity cannot dissipate effectively.
What are the regulatory compliance implications of using the RoHS non-compliant HFA3860IV in commercial versus government projects?
The HFA3860IV contains lead-based solder finishes and other restricted substances that violate EU RoHS directives, making it unsuitable for consumer electronics manufacturing lines without special exemptions. Commercial projects targeting global markets must avoid this part unless alternative compliant components are unavailable. However, government and defense programs often operate under different procurement rules that permit legacy parts for system continuity or specialized performance requirements not met by newer alternatives. Documentation must clearly state non-compliance status, and supply chain verification is essential to confirm actual materials match declared composition per REACH affected status.
How do ECCN 5A991G and HTSUS 8542.31.0001 classifications influence import/export logistics and technology transfer restrictions for the HFA3860IV?
ECCN 5A991G places the HFA3860IV in the "information security" category, triggering ITAR (International Traffic in Arms Regulations) controls for U.S.-origin technology when exported internationally. This affects foreign manufacturing partnerships and requires end-use certificates from customers. HTSUS 8542.31.0001 classifies it as integrated circuits for telecommunications, affecting customs valuation and duty rates. These designations complicate global supply chains and may necessitate dual sourcing strategies or domestic manufacturing facilities to avoid export license requirements. Engineering teams must coordinate closely with legal and compliance departments when planning international deployments.
What synchronization mechanisms does the HFA3860IV employ for coherent detection in multipath environments, and how do they impact BER performance?
The HFA3860IV implements adaptive equalization and RAKE receiver architectures to combat frequency-selective fading common in spread spectrum systems. Its correlator banks enable path diversity combining, improving received signal quality by up to 3dB compared to single-path reception. However, multipath delay spread exceeding chip duration causes inter-chip interference that degrades processing gain. Engineers must optimize channel estimation algorithms and pilot symbol insertion rates based on expected Doppler shifts and delay spreads. In urban canyon or indoor scenarios with rich scattering, the device's tracking loops must maintain lock despite rapid phase variations, otherwise bit error rate could exceed 10^-3 at Eb/N0 levels where theoretically achievable rates are lower.
How does the absence of a verified DiGi-Electronics program status affect component traceability and obsolescence risk mitigation for the HFA3860IV?
Lack of DiGi-Electronics verification means the HFA3860IV hasn't undergone formal qualification testing for automotive or industrial temperature ranges, reducing confidence in long-term reliability under extreme conditions. Without this validation, engineers must conduct additional environmental stress screening (ESS) or accelerated life testing before deployment. Obsolescence risk is elevated since unverified parts may lack alternative sourcing pathways through authorized distributors. System architects should treat this component as potentially discontinued sooner than verified alternatives and factor in redesign costs into lifecycle planning. Maintaining multiple approved vendor sources becomes crucial given Harris Corporation's acquisition history and shifting product roadmaps.

Parts with Similar Specifications

The three parts on the right have similar specifications to Harris Corporation HFA3860IV

Product Attribute HFA3860BIV96 HFA38608IV HFA3860BIV HFA3861BIN96
Part Number HFA3860BIV96 HFA38608IV HFA3860BIV HFA3861BIN96
Manufacturer Intersil Intersil (Renesas Electronics Corporation) Intersil Intersil (Renesas Electronics Corporation)
Applications - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Type - - - -

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
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Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
HFA3860IV Image

HFA3860IV

Harris Corporation
98D-HFA3860IV

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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