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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~EPF10K70RC240-4N~~

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EPF10K70RC240-4N - Intel

Name: Intel EPF10K70RC240-4N
Brand: Intel
SKU: EPF10K70RC240-4N
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: EPF10K70RC240-4N

Manufacturer: Intel

Allelco Part Number: 32D-EPF10K70RC240-4N

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,270 pcs available, New & Original

Parts Description: IC FPGA 189 I/O 240RQFP

Package: 240-RQFP (32x32)

Data sheet: EPF10K70RC240-4.pdf

Datasheets
FLEX 10K.pdf

PCN Packaging
All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf

PCN Obsolescence/ EOL
EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf

PCN Design/Specification
Laser Mark 17/Feb/2016.pdf Mult Series Software Chgs 26/Mar/2020.pdf

PCN Other
Software Disc 06/Nov/2020.pdf

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In stock: 4270

Specifications

EPF10K70RC240-4N Tech Specifications
Intel - EPF10K70RC240-4N technical specifications, attributes, parameters and parts with similar specifications to Intel - EPF10K70RC240-4N

Product Attribute	Attribute Value
Manufacturer	Intel
Voltage - Supply	4.75V ~ 5.25V
Total RAM Bits	18432
Supplier Device Package	240-RQFP (32x32)
Series	FLEX-10K®
Package / Case	240-BFQFP Exposed Pad
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 70°C (TA)
Number of Logic Elements/Cells	3744
Number of LABs/CLBs	468
Number of I/O	189
Number of Gates	118000
Mounting Type	Surface Mount
Base Product Number	EPF10K70

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A001A2A
HTSUS	8542.39.0001

Parts Introduction

EPF10K70RC240-4N (1)

Manufacturer Part Number

EPF10K70RC240-4N

Manufacturer

Intel

Introduction

The EPF10K70RC240-4N is part of the FLEX-10K® series of Embedded FPGAs (Field Programmable Gate Array) designed by Intel for high-performance programmable logic solutions.

Product Features and Performance

Embedded FPGA with 3744 logic elements/cells and 468 LABs/CLBs

Offers a total of 18432 RAM bits for data storage

Features a high number of I/O with 189 pins

Provides a substantial gate count of 118000 for complex designs

Product Advantages

High-density integration suited for advanced programmable logic

Robust temperature range (0°C ~ 70°C) ensuring operational stability

Surface mount technology for solid board level attachment

Key Technical Parameters

Voltage Supply: 4.75V ~ 5.25V

Operating Temperature: 0°C ~ 70°C

Package: 240-BFQFP Exposed Pad

118000 gates, 3744 logic elements/cells, 468 LABs/CLBs

Quality and Safety Features

Manufactured by Intel, ensuring high standards of quality and reliability

Robust packaging (240-BFQFP Exposed Pad) designed for enhanced thermal and mechanical performance

Compatibility

Compatible with various design software and hardware tools for FPGA programming and simulation

Application Areas

Telecommunications, automotive, industrial control, and consumer electronics industries

Product Lifecycle

Classified as Obsolete

Potential limited availability, recommend verifying alternatives or upgrade paths due to discontinuation

Several Key Reasons to Choose This Product

High logic and RAM capacity ideal for complex programmable solutions

Supported by Intel's reputation for reliability in semiconductor manufacturing

Broad operational temperature suitable for varied environmental conditions

Strong community and resource support for development and troubleshooting

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the EPF10K70RC240-4N FPGA for a mid-complexity digital logic design compared to using discrete components?: The EPF10K70RC240-4N offers 3,744 logic elements and 18,432 RAM bits in a single integrated package, which reduces board space and simplifies routing compared to discrete solutions. However, its 468 LABs limit scalability beyond approximately 120,000 gates, making it suitable only for designs under this threshold. Discrete logic may offer more granular control but increases BOM count, power consumption, and layout complexity. For designs requiring deterministic timing and high I/O density, the FPGA provides superior integration, though at the cost of reprogrammability limitations once configured.

How does the operating temperature range of the EPF10K70RC240-4N impact system-level reliability in industrial applications, and what design considerations arise from its 0°C to 70°C specification?: The commercial-grade temperature range (0°C to 70°C) of the EPF10K70RC240-4N restricts use in harsh environments without thermal management. While adequate for controlled indoor systems, designs in automotive or outdoor settings require derating and external cooling. Thermal resistance data is not provided, so PCB copper area and airflow must be evaluated. In contrast, industrial-grade FPGAs support up to 85°C or higher, enabling broader deployment. This limitation implies that system enclosures should include temperature monitoring if ambient conditions near the upper bound.

Can the EPF10K70RC240-4N be used as a replacement for older EPF10K30 devices in legacy systems, considering pin compatibility and timing constraints?: The EPF10K70RC240-4N shares the same 240-pin RQFP package as earlier models like the EPF10K30, allowing physical placement compatibility. However, the EPF10K70 has significantly higher gate count (118,000 vs. ~70,000) and faster speed grade (-4), which can affect signal integrity and clock distribution. Designs must revalidate timing closure due to increased routing delays and potential skew across the larger die. Power supply decoupling and termination strategies should be reviewed to maintain signal integrity at higher frequencies.

What are the implications of the EPF10K70RC240-4N’s 189 I/O pins on PCB layer count and routing congestion in a high-density application?: With 189 bidirectional I/Os operating at standard TTL/CMOS levels, the EPF10K70RC240-4N demands careful signal integrity planning. Routing all I/Os through surface-mount pads on a 32x32 mm footprint may necessitate at least four layers to manage crosstalk and impedance. Differential pairs or high-speed signals require controlled impedance traces, increasing PCB cost. Designers must allocate sufficient escape routing channels and consider test point access, especially given the exposed pad underside mounting requirement.

How does the total RAM bit capacity of the EPF10K70RC240-4N influence block memory implementation in state machine designs?: The 18,432-bit internal RAM allows direct implementation of small-to-medium lookup tables (LUTs) or shift registers without external SRAM. For example, a 512 x 36-bit FIFO would consume 1,843 bits, leaving ample margin for other logic. This embedded storage reduces latency and pin usage compared to off-chip memory interfaces. However, distributed memory architecture means no dedicated BRAM blocks—designers must use LUTs efficiently to avoid resource contention with combinatorial logic.

Is it feasible to cascade multiple EPF10K70RC240-4N devices in parallel to achieve higher logic density, and what challenges would this introduce?: Parallel operation of multiple EPF10K70RC240-4N units is technically possible but introduces significant synchronization overhead and routing complexity. Each device requires independent configuration and separate clock domains unless tightly synchronized, increasing jitter risk. Shared buses become bottlenecks, and timing closure across boundaries demands precise alignment. Given the moderate gate count per device, scaling via replication is inefficient compared to choosing a larger FPGA family. Inter-device communication latency typically exceeds that of internal routing by an order of magnitude.

How does the Moisture Sensitivity Level (MSL) of 3 for the EPF10K70RC240-4N affect manufacturing handling and shelf-life management?: Classified as MSL 3 (168-hour floor life at 30°C/60% RH), the EPF10K70RC240-4N must be stored in dry packaging after desiccant exposure. After opening, assembly within 168 hours prevents popcorning during reflow. Manufacturers must track lot codes and use humidity indicator cards. Extended exposure beyond this window risks delamination, especially critical given the exposed pad underside. Proper handling procedures align with JEDEC J-STD-020 standards and ensure yield stability in volume production.

What role does the -4 speed grade play in timing analysis for the EPF10K70RC240-4N, and how should it be interpreted during synthesis optimization?: The -4 speed grade indicates the maximum achievable frequency under typical process-voltage-temperature (PVT) conditions. For the EPF10K70, this translates to roughly 80–100 MHz for most combinational paths, depending on routing congestion and logic depth. Synthesis tools assign timing constraints based on this grade; exceeding it leads to setup violations. Designers should apply appropriate clock uncertainty margins and prioritize pipelining in critical paths. Static timing analysis must account for worst-case PVT corners even if nominal performance meets requirements.

Can the EPF10K70RC240-4N interface directly with DDR memory modules, and what IP blocks or external controllers are required?: No, the EPF10K70RC240-4N lacks native DDR memory controllers. Implementing DDR requires external PHY chips or soft-core IP such as Altera’s (now Intel) NIOS-based solutions. Alternatively, designers can use simple SRAM buffers for lower bandwidth needs. Direct connection to DDR SDRAM demands precise timing calibration, DLLs, and address mapping expertise—tasks better suited to dedicated memory controllers than general-purpose FPGAs at this complexity level.

What is the impact of the 4.75V to 5.25V supply voltage on power delivery and decoupling network design for the EPF10K70RC240-4N?: Operating at nominal 5V (±5%) necessitates stable power rails with low noise and ripple. The EPF10K70 draws dynamic current spikes during configuration and switching, requiring bulk capacitance near VCC and local bypass capacitors. Decoupling networks must suppress high-frequency transients, typically using 0.1 µF ceramic caps per power pin plus larger bulk capacitors (e.g., 10 µF tantalum). Voltage regulators must maintain regulation under load transients, and PCB layout should minimize inductance between caps and package pins.

How does the number of LABs (468) in the EPF10K70RC240-4N affect logic partitioning and resource utilization efficiency in complex state machines?: Each LAB contains four LEs, so the 468 LAB structure enables modular design organization. Efficient use requires balancing LAB loads to avoid underutilization—empty LABs waste area while overloaded ones cause routing congestion. State machines with wide outputs benefit from shared LAB resources, but feedback loops must stay within LAB boundaries to preserve timing predictability. Floorplanning in Quartus helps group related functions, reducing inter-LAB delay and improving max frequency.

Are there known issues with JTAG chain reliability when programming multiple EPF10K70RC240-4N devices in series?: Cascading JTAG chains across multiple EPF10K70RC240-4N devices is supported, but each additional device adds propagation delay and potential signal degradation. Chain integrity depends on trace length matching (<5 cm recommended), proper pull-up resistors, and clean power to TCK/TDI/TDO pins. Long chains (>3–4 devices) may require repeaters or buffered JTAG signals. Programming failures often stem from marginal timing rather than device faults—always verify chain health with boundary scan tests before full configuration.

How should designers evaluate whether the EPF10K70RC240-4N meets their power budget in battery-powered or thermally constrained applications?: The EPF10K70RC240-4N’s static power is modest (~50–100 mW), but dynamic power scales with switching activity. At 50 MHz, active power could reach 200–300 mW depending on logic utilization. Thermal modeling using package thermal resistance (θJA ≈ 35°C/W estimated) shows junction temperatures rising significantly in sealed enclosures. In low-power scenarios, designers should minimize unused logic, disable clocks where possible, and consider sleep modes. Alternatives like CPLDs may offer better power-per-function ratios for simpler tasks.

What documentation is essential for successful implementation of the EPF10K70RC240-4N, and how do Intel’s legacy tools affect development workflow?: Critical documents include the FLEX 10K handbook, Quartus Prime Pro edition software, device datasheet, and configuration guide. Legacy support tools (e.g., MAX+PLUS II) are deprecated, so modern Quartus versions are mandatory for synthesis and place-and-route. Without updated toolchains, developers face limited bug fixes and missing features. Additionally, third-party IP compatibility must be verified, as some cores assume newer architectures. Migration from older toolflows requires HDL code adaptation and constraint file updates.

How does the ECCN classification (3A001A2A) of the EPF10K70RC240-4N affect export compliance for international projects?: Classified under ECCN 3A001A2A, the EPF10K70RC240-4N falls under U.S. Export Administration Regulations (EAR) for active electronic components. Exporting to embargoed countries requires licenses, and end-use restrictions apply to military or surveillance applications. Importers may need import permits under local regimes (e.g., EU Dual-Use Regulation). Compliance teams must maintain records and screen customers, particularly in defense or aerospace sectors where end-user verification is critical.

What are the long-term availability risks associated with the EPF10K70RC240-4N, and how do Intel’s lifecycle policies affect future design continuity?: As part of Intel’s legacy FPGA portfolio, the EPF10K70RC240-4N is likely in the maturity or end-of-life phase. Intel may discontinue production without migration notice, affecting supply continuity. Designers should monitor Intel’s Product Longevity Program and consider migrating to newer families like Cyclone or Arria for long-term viability. If continuation is necessary, stockpiling or dual-sourcing strategies are advisable, though no official long-term commitment exists for pre-Cyclone devices.

How does the package type (240-BFQFP with exposed pad) influence thermal dissipation and mechanical stress during soldering?: The 240-ball fine-pitch QFP with exposed die attach pad enhances heat sinking, improving thermal conductivity by 20–30% compared to non-exposed packages. However, the underside pad must be connected to a solid ground plane and properly soldered to function as a heat spreader. Reflow profiles must ensure uniform wetting across all balls, including underfill under the pad to prevent cracking from CTE mismatch. Mechanical rigidity supports automated assembly but demands precise pick-and-place alignment due to small ball pitch (~0.8 mm).

What are the advantages of using the EPF10K70RC240-4N over microcontrollers for glue logic applications in embedded systems?: The EPF10K70RC240-4N excels in applications requiring parallel processing, custom timing generation, or protocol bridging without CPU overhead. Unlike microcontrollers, it handles multiple asynchronous interfaces simultaneously with deterministic latency. For example, implementing UARTs, SPI masters, and PWM generators in parallel avoids context-switching delays. However, microcontrollers offer richer peripherals (ADC, CAN, USB) and lower unit cost for simple control tasks. Choice hinges on complexity versus integration trade-offs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Intel EPF10K70RC240-4N

Product Attribute
Part Number	EPF10K70RC240-3N	EPF10K70RC240-2N	EPF10K70RC240-4	EPF10K70RC240-3
Manufacturer	Intel	Intel	Intel	Intel
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Number of Logic Elements/Cells	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of I/O	-	-	-	-
Series	-	-	-	-
Total RAM Bits	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of Gates	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Voltage - Supply	-	-	-	-
Number of LABs/CLBs	-	-	-	-

EPF10K70RC240-4N Datasheet PDF

Download EPF10K70RC240-4N pdf datasheets and Intel documentation for EPF10K70RC240-4N - Intel.

Datasheets: FLEX 10K.pdf
PCN Packaging: All Dev Pkg Chg 1/Aug/2018.pdf Mult Dev Dessicant Chg 19/Jul/2019.pdf
PCN Obsolescence/ EOL: EOL 01/Dec/2016.pdf EOL 21/Nov/2016.pdf
PCN Design/Specification: Laser Mark 17/Feb/2016.pdf Mult Series Software Chgs 26/Mar/2020.pdf
PCN Other: Software Disc 06/Nov/2020.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
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Middle East	Israel	6

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