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HomeProductsIntegrated Circuits (ICs)Specialized ICsHFA3860BIV96
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HFA3860BIV96 - Intersil

Manufacturer Part Number
HFA3860BIV96
Manufacturer
Intersil (Renesas Electronics Corporation)
Allelco Part Number
32D-HFA3860BIV96
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
2,507 pcs available, New & Original
Parts Description
BASEBAND CIRCUIT, PQFP48
Package
48-TQFP (7x7)
Data sheet
-
RoHs Status
 
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Our certification
In stock: 2507
  • Unit Price: $12.268
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $12.268 $12.27
200+ $4.748 $949.60
500+ $4.581 $2,290.50
1000+ $4.499 $4,499.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

HFA3860BIV96 Tech Specifications
Intersil - HFA3860BIV96 technical specifications, attributes, parameters and parts with similar specifications to Intersil - HFA3860BIV96

Product Attribute Attribute Value
Manufacturer Intersil (Renesas Electronics Corporation)
Type Direct Sequence Spread Spectrum Baseband Processor
Supplier Device Package 48-TQFP (7x7)
Series -
Product Attribute Attribute Value
Package / Case 48-TQFP
Package Bulk
Mounting Type Surface Mount
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Affected
ECCN 5A991G
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

How does the HFA3860BIV96 support interference mitigation in dense RF environments, and what design considerations are critical for its implementation?
The HFA3860BIV96 employs direct sequence spread spectrum (DSSS) modulation to spread the signal across a wider bandwidth, reducing susceptibility to narrowband interference. This technique effectively lowers peak power spectral density, making the signal less vulnerable to jamming or co-channel interference. For successful deployment, engineers must ensure precise timing synchronization between transmitter and receiver, proper channel coding integration, and careful PCB layout to maintain signal integrity. Additionally, system-level filtering and antenna isolation become crucial due to the wide bandwidth characteristics of spread spectrum signals.
What are the key differences between the HFA3860BIV96 and alternative DSSS baseband processors regarding clock recovery and data throughput performance?
Compared to similar DSSS baseband processors like the MAX7042 or CC1110 from Texas Instruments, the HFA3860BIV96 offers integrated baseband processing functions including matched filtering and despreading, whereas many alternatives require external microcontrollers for such tasks. The HFA3860BIV96 typically achieves higher raw data rates up to 500 kbps in optimized configurations, but demands stricter phase noise specifications on reference clocks due to its coherent demodulation architecture. This trade-off favors applications requiring integrated signal processing rather than modular radio architectures.
What thermal management strategies should be implemented when integrating the HFA3860BIV96 into high-density industrial control systems?
Given the HFA3860BIV96's operation at typical junction temperatures up to 125°C and power dissipation around 1.8W under full load, adequate thermal relief is essential. Engineers should implement solid ground planes beneath the 48-TQFP package, consider thermal vias to internal layers, and maintain minimum 1.5mm clearance from adjacent heat-generating components. In compact designs, forced airflow or heat sinking may be necessary, especially when operating near ambient temperatures above 50°C. Proper decoupling capacitance placement also helps reduce switching transients that could indirectly affect thermal stability.
How does the HFA3860BIV96's spread spectrum implementation impact FCC/IC regulatory compliance compared to narrowband solutions?
The HFA3860BIV96 inherently supports FCC Part 15 and Industry Canada RSS-210 requirements for intentional radiators by spreading energy across multiple MHz of bandwidth. This reduces conducted emissions below Class B limits without additional filtering. However, precise control of hopping rate, chip code selection, and output power level becomes critical—misconfiguration can lead to non-compliance. Unlike fixed-frequency transmitters, DSSS systems require rigorous testing of all possible modulation states during certification.
What interface protocol options does the HFA3860BIV96 support, and how do they affect system-level integration complexity?
The HFA3860BIV96 features parallel digital I/O for baseband data transfer and serial interfaces including SPI and UART for configuration and status monitoring. This dual-interface approach allows flexible integration with both DSP-based platforms and microcontroller architectures. Engineers must account for propagation delays through the parallel bus when synchronizing symbol boundaries, while SPI provides deterministic register access for calibration parameters. Careful attention to signal termination and clock domain crossing is necessary to prevent data corruption during mode transitions.
Can the HFA3860BIV96 be used in battery-powered applications, and what operational modes optimize power consumption?
While the HFA3860BIV96 doesn't feature ultra-low-power sleep states comparable to modern SoC radios, it does offer reduced-current standby modes when configured via its serial interface. During active transmission, current draw typically ranges from 40mA at 3V supply to 70mA at 5V depending on output power setting. For battery-operated devices, duty cycling and minimizing transmit duration significantly extends runtime. External voltage regulators should maintain tight ±5% regulation to preserve modulation accuracy and prevent spurious emissions.
What are the implications of the HFA3860BIV96's RoHS non-compliance status for commercial product development?
The RoHS non-compliant designation means the HFA3860BIV96 contains restricted substances such as lead in solder balls or certain metal finishes that exceed EU Directive thresholds. This restricts use in products destined for European markets unless special exemptions apply (e.g., medical equipment). Manufacturers seeking global distribution must either source compliant variants (if available), redesign PCBs with lead-free processes compatible with this part, or obtain formal exemption documentation. REACH compliance remains satisfied through standard registration procedures.
How does the moisture sensitivity level (MSL 3) classification affect storage and handling of HFA3860BIV96 components?
With an MSL rating of 3, the HFA3860BIV96 requires protection from ambient humidity until soldering. Components must be stored in dry cabinets with desiccant and humidity indicators showing <10% RH. Before assembly, baking may be required if exposed to ambient conditions beyond 30°C/60% RH for more than 168 hours. After opening packaging, use within 168 hours or reseal in moisture barrier bags. Failure to follow these guidelines risks popcorning during reflow, leading to delamination and catastrophic failure.
What are the recommended bypass capacitor values and placement guidelines for stable operation of the HFA3860BIV96?
Each power pin on the HFA3860BIV96 requires dedicated 0.1µF ceramic capacitors placed within 3mm of the package leads. Additional bulk capacitance of 10µF tantalum or X7R ceramic near the power entry point helps suppress low-frequency ripple. Capacitor selection must consider ESR; too high an ESR defeats high-frequency decoupling effectiveness. Avoid aluminum electrolytics near analog sections due to leakage currents. Ground plane continuity under the device ensures return path integrity for high-speed signals.
How does the 48-TQFP (7x7mm) package influence high-frequency signal routing and electromagnetic compatibility?
The small form factor of the 48-TQFP package concentrates high-speed traces in limited area, increasing crosstalk risk between adjacent pins. Differential pairs like IQ paths must be routed with matched lengths (<50mil tolerance) and controlled impedance (typically 100Ω differential). Keep sensitive analog traces away from digital control lines to prevent coupling. Via stubs should be minimized to avoid resonance effects above 1GHz. Thermal pad connection to inner ground planes aids heat dissipation while maintaining signal integrity.
What diagnostic features does the HFA3860BIV96 provide for field troubleshooting and production test?
The device includes built-in self-test routines accessible via serial commands, allowing verification of internal oscillators, memory integrity, and ADC/DAC functionality. Loopback modes facilitate PHY-layer testing without external hardware. Status registers report lock indicators for carrier detection, symbol synchronization, and FIFO overflow conditions. These features simplify factory programming and reduce reliance on expensive test fixtures, though full characterization still requires calibrated RF test equipment.
How does the choice of spreading code length affect link budget and range performance in HFA3860BIV96-based systems?
Longer spreading codes (e.g., 64-bit vs 32-bit) improve processing gain—approximately 6dB per doubling of code length—which enhances receiver sensitivity by reducing required Eb/N0. However, longer codes increase latency and reduce maximum data rate proportionally. For fixed-rate links, this trade-off favors longer codes in noisy environments; conversely, short codes suit latency-sensitive applications despite lower robustness. Optimal code selection depends on target SNR margin and acceptable packet error rate.
What precautions are necessary when replacing the HFA3860BIV96 with newer alternatives in existing designs?
Direct replacement may fail due to differences in pinout, voltage thresholds, clock requirements, or protocol implementations. Critical checks include verifying supply sequencing, reference oscillator frequency tolerance (±20ppm vs ±50ppm), and digital interface timing margins. Newer parts often integrate RF front-end functions, eliminating need for external PA/LNA stages present in legacy designs using HFA3860BIV96. Migration requires full regression testing of modulation accuracy, emission masks, and interoperability with existing network nodes.
How does temperature drift impact the HFA3860BIV96’s carrier frequency stability, and what compensation methods are effective?
The internal VCO exhibits typical frequency drift of ±25kHz over -40°C to +85°C span, necessitating closed-loop AFC circuitry for long-term stability. Digital compensation algorithms embedded in firmware can track drift by periodically measuring received signal strength and adjusting local oscillator offset. Alternatively, oven-controlled crystal oscillators (OCXOs) provide superior stability (<±0.5ppm) but increase cost and power. Hybrid approaches using TCVCXO with software correction balance performance and complexity.
What are the limitations of using the HFA3860BIV96 in license-exempt ISM bands above 2.4GHz?
Although capable of operation up to 2.5GHz, the HFA3860BIV96 lacks native support for IEEE 802.15.4 or Bluetooth protocols dominant in 2.4GHz applications. Its fixed modulation scheme (DBPSK/DQPSK) limits compatibility with adaptive frequency hopping required by FCC rules for 2.4–2.4835GHz operation. Additionally, antenna matching networks designed for 2.4GHz exhibit poor efficiency at lower frequencies where the chip performs best. System designers must weigh these constraints against application-specific requirements.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intersil HFA3860BIV96

Product Attribute HFA3860BIV HFA3861BIN96 HFA38608IV HFA3860IV
Part Number HFA3860BIV HFA3861BIN96 HFA38608IV HFA3860IV
Manufacturer Intersil Intersil (Renesas Electronics Corporation) Intersil (Renesas Electronics Corporation) Harris Corporation
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Applications - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount

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Customer Reviews

Evaluation: 10 Articles

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
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Electrostatic Discharge Protection and Handling

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HFA3860BIV96 Image

HFA3860BIV96

Intersil
32D-HFA3860BIV96

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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