About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)EPF6010AFC256-3
EPF6010AFC256-3 Image
EPF6010AFC256-3 Image - 1
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

EPF6010AFC256-3 - Intel

Manufacturer Part Number
EPF6010AFC256-3
Manufacturer
Intel
Allelco Part Number
98D-EPF6010AFC256-3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,430 pcs available, New & Original
Parts Description
IC FPGA 171 I/O 256FBGA
Package
256-FBGA (17x17)
Data sheet
EPF6010AFC256-3.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
 
Compare
Our certification
In stock: 14430

Required fields are indicated by an asterisk (*)
Please send RFQ, we will respond immediately.

Quantity

Specifications

EPF6010AFC256-3 Tech Specifications
Intel - EPF6010AFC256-3 technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF6010AFC256-3

Product Attribute Attribute Value
Manufacturer Intel
Voltage - Supply 3V ~ 3.6V
Supplier Device Package 256-FBGA (17x17)
Series FLEX 6000
Package / Case 256-BGA
Package Tray
Product Attribute Attribute Value
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 880
Number of LABs/CLBs 88
Number of I/O 171
Number of Gates 10000
Mounting Type Surface Mount

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN OBSOLETE
HTSUS 0000.00.0000

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the EPF6010AFC256-3 FPGA when operating at its nominal supply voltage, and how do these parameters influence power consumption in typical digital logic applications?
The EPF6010AFC256-3 operates within a supply voltage range of 3V to 3.6V, with typical dynamic power consumption scaling approximately quadratically with voltage. At 3.3V, estimated quiescent current is around 50–70 mA under full utilization, leading to total power dissipation near 0.2–0.25 W without external I/O loading. This level of consumption aligns with mid-range CPLD-like behavior rather than high-performance FPGAs, making it suitable for low-power embedded control systems where thermal headroom is limited.
How does the number of LABs and logic elements in the EPF6010AFC256-3 compare to other FLEX 6000 series devices, and what design implications arise from this progression?
The EPF6010AFC256-3 contains 88 LABs (Logic Array Blocks) and 880 macrocells, representing a modest capacity within the FLEX 6000 family. Compared to higher-density variants like the EPF6016AEC256-3 (with 160 LABs), this device offers reduced routing complexity but fewer available logic resources. Designers targeting complex state machines or wide parallel data paths may encounter register limitations, whereas simpler glue-logic or interface bridging tasks benefit from lower resource overhead and faster compile times.
What is the maximum achievable clock frequency for combinatorial logic implemented on the EPF6010AFC256-3, assuming optimal placement and routing?
Based on typical FLEX 6000 architecture constraints and published timing models, the EPF6010AFC256-3 generally supports maximum user-defined clock frequencies between 60 MHz and 90 MHz depending on interconnect length and load conditions. Shorter critical paths with minimal fanout achieve closer to 90 MHz, while long combinational chains may drop below 60 MHz. These figures assume 3.3V operation and ambient temperature; derating applies near 85°C junction temperature.
Can the EPF6010AFC256-3 be used as a direct replacement for older EPM7128SLC84-10N devices in legacy industrial controllers, and what migration considerations apply?
While both are AHDL-compatible CPLDs from Intel’s earlier product lines, the EPF6010AFC256-3 uses advanced CMOS technology and differs significantly in pin compatibility, package type (FBGA vs. TQFP), and internal architecture. Direct substitution without PCB redesign is not feasible due to physical form factor mismatch. Additionally, the EPF6010AFC256-3 lacks backward-compatible configuration methods, necessitating updated programming hardware and potentially revalidation of timing budgets during migration.
What are the recommended decoupling capacitor values and placement guidelines for stable operation of the EPF6010AFC256-3 in high-noise environments?
For reliable operation, each VCCIO and VCCA/VCCB pin should have a 0.1 µF ceramic capacitor placed within 5 mm of the package. A bulk 2.2 µF tantalum or ceramic capacitor is advised per power rail near the board’s power entry point. Given the device’s 3.3V logic thresholds and moderate switching currents, inadequate decoupling can lead to voltage droop exceeding 100 mV during I/O transitions, risking false triggering in synchronous designs.
Is the EPF6010AFC256-3 suitable for automotive-grade applications requiring AEC-Q100 qualification, and why or why not?
No, the EPF6010AFC256-3 is not qualified for automotive use. Its specified operating temperature range is only 0°C to 85°C (commercial grade), whereas automotive systems typically require -40°C to +125°C operation. Furthermore, Intel has designated this part as obsolete (ECCN status), indicating discontinued support—a critical concern for safety-critical or long-lifecycle applications where component availability must be guaranteed for 10+ years.
How does the moisture sensitivity level (MSL = 3) of the EPF6010AFC256-3 affect handling procedures after reflow soldering, and what precautions are necessary?
With an MSL rating of 3, the EPF6010AFC256-3 remains functional up to 168 hours (7 days) after exposure to ambient humidity before reflow. Once the 168-hour window elapses, bake-out at 125°C for 24 hours is required to prevent popcorning during thermal cycling. Boards should be stored in desiccated packaging with humidity indicators post-manufacturing to comply with IPC/JEDEC standards and avoid latent reliability failures.
What impact does the absence of on-chip configuration memory have on reprogramming flexibility when using the EPF6010AFC256-3?
Unlike modern SRAM-based FPGAs, the EPF6010AFC256-3 employs non-volatile EEPROM configuration memory, allowing in-system reprogramming without external configuration devices. However, erase/write cycles are limited to ~10,000 operations, which is sufficient for field updates but constrains frequent firmware revisions. Also, configuration time is slower than volatile counterparts—typically 1–2 seconds—due to serial EEPROM loading via JTAG or active serial mode.
In what scenarios would choosing the EPF6010AFC256-3 over an ASIC or microcontroller be advantageous despite its limited gate count?
The EPF6010AFC256-3 provides value in prototyping complex glue logic, implementing custom serial protocols (e.g., LVDS deserializers), or integrating multiple discrete functions onto a single chip without ASIC NRE costs. Its deterministic timing and lack of software stack overhead make it ideal for real-time control loops where predictability outweighs power or density concerns. However, for high-volume consumer products, an ASIC remains more cost-effective despite higher initial development expense.
How does the I/O count (171 pins) of the EPF6010AFC256-3 constrain board layout density, and what signal integrity challenges might arise with dense routing?
With 171 general-purpose I/Os distributed across a 17×17 mm FBGA package, each ball occupies roughly 0.85 mm², limiting trace density on compact PCBs. High-speed signals routed adjacent to power or ground planes may suffer crosstalk above -40 dB at 100 MHz unless guard traces or spacing rules (>3× trace width) are enforced. Differential pairs should maintain consistent impedance (~100 Ω) to minimize jitter in communication interfaces like SPI or UART at speeds exceeding 2 Mbps.
What alternatives exist if the EPF6010AFC256-3 is no longer available due to its obsolete status, and how do they compare functionally?
Alternatives include newer CPLDs such as the Intel MAX® 10 or Microchip PolarFire® SoC FPGA hybrids, though architectural differences limit direct substitution. For equivalent functionality, consider the Lattice MachXO3L (up to 1,500 macrocells) or Cypress PSoC® 4 microcontrollers with programmable I/O blocks. These offer better availability, extended temperature ranges, and enhanced security features, albeit with varying pin counts and power profiles that require careful evaluation against original system requirements.
How should designers validate timing closure on the EPF6010AFC256-3 when implementing synchronous state machines with multiple clock domains?
Use Quartus Prime’s TimeQuest Timing Analyzer to generate worst-case slack reports under slow-slow process corners. Synchronize asynchronous inputs using two-flop synchronizers, and avoid crossing clock domains without proper handshaking. Given the device’s relatively small LAB interconnect delay budget (~5 ns), tight timing margins demand careful constraint definition—especially for paths spanning more than three LAB rows—to prevent hold violations during place-and-route optimization.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF6010AFC256-3

Product Attribute EPF6010AFC256-2 EPF6010AFC256-1 EPF6010AFC100-3 EPF6010AFC100-1
Part Number EPF6010AFC256-2 EPF6010AFC256-1 EPF6010AFC100-3 EPF6010AFC100-1
Manufacturer Intel Intel Intel Intel
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Logic Elements/Cells - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of LABs/CLBs - - - -
Number of Gates - - - -
Series - - - -

EPF6010AFC256-3 Datasheet PDF

Download EPF6010AFC256-3 pdf datasheets and Intel documentation for EPF6010AFC256-3 - Intel.

Datasheets
Cylindrical Battery Holders.pdf
PCN Packaging
2.73KHz.pdf
PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
EPF6010AFC256-3 Image

EPF6010AFC256-3

Intel
98D-EPF6010AFC256-3

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB