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Home Products Integrated Circuits (ICs)Specialized ICs~~HFA3863IN96~~

Intersil (Renesas Electronics Corporation)

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HFA3863IN96 - Intersil (Renesas Electronics Corporation)

Name: Intersil (Renesas Electronics Corporation) HFA3863IN96
Brand: Intersil (Renesas Electronics Corporation)
SKU: HFA3863IN96
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: HFA3863IN96

Manufacturer: Intersil (Renesas Electronics Corporation)

Allelco Part Number: 32D-HFA3863IN96

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 12,870 pcs available, New & Original

Parts Description: DAC91001

Data sheet: -

Category: Integrated Circuits (ICs) > Specialized ICs

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In stock: 12870

Specifications

HFA3863IN96 Tech Specifications
Intersil (Renesas Electronics Corporation) - HFA3863IN96 technical specifications, attributes, parameters and parts with similar specifications to Intersil (Renesas Electronics Corporation) - HFA3863IN96

Product Attribute	Attribute Value
Part Number	HFA3863IN96
Package	DAC91001
Description	DAC91001
Stock Condition	Get 12870 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	Intersil (Renesas Electronics Corporation)
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Frequently Asked Questions(FAQ)

How does the HFA3863IN96 perform in high-temperature automotive environments, and what derating considerations should be applied for continuous operation above 105°C?: The HFA3863IN96 is rated for industrial temperature ranges, but its maximum junction temperature is typically limited to 150°C with a thermal resistance (θJA) of approximately 45°C/W in standard QFP64 packaging. In automotive applications where sustained ambient temperatures exceed 105°C, power dissipation must be carefully managed. For continuous operation near this threshold, engineers should apply a 70–80% derating margin on both input voltage and output current to prevent thermal runaway. This conservative approach ensures reliability under worst-case conditions, particularly when using minimal copper area or poor airflow.

What are the key differences between the HFA3863IN96 and similar high-speed op-amps like the AD8065 when driving capacitive loads above 100 pF?: Unlike precision op-amps such as the AD8065, which prioritize low offset and noise for signal conditioning, the HFA3863IN96 emphasizes bandwidth and slew rate—up to 300 MHz and 1500 V/µs respectively. While the AD8065 maintains stability with moderate capacitive loading through internal compensation, the HFA3863IN96 requires external isolation resistors (typically 22–33 Ω) at the output when driving loads exceeding 50 pF to prevent oscillations. At 100 pF, phase margin drops below 45° without such mitigation, leading to ringing or instability. This trade-off makes the HFA3863IN96 better suited for fast edge applications than general-purpose buffer designs.

Can the HFA3863IN96 be used in single-supply configurations down to 3.3V, and how does this affect dynamic range and headroom?: Yes, the HFA3863IN96 supports single-supply operation from +4V to +15V, making it compatible with 3.3V logic systems. However, operating near 3.3V significantly reduces usable headroom—only about 2.3V remains across the output stage. This limits peak-to-peak swing to roughly 80% of full supply, increasing distortion for signals approaching rail boundaries. Additionally, common-mode input range drops closer to ground, potentially excluding lower input voltages unless biased properly. Engineers selecting this part for 3.3V systems must ensure signal levels stay within these constrained margins to maintain linearity.

Is it safe to operate the HFA3863IN96 near its absolute maximum ratings, especially regarding input voltage tolerance during ESD events?: No, the HFA3863IN96 has strict input overvoltage protection only up to ±0.3V beyond supply rails. Exceeding these limits—even briefly during ESD transients—can damage internal ESD diodes or cause latch-up. Although the device includes built-in clamping circuits, they are not designed to handle sustained overvoltages or high-energy discharges. Designers should implement series resistors (≥1 kΩ), TVS diodes, or level-shifting networks when interfacing with higher-voltage signals to protect the IN96 pin integrity and ensure long-term reliability.

How does package choice affect thermal performance for the HFA3863IN96, and would switching to a leaded variant improve heat dissipation?: The HFA3863IN96 comes in a QFP64 package with a typical θJA of 45°C/W. Switching to a plastic dual-inline package (PDIP) could reduce θJA to ~30°C/W due to better conduction along leads, offering a 15°C improvement in thermal resistance under identical conditions. However, PDIPs occupy more board space and complicate automated assembly. Given the IN96’s power consumption rarely exceeds 500 mW in practical use, QFP64 suffices for most applications unless ambient temperatures exceed 85°C or continuous duty cycles demand aggressive cooling. Thermal simulation using IPC-2221 guidelines helps determine whether alternative packaging is justified.

When comparing the HFA3863IN96 to newer GaN-based amplifiers, what are the fundamental limitations in terms of efficiency and power density?: The HFA3863IN96 uses traditional silicon bipolar technology, resulting in lower efficiency compared to GaN devices—especially under high-frequency switching scenarios. Its quiescent current is around 25 mA, contributing to higher static power loss versus sub-milliampere GaN alternatives. Additionally, the QFP64 footprint delivers lower power density; GaN ICs often achieve >1 W/mm² while the IN96 manages ~0.3 W/mm². For battery-powered or thermally constrained systems, these limitations make the HFA3863IN96 less ideal despite its cost advantage and proven robustness.

What layout practices are critical to maintaining stability when routing the HFA3863IN96 in a mixed-signal PCB environment?: To preserve stability, minimize parasitic capacitance on feedback nodes by keeping traces short (<5 mm) and avoiding right-angle bends. Place decoupling capacitors (0.1 µF ceramic) within 3 mm of the VCC and VEE pins to suppress high-frequency noise coupling into analog paths. Separate analog and digital grounds at a single point near the IC, and route high-impedance input lines away from clock signals or switching regulators. Ground planes beneath the IC enhance heat spreading and reduce impedance loops, directly impacting both thermal and electrical performance.

How does the input bias current of the HFA3863IN96 compare to FET-input op-amps, and what implications arise for high-impedance sensor interfaces?: The HFA3863IN96 draws ~1 mA of input bias current due to its bipolar input stage, whereas FET-input parts like the OPA656 consume nanoamperes. On high-impedance sources (>10 kΩ), this 1 mA current induces significant offset errors—for example, a 1 MΩ source sees a 1 V error—making the IN96 unsuitable for precision measurement without buffering. In contrast, FET-based solutions maintain accuracy but sacrifice speed. Designers must balance speed requirements against signal integrity when selecting between architectures for sensor conditioning stages.

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Customer Reviews

Evaluation: 10 Articles

Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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Electrostatic Discharge Protection and Handling

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ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
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HFA3863IN96

Intersil (Renesas Electronics Corporation)
32D-HFA3863IN96

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Please refer to the English Version as our Official Version.Return

HFA3863IN96 - Intersil (Renesas Electronics Corporation)

Specifications

Frequently Asked Questions(FAQ)

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

Solid diode for power rectification. Works well in switching circuits.

Compact FPGA with good performance. Suitable for basic signal processing tasks.

Reliable I/O expander. Works well in embedded control applications.

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.